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WO/2024/095928A1 |
The present invention provides an epoxy compound product which has a low viscosity and is not susceptible to curing shrinkage, while being capable of forming a cured product that exhibits excellent heat resistance and excellent transpare...
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WO/2024/092601A1 |
The present invention relates to a two-component epoxy resin composition, consisting of - a first component K1 comprising at least one epoxy resin A that contains on average more than one epoxy group per molecule; and - a second componen...
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WO/2024/095186A1 |
The present invention provides a single-component structural adhesive, the single-component structural adhesive including: 50 weight percent to 60 weight percent of an epoxy resin having an epoxy equivalent weight of less than 190 grams ...
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WO/2024/095203A1 |
Provided in the present invention is a one-component structural adhesive including: 47 to 61 weight percent of a first epoxy resin, the first epoxy resin having an epoxide equivalent weight of less than 240 grams per equivalent; 27 to 41...
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WO/2024/095904A1 |
This adhesive for an optical image formation device is for bonding two resin substrates of an optical image formation device in which two resin substrates each have a relief surface, each have a light-reflection section on a portion of t...
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WO/2024/094600A1 |
The invention relates to the use of an epoxy resin adhesive for bonding a membrane made of soft PVC to a further substrate, wherein the curing-agent component of the adhesive comprises at least one amine A1 having at least one dimethylam...
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WO/2024/090291A1 |
Provided are an adhesive composition that has excellent adhesion and solder heat resistance, exerts excellent adhesion even after being exposed to high temperatures for a long period of time, and has good circuit embeddability while supp...
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WO/2024/090259A1 |
The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive. Provided is a resin c...
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WO/2024/090129A1 |
Provided are a connection material with which it is possible to obtain excellent connection reliability and repairability, a connection structure, and a method for producing a connection structure. The connection material contains an ion...
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WO/2024/089087A1 |
A hydrazide with a melting point of at least 65°C is used as a curing agent for the heat-curing in a heat-curable polyurethane composition that comprises a prepolymer with isocyanate end groups, obtained from at least one polyisocyanate...
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WO/2024/078879A1 |
The present invention is directed to a two-component (2K) curable composition comprising: a first component comprising: a) at least one epoxy resin; and, a second component comprising: b) a mixture of polyamines of which each polyamine h...
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WO/2024/080336A1 |
Provided is a curable composition for inkjet use and for air cavity formation. The curable composition can form a cured product layer having a high aspect ratio, and can suppress the generation of outgassing even if exposed to high tempe...
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WO/2024/075602A1 |
The present invention provides a low-temperature-curable epoxy resin composition that achieves both excellent adhesive strength and ink resistance. Provided is an epoxy resin composition that includes components (A)–(C), the epoxy resi...
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WO/2024/076408A1 |
Provided herein is a novel monomer for making polymers, in particular adhesives, and adhesives made with said novel monomer.
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WO/2024/076409A1 |
Provided herein is a monomer for making polymers, in particular adhesives, and adhesives made with said monomer.
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WO/2024/066601A1 |
A preparation method for an aircraft cargo hold floor, and an aircraft cargo hold floor. The preparation method comprises the following preparation steps: separately preparing phenolic resin upper panel layers (4), phenolic resin lower p...
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WO/2024/066254A1 |
Disclosed are a low-modulus die attach film adhesive for a vertically stacked package, a preparation method therefor and an application thereof. The die attach film adhesive comprises the following raw materials: 2-5 parts by mass of sil...
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WO/2024/068274A1 |
The invention relates to a curable adhesive comprising: a) one or more (co)polymers, b) one or more polymerizable epoxide compounds, c) one or more cationic initiators, and d) one or more pH colour indicators with at least one pH-depende...
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WO/2024/062904A1 |
The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device. That is, provided is a r...
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WO/2024/055959A1 |
Provided in embodiments of the present application is a resin composition, the resin composition comprising epoxy resin, a curing agent and an inorganic filler, wherein the cut-off particle size of the inorganic filler is 3 μm, and the ...
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WO/2024/050892A1 |
A resin composition and an adhesive. The resin composition is composed of the following components: benzoxazine, which is a synthetic product of a primary amine-terminated flexible polyimide oligomer, an aldehyde compound and a monofunct...
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WO/2024/052060A1 |
The present disclosure is directed to a curable and electrochemically disbondable one component (1K) adhesive composition comprising: a) at least one epoxide compound; b) a curing agent consisting of one or more compounds which have at l...
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WO/2024/053614A1 |
The present disclosure provides an adhesive sheet which is used to attach a first member and a second member together, and in which the tensile elastic modulus of the first member is smaller than the tensile elastic modulus of the second...
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WO/2024/053232A1 |
This laminated film comprises in the order given: an adhesive layer containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having two carboxyl groups; a pressure-sensitive adhesive layer; and a base ...
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WO/2024/050710A1 |
Disclosed in the present invention are an insulating adhesive film material for preparing a fine circuit and a preparation method therefor. Specifically, the insulating adhesive film material is composed of a polymer compound, which is c...
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WO/2024/048088A1 |
Provided are an anisotropic conductive film, a connection structure, and a method for producing a connection structure, that, in the case of high-pressure mounting, suppress increases in the continuity resistance value, avoid the generat...
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WO/2024/048444A1 |
A coating agent which comprises an acid-modified polyolefin resin (A), an epoxy compound (B), and an aqueous medium, and is characterized in that the acid-modified polyolefin resin (A) contains 0.1-10 mass% unsaturated carboxylic acid co...
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WO/2024/046824A1 |
The present application is directed to dual curing composition which is both heat- and photo-curable, said composition comprising, based on the weight of the composition: from 20 to 90 wt.% of a) at least one epoxy methacrylate compound ...
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WO/2024/048592A1 |
The purpose of the present invention is to provide a blocked urethane which can improve epoxy toughness, exhibits excellent storage stability, and serves as a raw material for a high-quality adhesive. This problem can be solved by a bl...
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WO/2024/042878A1 |
A connected body of metal materials having an overlapping portion where an end A of a metal material A and an end B of a metal material B are overlapped via a film composed mainly of a thermoplastic resin, wherein the film is one that ha...
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WO/2024/044505A1 |
An adhesive material includes a polymeric-based adhesive composition and a bio-based reactive diluent, wherein the bio-based reactive diluent includes a hydrocarbon ring structure having at least one pendant epoxy end group or a hydrocar...
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WO/2024/043288A1 |
The present invention relates to an adhesive composition which contains a multifunctional epoxy resin, a monofunctional epoxy compound and a thermoplastic resin, wherein: the content ratio of the monofunctional epoxy compound with respec...
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WO/2024/038816A1 |
[Problem] The purpose of the present invention is to provide an epoxy-based adhesive which exhibits good toughness and heat resistance, while having excellent adhesion to a base material. [Solution] An adhesive composition which contains...
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WO/2024/038859A1 |
The present invention addresses the problem of providing an adhesive resin composition usable without solvents, said adhesive resin composition having high flexibility, impact resistance and adhesive strength, showing little difference i...
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WO/2024/038048A1 |
The invention relates to a curable one-component adhesive composition comprising (a) liquid epoxy resin; (b) latent epoxy curing agent; (c) silica; and (d) metal oxide; wherein the weight content of the liquid epoxy resin is at least 20 ...
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WO/2024/034464A1 |
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer containing conductive particles and a thermoplastic resin; and a second adhesive layer provided on the firs...
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WO/2024/030184A1 |
Provided herein is an expandable epoxy adhesive.
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WO/2024/029541A1 |
The present disclosure provides a means which is capable of suppressing the connection resistance to a low level in cases where base metals, or a base metal and another material are electrically connected to each other with use of a cond...
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WO/2024/030183A1 |
Provided herein is an expandable epoxy adhesive.
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WO/2024/029315A1 |
A method for producing a (meth)acrylic resin having an ethylenically unsaturated group comprising a step (i) that reversible addition-fragmentation chain transfer (RAFT) polymerizes a raw material monomer group (M) containing a hydroxy g...
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WO/2024/026949A1 |
A double release sheet, which is used for being combined with a functional layer having a transparent conductive layer to form a display assembly. In comparison with electrophoretic display devices in the prior art, a PET part is removed...
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WO/2024/024835A1 |
An adhesive resin composition-coated electromagnetic steel sheet comprising: a steel sheet; and an adhesive resin composition film on at least one surface of the steel sheet, wherein the adhesive resin composition film is a semi-cured pr...
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WO/2024/024424A1 |
A connected body of metal materials obtained by matching a cross-section A of a flat metal material A and a cross-section B of a flat metal material B, covering at least part of the opposing portion, which is a region spanning both the e...
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WO/2024/024834A1 |
An adhesive resin composition-coated electromagnetic steel sheet comprising a steel sheet and an adhesive resin composition coating film provided to at least one surface of the steel sheet, wherein the adhesive resin composition coating ...
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WO/2024/018388A1 |
The present disclosure provides a curable adhesive composition precursor, comprising a first part (A) comprising (i) at least one first epoxy curing agent; (ii) at least one first curing aid comprising at least one ammonium salt; a secon...
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WO/2024/018943A1 |
The present invention pertains to an epoxy resin composition comprising (A) an epoxy resin containing at least two epoxy groups in one molecule, (B) a polyorganosiloxane compound represented by general formula (1), and (C) an epoxy resin...
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WO/2024/018145A1 |
The invention relates to a method for assembling an optical device compatible with terahertz radiation, the method comprising the following steps: providing first and second silicon elements, each having a planar face; depositing, on the...
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WO/2024/018243A1 |
Method for end-sealing of hollow membrane filter fibers. During the method one end of the hollow filter fibers is immersed in a low-viscosity hardening sealing material. After the sealing material solidifies, filter fibers with end seals...
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WO/2024/012932A1 |
The invention relates to a polyepoxide for use in reactive adhesive compounds, wherein the polyepoxide can be produced by the polymerisation of a monomer composition comprising, based on the mass of the monomer composition: i) one or mor...
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WO/2024/015165A1 |
Provided herein is a two-component, thermally-conductive acrylic-epoxy adhesive composition.
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