Title:
RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/089905
Kind Code:
A1
Abstract:
The object of the present invention is to provide a resin composition and an adhesive that cure under a low temperature condition, provide a cured product with an excellent stress relaxation property, and have a low self-exothermic temperature during a curing reaction. The present invention provides a resin composition comprising (A) a polyfunctional epoxy compound, (B) a polyfunctional thiol compound, (C) a monofunctional compound having one group (c) containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule, and (D) a curing catalyst.
Inventors:
MEGURO KENTO (JP)
SAITO ATSUSHI (JP)
SAITO ATSUSHI (JP)
Application Number:
PCT/JP2022/047359
Publication Date:
May 02, 2024
Filing Date:
December 22, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G59/06; C08G59/68; C08G75/045; H01L23/29
Domestic Patent References:
| WO2022210261A1 | 2022-10-06 | |||
| WO2009028271A1 | 2009-03-05 |
Foreign References:
| KR102271763B1 | 2021-07-01 | |||
| KR20150034488A | 2015-04-03 | |||
| JP2021075698A | 2021-05-20 | |||
| US20190185657A1 | 2019-06-20 | |||
| US9606265B2 | 2017-03-28 | |||
| JPH06211969A | 1994-08-02 | |||
| JPH06211970A | 1994-08-02 | |||
| JP2019156965A | 2019-09-19 | |||
| JP2012153794A | 2012-08-16 | |||
| JP2022173402A | 2022-11-18 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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