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WO/2022/176161A1 |
Disclosed is an adhesive sheet having an adhesive layer (A1L) that is solid at 18°C, wherein the adhesive layer (A1L) includes an epoxy resin, the adhesive sheet has a pressure-sensitive adhesive region (A2R) formed by partially providi...
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WO/2022/176585A1 |
The present invention provides an adhesive sheet that sufficiently and stably adheres to a back surface of a lead frame and a back surface of a sealing resin, and is not separated therefrom before a separation step even when subjected to...
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WO/2022/176809A1 |
Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver...
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WO/2022/173088A1 |
The present invention relates to an additive for an epoxy adhesive, and a structural epoxy adhesive composition comprising same. The additive for an epoxy adhesive according to the present invention may have excellent dispersibility and ...
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WO/2022/166825A1 |
The present invention relates to a curable epoxy resin composition, comprising: A) an epoxy resin; B) a curing agent, comprising polyamide (PA) and polyoxyethylene-based polyetheramine (PEA), wherein the weight ratio of PA to PEA is 1.3-...
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WO/2022/168729A1 |
Provided is a thermally conductive sheet laminate having low thermal resistance and excellent handling and adhesion properties. In this thermally conductive sheet laminate 1, an adhesive film 3 is laminated onto both surfaces of a ther...
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WO/2022/168723A1 |
The present invention addresses the problem of providing an organic resin composition sheet for covering an electronic component that improves yield from a processing step and has superior reliability. The organic resin composition she...
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WO/2022/161847A1 |
The invention relates to an amino-functional adduct from the reaction of at least one amine of formula (I) with at least one epoxy novolac resin having an average functionality in the range of 2.5 to 4. The adduct is liquid at room tempe...
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WO/2022/164171A1 |
The present invention relates to a thermosetting adhesive film and a coverlay film comprising same, and more specifically, to a thermosetting adhesive film which has excellent ion migration resistance while having a low dielectric permit...
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WO/2022/155800A1 |
A fast-dry pre-applied adhesive composition comprising at least one (meth) acrylate component; at least one accelerator; at least one organic peroxide; at least one non-aromatic epoxy resin; and at least one cationic photoinitiator. The ...
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WO/2022/153095A1 |
The present disclosure pertains to UV-curable epoxy acrylate/ methacrylate resins and process for their synthesis. Specifically, the present disclosure pertains to one pot synthesis process for the preparation of UV-curable multifunction...
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WO/2022/152942A1 |
The invention relates to epoxy adhesive compositions comprising low glass transition temperature elastomeric core nanoparticles, a process for the preparation thereof, and uses thereof, in particular at a low temperature.
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WO/2022/149581A1 |
The present disclosure provides an adhesive agent composition. The adhesive agent composition contains an epoxy resin, a first curing agent having a softening point of 90°C or higher, a second curing agent having a softening point of le...
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WO/2022/148103A1 |
Disclosed is a prepolymer, and the preparation raw materials thereof comprise: (A) a compound with the structure as shown in formula (1), wherein R1, R2 and R3 in formula (1) are each independently selected from vinyl or epoxy groups; (B...
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WO/2022/149277A1 |
The present disclosure provides an adhesive composition. The adhesive composition contains an epoxy resin, a first curing agent that has a softening point of at least 90°C, a second curing agent that has a softening point of less than 9...
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WO/2022/149582A1 |
The present disclosure provides a film-like adhesive. With respect to this film-like adhesive, the shear viscosity at 120°C is 17000 Pa·s or less, the storage elastic modulus at 150°C is 23 MPa or more after being cured at 170°C for ...
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WO/2022/141817A1 |
The present invention provides a resin composition and an adhesive film and a cover film comprising same. The resin composition comprises the following components in parts by weight: 40-80 parts of a polyamide imide resin, 10-40 parts of...
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WO/2022/141816A1 |
Provided are a resin composition, a resin adhesive film, and an application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 par...
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WO/2022/142648A1 |
The present invention relates to an organic silicon prepolymer, an organic silicon modified epoxy resin, an adhesive, and a colloid and a preparation method therefor. The organic silicon modified epoxy resin is mainly prepared from the f...
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WO/2022/138807A1 |
The present invention addresses the problem of providing a curable resin composition that is superior as a two-component or multi-component epoxy resin composition as compared to the prior art. Provided is a curable resin composition inc...
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WO/2022/138343A1 |
Provided is an epoxy resin composition including an epoxy resin (A) and a latent curing agent (B) wherein the latent curing agent (B) is solid at 25°C.
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WO/2022/137908A1 |
The present invention provides: an adhesive composition for organic fibers, said adhesive composition being capable of ensuring a desired adhesiveness without using resorcin, while having excellent environmental friendliness and not dete...
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WO/2022/137122A1 |
The present disclosure provides a two-part curable composition precursor comprising (a) a first part (A) comprising at least one multifunctional epoxy resin having an epoxy functionality of at least three; and (b) a second part (B) compr...
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WO/2022/133880A1 |
The present invention relates to a one-component thermosetting epoxy resin adhesive, comprising a) at least one epoxy resin A of the formula (II) wherein the substituents R' and R" independently of one another are either H or CH 3 and th...
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WO/2022/138132A1 |
This adhesive composition comprises a copolymer (A), a crosslinking agent (B), and an aqueous medium, wherein: the copolymer (A) has a structural unit derived from a monomer (a1), a structural unit derived from a monomer (a2) having a ca...
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WO/2022/138747A1 |
This method for manufacturing a circuit connection structure comprises: a step for preparing an adhesive film for circuit connection, which includes a first adhesive layer containing conductive particles and a second adhesive layer provi...
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WO/2022/137703A1 |
The present invention addresses the problem of providing an adhesive composition for organic fibers which is reduced in environmental burden, has satisfactory application efficiency, and can bring about satisfactory adhesion between the ...
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WO/2022/138407A1 |
One purpose of the present invention is to provide a curable resin composition that has excellent fluid characteristics before being cured, excellent leach preventing ability when being semi-cured, and excellent heat resistance after bei...
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WO/2022/135997A1 |
The present invention is directed to a two-component (2K) curable composition comprising: a first component comprising, based on the weight of the component: from 80 to 100 wt.% of a) i) at least one partially (meth)acrylated epoxy resin...
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WO/2022/137861A1 |
A purpose is to provide an adhesive composition that is capable of ensuring the desired adhesiveness without using resorcinol and without harming the workability at the time of use, and a resin material, a rubber article, an organic fibe...
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WO/2022/130258A1 |
Articles that include at least two substrates; and an adhesion promoter, wherein the adhesion promoter is a compound of formula I, (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and...
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WO/2022/126463A1 |
Provided is a two-part epoxy-based structural adhesive composition, which comprises a first part and a second part. The first part comprises: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less ...
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WO/2022/130253A1 |
Methods of bonding a male element and a female element, the method including applying an adhesive composition to at least the male element, the male element including a first metal; inserting at least a portion of the male element into t...
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WO/2022/131318A1 |
Provided are adhesive particles for which adhesion is increased, aggregations are effectively suppressed, and dripping during heating is suppressed. Adhesive particles according to the present invention each include a thermosetting res...
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WO/2022/128967A1 |
The present invention relates to a hem flange bonding method. According to this method, a single-component heat-curing epoxy resin composition comprising 20 -60 wt.% of at least one epoxy resin A, a latent curing agent for epoxy resin B,...
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WO/2022/130879A1 |
The purpose of the present invention is to provide an adhesive composition capable of achieving excellent adhesiveness and mechanical stability even if resorcin and formalin are not contained therein. The present invention is character...
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WO/2022/131319A1 |
Provided are adhesive particles for which dripping during heating is suppressed, adhesion is increased, and the occurrence of light leakage is suppressed. Adhesive particles according to the present invention each comprise a base parti...
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WO/2022/120715A1 |
Disclosed are an insulating adhesive film material, a preparation method therefor and an application thereof; the insulating adhesive film material comprises an insulating polymer composite layer, and the insulating polymer composite lay...
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WO/2022/123894A1 |
Provided is a vulcanized rubber surface processing agent which enables vulcanized rubber pieces to be securely adhered to each other without heating, and with which rubber degradation effects are small. This vulcanized rubber surface pro...
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WO/2022/120900A1 |
Disclosed is a silica filler. The silica filler is composed of silica particles having two or more different organic functional groups grafted on the surface thereof by means of surface modification with two or more different silane coup...
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WO/2022/123994A1 |
The purpose of the present invention is to provide an epoxy resin composition that exhibits an excellent deformation-resistant flexibility and adherence to substrates, can easily be detached after use, and tis suitable for use as a struc...
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WO/2022/123004A1 |
It is provided a photocurable adhesive composition, an article comprising at least one surface coated with the adhesive composition and the use thereof. The photocurable adhesive composition exhibits a good storage stability and a good a...
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WO/2022/123999A1 |
This conductive adhesive film includes a support body and a conductive layer; the conductive layer contains a thermosetting resin composition, and the thermosetting resin composition contains (a) an epoxy resin, (b) a polymer resin that ...
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WO/2022/123931A1 |
The present invention provides an adhesive sheet which exhibits adequate adhesiveness to a semiconductor chip and a sealing resin that seals the semiconductor chip, and which is not likely to leave adhesive residue when removed, while be...
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WO/2022/124336A1 |
The present invention provides an epoxy adhesive which is capable of undergoing cohesive failure without the occurrence of interfacial debonding even in cases where dissimilar materials are bonded by the epoxy adhesive, while maintaining...
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WO/2022/114073A1 |
A one-pack type curable resin composition which contains 100 parts by weight of (A) an epoxy resin, from 1 to 100 parts by weight of (B) polymer particles having a core-shell structure and/or a blocked urethane, (C) a compound which has ...
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WO/2022/114894A1 |
The present invention relates to an epoxy-curing electrically conductive adhesive capable of high-temperature detachment, and a solar cell module using same. More specifically, the present invention relates to: a solvent-free conductive ...
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WO/2022/113923A1 |
This silver-containing paste is used for bonding a silicon surface of a silicon chip to a metal surface, and contains silver-containing particles, a difunctional or higher resin, and a solvent. The content of the silver-containing partic...
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WO/2022/110549A1 |
The present invention relates to a second-order epoxy adhesive layer oil, a preparation method therefor, and an application method thereof, used for a (waterproof) adhesive layer in the field of road and bridge pavement. The second-order...
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WO/2022/113946A1 |
Disclosed is an adhesive film for circuit connection which includes an electroconductive-particle layer comprising electroconductive particles, a cationically polymerizable compound, and an initiator for thermal cationic polymerization. ...
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