Title:
SINGLE-COMPONENT CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/095701
Kind Code:
A1
Abstract:
A single-component curable composition containing (A) an epoxy resin, (B) a solid rubber, (C) a latent curing agent, (D) a filler, and (E) a foaming agent, wherein (A) contains (A1) an unmodified bisphenol epoxy resin, the single-component composition contains 10 to 100 mass parts of (B) per 100 mass parts of (A), and (B) contains (B1) a styrene-butadiene-divinylbenzene copolymer.
Inventors:
MURATA TAKAHIRO (JP)
UNO ATSUSHI (JP)
UNO ATSUSHI (JP)
Application Number:
PCT/JP2023/036591
Publication Date:
May 10, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
SUNSTAR ENG INC (JP)
International Classes:
C08G59/06; C08G59/24; C09D7/61; C09D7/63; C09D109/02; C09D125/10; C09D163/02
Attorney, Agent or Firm:
YAMAO, Norihito et al. (Osaka Umeda Twin Towers North 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, JP)
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