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WO/2021/079812A1 |
Provided are: a method for producing a connected structure, the method being capable of bonding electronic components including fine-pitch electrodes; an anisotropic electroconductive bonding film; and a connected structure. An anisotrop...
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WO/2021/080286A1 |
The present invention relates to a semiconductor adhesive composition and a semiconductor adhesive film comprising a cured product thereof, and specifically, to: a semiconductor adhesive composition capable of removing a void formed betw...
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WO/2021/074793A1 |
The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive...
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WO/2021/075367A1 |
The present invention addresses the problem of providing an adhesive composition which has high adhesion between a metal substrate and a non-polar resin substrate such as one made of a liquid crystal polymer, also has solder heat resista...
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WO/2021/068164A1 |
An insulating film material used in printed circuit board (PCB), substrate, carrier board, and the like semiconductor electronic packaging fields, and a preparation method therefor. The insulating film material is characterized in being ...
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WO/2021/068319A1 |
Disclosed are a conductive adhesive for bonding a fuel cell bipolar plate and a preparation method therefor. The raw materials of the conductive adhesive comprise the following components in parts by weight: 100 parts of an epoxy resin, ...
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WO/2021/070606A1 |
An adhesive composition that includes an acid-modified polyolefin (A) satisfying conditions (1) through (3), and that contains one or more selected from the group consisting of an epoxy resin (B1), an isocyanate compound (B2), and a carb...
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WO/2021/065518A1 |
Disclosed is an adhesive for semiconductors which comprises a thermoplastic resin, a thermosetting resin, a hardener having a reactive group, and a flux compound having an acid group. The adhesive for semiconductors, when examined by dif...
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WO/2021/065431A1 |
Provided is an adhesive sheet having an adhesive layer that has a thickness variation of less than 10% and contains an FeCo-type magnetic powder having an average primary particle size of not more than 100 nm and a coercive force Hc of a...
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WO/2021/066480A1 |
The present invention pertains to a coverlay adhesive composition and an FPCB coverlay including same. The coverlay adhesive composition contains an epoxy resin, a rubber resin, a thermoplastic resin, a curing agent, inorganic particles,...
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WO/2021/060275A1 |
Provided is an antireflection structure which has excellent antireflection performance and transparency and is reduced in the formation of wrinkles on the surface thereof. In order to solve the problem, the present invention is an anti...
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WO/2021/058509A1 |
The present invention is directed to an one component (1K) composition comprising: a) at least one epoxy resin; b) at least one internally flexibilized epoxy resin which is characterized by a Shore D hardness, as measured with a duromete...
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WO/2021/059154A1 |
An expandable structural adhesive film for bonding metal parts. The adhesive film comprises at least one first epoxy compound; at least one epoxy curing agent; at least one blowing agent; at least one film-forming agent; and at least one...
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WO/2021/060486A1 |
The present invention addresses the problem of realizing an adhesive agent that exhibits good peeling form, adhesive strength and viscosity. This adhesive agent contains an epoxy resin (A) and, relative to 100 parts by mass of the epoxy ...
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WO/2021/046722A1 |
A high temperature resistant insulating polymer composite, comprising the following components in parts by mass: 3-12 parts of a cyanate resin, 3-20 parts of an epoxy resin, 5-15 parts of an inorganic filler, 0.1-2 parts of an epoxy curi...
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WO/2021/042418A1 |
An insulating dielectric adhesive film and a preparation method therefor, and a multilayer printed circuit board comprising the insulating dielectric adhesive film. The insulating dielectric adhesive film comprises a release film and an ...
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WO/2021/044915A1 |
A thermally conductive composition including metal-containing particles and a thermosetting component that includes at least one selected from the group consisting of polymers, oligomers, and monomers, the thermally conductive compositio...
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WO/2021/035909A1 |
The present invention relates to a preparation method for a thermally cured organic silicon adhesive, comprising the steps: sequentially adding vinyl-terminated silicon oil and an epoxy resin compound into a mixing kettle to be stirred, ...
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WO/2021/041310A1 |
This invention provides a thin film comprising high percentages of biomass microparticles, and methods to increase biomass percentage in thin film while reducing resin and related additives in thin film plastics.
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WO/2021/040868A1 |
Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a ...
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WO/2021/040867A1 |
Disclosed is an epoxide-functional adduct (E2) and an amine-functional adduct (A3) and coating compositions including these adducts. The epoxide-functional adduct (E2) comprises a reaction product of a reaction mixture comprising (a) an ...
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WO/2021/040865A1 |
Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a ...
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WO/2021/040864A1 |
The present invention is directed to compositions comprising a first component, a second component, and elastomeric particles. The first component comprises an epoxy-containing compound. The second component comprises a diamine comprisin...
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WO/2021/033368A1 |
Provided are an adhesive composition, a film-like adhesive and a production method thereof, and a semiconductor package and a method for manufacturing the same, the adhesive composition being characterized by containing an epoxy resin (A...
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WO/2021/032865A1 |
An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a su...
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WO/2021/029045A1 |
One aspect of the present invention is an adhesive set comprising a first liquid that contains a polymerization initiator, and a second liquid that contains a reducing agent, the first liquid and/or the second liquid also containing a mo...
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WO/2021/024817A1 |
A multiple package-type curable composition comprises: an agent A that contains a polyoxyalkylene polymer (A) having a reactive silicon group represented by general formula (1), a (meth)acrylic acid ester polymer (B) having a reactive si...
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WO/2021/025756A1 |
Disclosed herein is an adhesive composition that includes a resin composition and an epoxy-containing compound. The resin composition includes an epoxidized polysulfide and an epoxidized oil. The epoxidized polysulfide is present in the ...
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WO/2021/024981A1 |
Provided are a laminate and a method for producing the same, the laminate being capable of maintaining the adhesive strength between respective layers high enough under high-temperature hydrothermal treatment conditions. A laminate 300 i...
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WO/2021/024597A1 |
The purpose of the present invention is to provide an adhesive composition which while maintaining the bulk strength of a cured product, has low warpage and excellent adhesion when different materials are bonded to each other. The pres...
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WO/2021/024702A1 |
[Problem] To provide an adhesive composition that has excellent adhesiveness with respect to both metal substrates and various resin substrates such as those made of polyimides, and that also has exceptional solder heat resistance, low d...
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WO/2021/024364A1 |
Provided is an adhesive composition which is low in permittivity and dielectric dissipation factor and is satisfactory in terms of flex resistance and heat resistance. The adhesive composition comprises, per 100 parts by mass of the wh...
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WO/2021/023217A1 |
Disclosed are a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesi...
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WO/2021/020506A1 |
A bonding agent set is provided with: a first liquid containing one or more acrylic monomers having two or more (meth)acryloyl groups and an epoxy resin having two or more epoxy groups; and a second liquid containing a curing agent, said...
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WO/2021/019488A1 |
A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic li...
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WO/2021/019359A1 |
The present invention relates to an adhesive film having a variable adhesive strength, a double coated adhesive tape using the same, and an adhesive composition for preparing the same. The adhesive composition comprises a base polymer; a...
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WO/2021/019741A1 |
Disclosed is an adhesive set comprising a first fluid, which comprises an acrylic monomer having two or more (meth)acryloyl groups and an epoxy resin having two or more epoxy groups, and a second fluid, which comprises a curing agent com...
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WO/2021/016514A1 |
A one-part adhesive including a grafted phenoxy resin, a polymaleimide compound, an organic carbonate, and an optional silane adhesion promoter is described. More particularly, the grafted phenoxy resin includes carboxylic acid and acryl...
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WO/2021/012354A1 |
Provided in the present disclosure are a conductive adhesive and a preparation method therefor. The conductive adhesive comprises a photosensitive small molecule monomer, a photocationic polymeric compound, a photoinitiated cationic curi...
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WO/2021/011125A1 |
An epoxy terminated polyester; an adhesive formulation including the epoxy terminated polyester and a curative composition; a laminating adhesive prepared from the above adhesive formulation; a process of making a laminate; a laminate ma...
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WO/2021/008254A1 |
Disclosed are a composition for glass bonding and laminated glass comprising said composition. The composition comprises a polyhydroxy polymer and a filler, in parts by weight, the polyhydroxy polymer being 50-99.99 parts, and the filler...
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WO/2021/004976A1 |
The invention relates to an adhesive film that can be wound and punched, comprising an epoxy-based adhesive compound that can be activated by UV radiation or thermally and an expandable filler admixed to the adhesive compound to produce ...
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WO/2021/002171A1 |
An adhesive composition containing an organic silicon compound represented by formula (1). [In the formula, R1 is an alkyl group or an aryl group, R2 are an alkyl group or an aryl group.R3 are an alkyl group, an aryl group, an aralkyl gr...
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WO/2021/002248A1 |
Disclosed is an adhesive composition containing an epoxy resin, a curing agent, an elastomer, and a filler, wherein the elastomer comprises a polyurethane resin.
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WO/2021/000727A1 |
Provided are aramid 1313 mesh fibers, which are flocculent fiber mass form aramid 1313 fibers, and aramid 1313 fiber filaments are interwoven to form a three-dimensional mesh structure. The aramid 1313 mesh fibers are used in an epoxy re...
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WO/2020/262061A1 |
Provided is an epoxy resin composition: that produces a cured product having excellent adhesion with a metal while having low dielectric properties; that has good workability when used; and that and good shelf life. More specifically, pr...
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WO/2020/262980A1 |
The present invention relates to: an adhesive composition; a coverlay film comprising same; and a printed circuit board, wherein the adhesive composition comprises an epoxy resin, a binder resin containing at least one type of rubber, an...
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WO/2020/261087A1 |
The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solu...
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WO/2020/261501A1 |
Disclosed is a method for selecting an adhesive composition containing a thermoplastic resin, a thermosetting resin, and a cationic polymerization initiator. This method for selecting an adhesive composition includes a step for determini...
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WO/2020/262969A1 |
The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of t...
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