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WO/2024/029602A1 |
The present invention provides: a cured molded product having excellent moldability and reliability, and having high thermal conductivity, low water absorption, low thermal expansion, high heat resistance, and flame retardancy; in additi...
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WO/2024/029233A1 |
The present invention addresses the problem of providing: a prepreg which comprises a resin composition and has excellent elastic modulus and heat resistance and also has excellent appearance including weather resistance and transparency...
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WO/2024/030184A1 |
Provided herein is an expandable epoxy adhesive.
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WO/2024/030183A1 |
Provided herein is an expandable epoxy adhesive.
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WO/2024/029315A1 |
A method for producing a (meth)acrylic resin having an ethylenically unsaturated group comprising a step (i) that reversible addition-fragmentation chain transfer (RAFT) polymerizes a raw material monomer group (M) containing a hydroxy g...
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WO/2024/029496A1 |
This curable resin composition contains a polyorganosiloxane compound that has an alicyclic epoxy group and an epoxy compound that has a plurality of glycidyl epoxy groups. The polyorganosiloxane compound is a condensate of a silane comp...
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WO/2024/027960A1 |
The present invention relates to epoxy resin compositions comprising a resin component containing at least one epoxy liquid resin, a hardener component containing at least one amine hardener, and at least one bio-based granular material ...
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WO/2024/024918A1 |
A polymerizable composition containing: an episulfide compound represented by formula (1); a polyiso(thio)cyanate compound; a polythiol compound; an epoxy compound (X) containing one or more epoxy groups and no episulfide groups per mole...
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WO/2024/024525A1 |
Provided are an epoxy resin composition exhibiting excellent low-dielectric properties, an epoxy resin giving the epoxy resin composition, and a method for producing the epoxy resin. The epoxy resin is characterized by comprising an epox...
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WO/2024/024881A1 |
In cases where a component having a low molecular weight is added to conventional epoxy resin compositions for the purpose of improving the workability thereof, the component having a low molecular weight is likely to volatilize and it i...
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WO/2024/024442A1 |
The present invention provides a resin composition which contains an alicyclic epoxy resin, a basic catalyst, a phenolic hydroxyl group-containing compound and a dye.
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WO/2024/022901A1 |
The invention relates to a process for producing an epoxy resin composition for preimpregnating materials, wherein an epoxy resin that has been provided is heated to a temperature in the range of 60°C to 100°C and is mixed with a harde...
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WO/2024/024331A1 |
The present invention provides a resin composition which is in a liquid state at 25°C and contains (A) an epoxy resin and (B) methacrylic acid anhydride, wherein the epoxy resin (A) contains (A-1) an epoxy resin that is in a liquid stat...
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WO/2024/023531A1 |
The invention relates to a class of amido-amines useful as curatives and having a high degree of biological based carbon content. In particular, the invention is directed to compounds comprising at least one amide group and at least one ...
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WO/2024/024396A1 |
One aspect of the present invention relates to an elastic resin composition which contains a polyrotaxane (A), an epoxy resin (B) and a crosslinking agent (C). The crosslinking agent (C) contains an isocyanate compound which has two or m...
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WO/2024/024490A1 |
A composition for forming a resist underlayer film, the composition containing a polymer having an alicyclic structure in locations other than terminals, and a solvent.
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WO/2024/018943A1 |
The present invention pertains to an epoxy resin composition comprising (A) an epoxy resin containing at least two epoxy groups in one molecule, (B) a polyorganosiloxane compound represented by general formula (1), and (C) an epoxy resin...
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WO/2024/018387A1 |
The present disclosure provides a curable lightweight potting adhesive composition precursor, comprising a first part (A) comprising (i) at least one first epoxy curing agent; (ii) at least one first curing aid comprising at least one am...
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WO/2024/017661A1 |
Subject of the invention is a chemical anchor system which comprises a component (A) comprising an epoxide bearing two or more epoxy groups and having an epoxy equivalent, and a component (B) comprising ≥ 5 wt.% of a tertiary amine, ba...
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WO/2024/018984A1 |
Provided is a copolymer having excellent curability, production stability and storage stability and capable of imparting excellent solvent resistance to a cured article. The copolymer comprises a constituent unit (A) derived from a com...
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WO/2024/017652A1 |
The present invention relates to a multi-component composition for securement uses, having an epoxy resin component (A) and a hardener component (B), where the epoxy resin component (A) and the hardener component (B) are used non-stoichi...
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WO/2024/017659A1 |
The invention relates to the use of tertiary amines in an epoxy resin compound to improve the creep behaviour of a chemical dowel produced from the epoxy resin compound.
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WO/2024/014435A1 |
Provided is a curable resin composition that contains (A) a rubber component, (B) a crosslinking component that has an epoxy group, (C) an ester-based curing agent, and (D) a filler.
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WO/2024/011502A1 |
Protection coating composition is provided, comprising: a) at least one resin selected from a group consisting of polyurethane resin (A) and polyurethane-acrylic resin (B), b) a solvent, and c) a bi-functional epoxy resin precursor (C) r...
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WO/2024/015165A1 |
Provided herein is a two-component, thermally-conductive acrylic-epoxy adhesive composition.
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WO/2024/014432A1 |
This curable resin composition contains (A) a rubber component, (B) an epoxy-group-containing cross-linking component, (C) an ester-based curing agent, and (D) a curing accelerator.
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WO/2024/009612A1 |
The present invention addresses the problem of providing a curable resin that can provide a cured product having superior adhesion and thermal shock resistance, as well as a method for manufacturing an intermediate with which said curabl...
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WO/2024/010980A2 |
A solid, storage-stable, epoxy resin composition comprising the reaction product of a solid carboxylated nitrile rubber (XNBR) and an epoxy functional resin, wherein the carboxylic acid content of the carboxylated nitrile rubber is less ...
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WO/2024/010059A1 |
A purpose of the present invention is to provide a curable resin composition which enables the achievement of a cured product that exhibits excellent heat resistance and low outgas properties, while having a low dielectric constant. Anot...
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WO/2024/008671A1 |
The present invention relates to a thermoset crosslinked epoxide resin composition obtainable by a method that comprises mixing an epoxide-functionalised resin with a cross-linking agent and a catalyst; and curing the mixture thus obtain...
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WO/2024/005037A1 |
This display device (10) comprises: a substrate (1); an optical element (2) mounted on one surface in the thickness direction of the substrate (1); a second sealing layer (6) for sealing the optical element (2); a second inorganic layer ...
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WO/2024/004438A1 |
The present invention provides a cationic electrodeposition coating material which, in an electrodeposition coating step, does not require high-temperature bake drying that emits CO2, which produces almost no volatile components during c...
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WO/2024/003053A1 |
A method of bonding substrates that are underwater comprising applying, underwater, a cyanoacrylate composition to at least one substrate and allowing the composition to cure underwater.
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WO/2024/003104A1 |
An example nanoimprint lithography (NIL) resin composition includes a total of three monomers, wherein two of the three monomers are selected from the group consisting of two different epoxy substituted silsesquioxane monomers; two diffe...
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WO/2024/002117A1 |
Disclosed are an antibacterial fluorine-modified epoxy vinyl ester resin, a method for preparing same, and a multi-mechanism synergistic universal anti-corrosion coating. The antibacterial fluorine-modified epoxy vinyl ester resin of the...
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WO/2024/005149A1 |
Provided according to the present disclosure is a conductive resin composition that suppresses generation of outgas. The present disclosure relates to a conductive resin composition containing the following components (A)-(D). Component ...
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WO/2024/003434A1 |
The present invention relates to a method for manufacturing a polymer material, said method comprising mixing an epoxy monomer with a compound that comprises maleimide groups, adding a reversible or irreversible amine hardener, adding a ...
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WO/2024/006470A1 |
The present disclosure relates generally to materials and methods for providing expanded foam materials. In one aspect, the present disclosure provides an expandable foam formulation, the expandable foam formulation being expandable to p...
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WO/2024/006101A2 |
The present invention relates to curable epoxy resin compositions comprising an alkyl-substituted aromatic epoxy resin and a bis alicyclic amine hardener, which when cured exhibit preferred chemical and physical characteristics. The pres...
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WO/2024/006422A1 |
A composition for making a filler including a plurality of ceramic particles, an oxirane monomer in liquid form, an ultraviolet initiator that absorbs ultraviolet, and a thermal initiator.
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WO/2023/249099A1 |
The problem addressed is to provide a curable resin composition that satisfies (i) and (i): a cured product having, at low temperature, (i) low viscosity and (ii) excellent adhesive strength by a short cure time can be provided. Provided...
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WO/2023/248488A1 |
The present invention provides: a method for producing a (meth)acrylate resin having excellent alkali developability and high optical sensitivity and ensuring not only excellent heat resistance but also excellent base material adhesivene...
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WO/2023/249123A1 |
This heat-curable composition according to the present disclosure comprises: a first component including a siloxane having an epoxy group, and a second component including at least one of: a phenol having a structure in which a ring-open...
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WO/2023/247445A1 |
The invention relates to a solution comprising 5 to 65 wt.% polyphenols which are solid at room temperature and 35 to 95 wt.% amines of formula (I). The solution according to the invention is preferably used for preparing a curing agent ...
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WO/2023/247278A1 |
The present invention relates to a process for preparing an epoxy-group-terminated impact modifier, in which process one or more polyisocyanates (a) are mixed with two or more polyols (b), containing at least one polyether polyol (b1) an...
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WO/2023/248380A1 |
This heat conductive resin composition includes: epoxy resin particles that have a mesogenic skeleton; a curing agent; a heat conductive inorganic filler; and a polymer that has a molecular weight of 10,000 or more, wherein the average p...
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WO/2023/248661A1 |
The present invention provides a photosensitive composition which is capable of suppressing decoloring of a sensitizing dye during the storage in an unexposed state. A photosensitive composition according to the present invention conta...
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WO/2023/247438A1 |
The present invention concerns a method for producing a curing agent for a waterborne epoxy coating formulation, said method comprising a step of carbonating a waterborne dispersion of a water insoluble curing agent comprising amine and/...
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WO/2023/242220A1 |
In particular, the present invention relates to the use of an epoxy-silicone copolymer, i.e. a polyorganosiloxane provided with branches comprising epoxide functional groups, for the manufacture of an anti-graffiti surface coating of a b...
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WO/2023/242041A1 |
The invention relates to a method to prepare a composition comprising an epoxy-based covalent adaptable network. The method comprises the steps of a) contacting a compound A and a compound B in controlled amounts to obtain a mixture comp...
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