HIGH DIELECTRIC COMPOUND AND PREPARATION METHOD THEREFOR, EPOXY HIGH DIELECTRIC MATERIAL AND PREPARATION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2023/065489

A1

Provided are a high dielectric compound and a preparation method therefor, an epoxy high dielectric material and a preparation method therefor, and a semiconductor device. The high dielectric compound is represented by chemical formula (I), R being one of (a), (b), and (c). Also provided are an epoxy high dielectric material and a preparation method therefor, the high dielectric compound being used as a photocrosslinking agent. The high dielectric compound is a functional molecule modified by bis(vinylsulfonyl)methane having a high dipole moment group, which can increase the dielectric coefficient and also allow the epoxy high dielectric material to have a photo-controllable self-healing ability, thereby prolonging the service life of the material. The obtained epoxy high dielectric material has a high capacitance due to the high dielectric coefficient thereof. Furthermore, leakage current can be significantly improved without changing electrical thickness.

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LIU JIE (CN)
LI QIANQIAN (CN)
YU SHUHUI (CN)
SUN RONG (CN)

PCT/CN2021/137309

April 27, 2023

December 12, 2021

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SHENZHEN INST OF ADV TECH CAS (CN)

C07C317/28; C07C315/04; C08G59/22; C08G59/24; C08G59/50; C08J3/28; C08L63/00; C09D163/00; H01L29/51

WO2015111982A1

2015-07-30

CN108484533A	2018-09-04
CN106280275A	2017-01-04
JP2009073987A	2009-04-09

BEIJING ZHONG XUN TONG DA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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