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WO/2020/176456A1 |
A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a f...
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WO/2020/175272A1 |
Provided are: an adhesive agent for an endoscope and containing a curing component, an acid-based curing acceleration component, and an epoxy resin containing at least one among bisphenol A epoxy resin, bisphenol F epoxy resin, and a phe...
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WO/2020/175278A1 |
An adhesive for an endoscope, the adhesive comprising (a)-(c), a cured product thereof, an endoscope in which members are fixed using the cured product, and a manufacturing method thereof. (a) an epoxy resin including at least one kind a...
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WO/2020/175056A1 |
Provided is an electroconductive adhesive having high flowability and electrical conductivity.　The electroconductive adhesive comprises (A) electroconductive particles, (B) a solvent, (C) a thermosetting resin, and (D) silica particles...
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WO/2020/170908A1 |
A multiple package-type curable composition which comprises: an agent A that contains (A) a polyoxyalkylene polymer having a reactive silicon group, (B) a (meth)acrylic acid ester polymer having a reactive silicon group, and (D) an epoxy...
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WO/2020/170778A1 |
The purpose of the present invention is to provide: a liquid epoxy resin composition which is a low-viscosity liquid at room temperature, exhibits sufficient adhesive strength, and provides a cured product exhibiting a lower dielectric c...
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WO/2020/166754A1 |
The present invention relates to a method for manufacturing a plastic card having a metal decoration inserted thereinto and a plastic card having a metal decoration inserted thereinto. The method for manufacturing a plastic card having a...
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WO/2020/158453A1 |
Provided are a surface modification method that modifies a surface of a polymeric material, particularly a polymeric material including a ketone group, and also a bonding method, a surface modification material, and an assembly. This sur...
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WO/2020/157805A1 |
The present invention discloses an adhesive composition which contains a thermosetting resin, a curing agent and an elastomer, and which is configured such that: the thermosetting resin contains an epoxy resin that has an alicyclic ring;...
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WO/2020/158360A1 |
An adhesive composition is provided which has excellent adhesion, excellent moist solder heat resistance, and excellent low dielectric properties.　As the copolymer components, this polyimide urethane resin (A) contains polycarboxylic a...
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WO/2020/157616A1 |
The present invention provides a photocurable adhesive composition. The photocurable adhesive composition comprises, based on the total solid content thereof, 10 to 40 wt% of a thermoplastic polymer containing carboxylic groups and epoxy...
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WO/2020/153259A1 |
Provided is a cover member which combines the properties of glass, flexibility and ease of handling.　This cover member has a configuration comprising a glass plate having a thickness not exceeding 500 μm and a resin film, laminated to...
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WO/2020/153258A1 |
Provided is a medium which has flexibility, smoothness and mold releasability and can retain these properties even when the medium is used repeatedly on a production line.　The medium according to the present invention is a medium which...
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WO/2020/153803A1 |
The present invention relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate, the method comprising the steps of: preparing a polarizer; providing an adhesive composition on one surfa...
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WO/2020/153134A1 |
Provided is a reinforcement laminated film which has a surface protection film and a separator, and can be smoothly picked up one by one from a stacked state. The reinforcement laminated film of the present invention has a separator, an ...
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WO/2020/145111A1 |
An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing said thiol compound; a curing agent containing said thiol compound; a resin composition containing said thiol compound and an epoxy co...
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WO/2020/141130A1 |
The present invention relates to heat-curing epoxy resin compositions containing a dihydracide as a hardener, which is selected from the group consisting of glutaric acid dihydracide, adipic acid dihydracide and pimelic acid dihydracide ...
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WO/2020/136902A1 |
Provided is a die bonding film which comprises an epoxy resin, an active ester resin, an elastomer, and a filler.
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WO/2020/137947A1 |
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. At least one surface of the film-like adhesive does not substantially include an aromatic compound.
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WO/2020/138070A1 |
A purpose of the present invention is to provide an adhesive composition for fixing movable components which has excellent adhesiveness to both metals and non-metals, can be cured at low temperatures, and can prevent the movable componen...
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WO/2020/136511A2 |
The present disclosure provides a method for bonding parts, comprising the following steps (a) Providing a two-component adhesive composition precursor, comprising a first part (A) comprising at least one epoxy curing agent and preferabl...
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WO/2020/137934A1 |
A film-like adhesive agent of one embodiment contains an acrylic resin (a), an epoxy compound (b1), and a phosphorus antioxidant (z). Before being heated at 260°C, this film-like adhesive agent has a linear transmittance of 90% or great...
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WO/2020/133353A1 |
A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw...
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WO/2020/136904A1 |
This adhesive film contains an adhesive agent layer comprising a thermosetting resin composition. When the shear viscosity of the adhesive agent layer at 40°C is denoted by η40 and the shear viscosity of the adhesive agent layer at 80Â...
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WO/2020/138632A1 |
The present invention relates to a non-conductive adhesive film for a semiconductor package and a semiconductor package manufacturing method using same. The non-conductive adhesive film for a semiconductor package comprises: a substrate;...
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WO/2020/136539A1 |
Provided are curable adhesives, along with adhesive tapes, laminates, and laminated mirror buttons that include the curable adhesive. The curable adhesive includes a (meth)acrylate polymer, a curable oxetane compound, a polymer filler, a...
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WO/2020/138052A1 |
Provided is a high-purity 3,4-epoxycyclohexylmethyl methacrylate that is useful as a starting material for functional materials and optical members having excellent transparency and heat resistance. Also provided is an alicyclic epoxy co...
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WO/2020/136901A1 |
Disclosed is a method for evaluating a photocurable adhesive used for a dicing/die attach film. Additionally disclosed are: a dicing/die attach film based on such a method for evaluating a photocurable adhesive; and a method for manufact...
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WO/2020/137944A1 |
A film-like adhesive of this embodiment is for bonding a circuit formation surface of a chip to a light-transmissive cover. When phosphorus concentration V1 is measured by performing X-ray photoelectron spectroscopy analysis on one surfa...
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WO/2020/129917A1 |
A resin composition for temporary fixing use according to the present invention can be used for the formation of a temporary fixing material for use in a semiconductor wafer processing method comprising a temporary fixing step of tempora...
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WO/2020/129996A1 |
A film-form adhesive for bonding a semiconductor element and a support member for mounting the semiconductor element. This film-form adhesive contains an epoxy resin having an epoxy equivalent amount of 140-220 g/eq, a phenolic resin hav...
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WO/2020/125715A1 |
Provided is a low-viscosity mono-component epoxy resin composition which comprises at least one epoxy resin, at least one liquid anhydride curing agent, at least one curing accelerator, and at least one thixotropic assistant. The low-vis...
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WO/2020/124931A1 |
The present invention provides an anisotropic conductive adhesive and a conductive film thereof. The conductive adhesive uses a thermal-cured epoxy resin system as a base, and comprises the following components in percentage by mass: 10-...
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WO/2020/131729A1 |
One-component (1 K) adhesive compositions ("PEEP" compositions) and a process for making them are disclosed. A polyepoxide is reacted with a polyether polyol composition, a polyester polyol composition, or both in the presence of a heat-...
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WO/2020/124909A1 |
Provided by the present invention are an anisotropic conductive adhesive and a conducting film thereof. The conductive adhesive employs a cationic curing system, and comprises the following components by mass: 10-40 wt% of film-forming r...
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WO/2020/128718A1 |
A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, ...
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WO/2020/122275A1 |
method for a functional coating composition and a liquid adhesive composition for urethane foam sponge, the method comprising a process for providing a coating layer on a first surface of a urethane sponge, and a process for providing an...
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WO/2020/121197A1 |
A curable coating composition precursor comprising a first part (A) and a second part (B). The first part (A) comprises at least one first epoxy curing agent selected from aliphatic and cycloaliphatic amines and any combinations and mixt...
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WO/2020/120144A1 |
The invention relates to a cationically curable mass having at least one cationically polymerizable component; a first photoinitiator, which releases an acid upon being irradiated by actinic radiation of a first wavelength λ1; and a sec...
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WO/2020/116408A1 |
The present invention provides a resin composition that is for a millimeter-wave substrate, that provides a cured product having excellent high-frequency characteristics, a small temperature dependence of tanδ, and superior flame retard...
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WO/2020/115041A1 |
An adhesive composition comprising a silane-modified epoxy resin, a dicyclopentadiene novolac epoxy resin and a curing agent. The composition shows good oily steel bonding, even in the absence of CTBN rubber or rubber adducts as tougheni...
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WO/2020/116101A1 |
Provided is an adhesive composition that includes a hydroxy-group-containing (meth)acrylic resin (a), a hydroxy-group-containing modified unsaturated epoxy ester resin (b), a polyisocyanate compound (c), and a photopolymerization initiat...
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WO/2020/117005A1 |
An electronic device is provided that includes a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a lateral member surrounding a space between the front...
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WO/2020/107506A1 |
The present invention relates to an EB curing-specific packaging adhesive, a preparation method, and a method for packaging a film capacitor. S1, hexanediol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, and ...
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WO/2020/110785A1 |
Provided is a film-like adhesive agent 1 for a semiconductor, the adhesive agent 1 having a first thermosetting adhesive agent layer 2 and a second thermosetting adhesive agent layer 3 laid on the first thermosetting adhesive agent layer...
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WO/2020/103228A1 |
The present application relates to an adhesive composition, and an electronic product and preparation method therefor. The adhesive composition is prepared from the following raw materials in parts by weight: 20-40 parts of a thermosetti...
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WO/2020/105438A1 |
The present invention addresses the problem of providing a tire, which is provided with a composite body of a member composed of a polyester material and a member composed of a rubber material, wherein the adhesiveness between the member...
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WO/2020/101236A1 |
The present invention relates to a resin composition for semiconductor adhesion, a semiconductor adhesive film produced therefrom, a dicing die bonding film and a semiconductor wafer dicing method, the resin composition for semiconductor...
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WO/2020/093595A1 |
Disclosed are a frame sealant (10) and a liquid crystal display panel (20). The frame sealant (10) is used for the liquid crystal display panel (20). The frame sealant (10) comprises epoxy resin, acrylic-based resin, a light initiator, a...
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WO/2020/095995A1 |
The present invention addresses the problem of providing an adhesive for structural material bonding, which is capable of bonding materials other than iron, while having properties equivalent to those of adhesives for structural material...
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