Title:
CURABLE RESIN COMPOSITION, CURABLE FILM, AND LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2024/014435
Kind Code:
A1
Abstract:
Provided is a curable resin composition that contains (A) a rubber component, (B) a crosslinking component that has an epoxy group, (C) an ester-based curing agent, and (D) a filler.
Inventors:
OHKODA YOHEI (JP)
MASAKI TAKESHI (JP)
KAWAMORI TAKASHI (JP)
MASAKI TAKESHI (JP)
KAWAMORI TAKASHI (JP)
Application Number:
PCT/JP2023/025487
Publication Date:
January 18, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B32B15/08; C08G59/40; C08K3/00; C08K5/10; C08K9/04; C08L21/00; C08L63/00; H05K1/03
Domestic Patent References:
| WO2020136902A1 | 2020-07-02 | |||
| WO2019216352A1 | 2019-11-14 | |||
| WO2019216425A1 | 2019-11-14 |
Foreign References:
| JP2020015859A | 2020-01-30 | |||
| JP2021027099A | 2021-02-22 | |||
| JP2018150543A | 2018-09-27 | |||
| JP2019123799A | 2019-07-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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