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WO/2021/135222A1 |
The present invention relates to a multifunctional-epoxy-vegetable-oil-based UV-curable prepolymer, a preparation method therefor and the use thereof. The preparation method comprises the following steps: uniformly mixing an epoxy vegeta...
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WO/2021/135375A1 |
A graphene AB adhesive and a preparation method therefor. The graphene AB adhesive comprises the following components according to the percentage by weight: a component A: 30%-60% of bisphenol-type glycidyl ether epoxy resin, 10%-30% of ...
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WO/2021/128250A1 |
The present disclosure relates to a B-stageable epoxy adhesive composition and an article manufactured therefrom. The B-stageable epoxy adhesive composition comprises (A) 20%to 50%by weight of a first epoxy resin with an epoxide equivale...
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WO/2021/130640A1 |
A two-component solvent-free adhesive having adhesiveness to polypropylene is provided. A two-component solvent-free adhesive including a main agent and a curing agent, in which the main agent contains an epoxy component including a liqu...
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WO/2021/131267A1 |
Provided is an adhesive composition which has excellent electrical properties (low relative permittivity and low dielectric dissipation factor) and can form an adhesive layer having excellent adhesion (adhesiveness) after heat curing. Th...
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WO/2021/131523A1 |
An adhesive agent for an endoscope and a cured product thereof, said adhesive agent including: an epoxy resin (A) including at least one type of epoxy resin out of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenolic novo...
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WO/2021/132234A1 |
[Problem] To provide a multilayer body which comprises a polarizing film and a retardation layer, while having good adhesion between the polarizing film and the retardation layer and excellent durability. [Solution] A multilayer body whi...
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WO/2021/132148A1 |
Provided is a laminated body in which, even in the case where multiple materials having different linear expansion coefficients are laminated via an adhesive, it is possible to keep warpage in the laminated body at a reduced level after ...
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WO/2021/131268A1 |
Provided is an adhesive composition that has superior electrical properties and is capable of forming an adhesive layer of superior tightness of bond (adhesiveness) when heat-cured, and that has superior tightness of bond (adhesiveness) ...
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WO/2021/124127A1 |
The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of a crosslinker and optionally one or more additives. The bonding resin i...
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WO/2021/124033A1 |
The present disclosure provides a two-part composition polymeric material including a first part and a second part. The first part includes an inorganic filler and a polymeric material including a polymerized reaction product of a polyme...
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WO/2021/124668A1 |
Provided is an adhesive composition from which an adhesive layer having an excellent electrical property and an excellent adhesion (stickiness) after heat and curing can be formed, and with which an adhesion (stickiness) during a laminat...
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WO/2021/124049A1 |
Provided are two-part shimming adhesives comprising a base part and a hardener part that are curable upon mixing. The base part includes a multifunctional epoxy resin having an epoxide functionality of at least three, a difunctional epox...
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WO/2021/124129A1 |
The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinker and optionally one or more additives....
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WO/2021/123998A1 |
The present invention provides a UV curable composition, a UV curable adhesive film and a UV curable adhesive tape. The UV curable composition comprises, based on the total weight thereof as 100 wt%: 25 to 60 wt% of an ethylene-vinyl ace...
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WO/2021/127128A1 |
Two part curable compositions are provided which include a first part comprising a (meth)acrylate component and an amine and a second part comprising a fatty acid peroxide. Further disclosed are methods of preparing a two part adhesive c...
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WO/2021/124051A1 |
Provided are two-part curable adhesives that can be suitable for use in industrial bonding applications, including aerospace and automotive bonding. The adhesives include a first part that contains an epoxy resin and a first oligomeric t...
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WO/2021/124126A1 |
The present invention relates to a process for preparing a bonding resin suitable for use in coatings. The invention is directed to a method for preparing a bonding resin for use in a coating, wherein a solution of lignin in an organic s...
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WO/2021/124125A1 |
The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives...
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WO/2021/115881A1 |
The invention relates to a single-component mass, which is liquid at ambient temperature and which can be fixed via irradiation with actinic radiation and can be cured via the influence of moisture. The mass comprises at least the follow...
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WO/2021/117396A1 |
The purpose of the present invention is to provide a cationically curable composition that exhibits an excellent adhesiveness with aluminum die castings, PPS, and the like, while retaining photocurability and low-temperature curability.ã...
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WO/2021/117604A1 |
Provided is an adhesive composition capable of limiting reduction in adhesiveness even after preservation in room temperature or refrigeration environment, the adhesive composition providing excellent adhesiveness under the same adhesion...
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WO/2021/115774A1 |
The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: ...
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WO/2021/119388A1 |
A moisture-cure, hybrid synthetic resin paste may be applied over an aperture formed in a wet surface to cover the aperture and form a waterproof barrier. In some examples, water may be flowing or even gushing through the aperture at the...
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WO/2021/112091A1 |
The present invention addresses the problem of providing a rapidly curable resin composition that produces a low-modulus cured article.　A resin composition according to the present invention includes: (A) a cyanate ester resin; (B) a c...
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WO/2021/111978A1 |
This anisotropic conductive film, which is applied for mounting an electronic component on a wiring board and capable of suppressing an increase in a connection resistance value without reducing particle capture efficiency, contains an e...
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WO/2021/108955A1 |
Disclosed are an insulating adhesive film material having low dielectric loss at high frequency and a preparation method therefor. The insulating adhesive film material is made of an electronic paste prepared from raw materials comprisin...
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WO/2021/112134A1 |
[Problem] To provide a layered product having good adhesiveness, dielectric characteristics, and linear expansion properties. [Solution] A layered product comprising a metal substrate, an adhesive layer, and a resin substrate, which are ...
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WO/2021/111995A1 |
[Problem] To provide an adhesive material which when being used to bond flexible members constituting a flexible laminate member, can suppress deformation in a bent place of the flexible laminate member even if the flexible laminate memb...
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WO/2021/112023A1 |
Provided is a film wound body that makes it possible to feed out an adhesive film exhibiting excellent adhesiveness even in thermocompression bonding at a low temperature for a short time, and to suppress the occurrence of blocking even ...
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WO/2021/112104A1 |
The problem addressed by the present invention is to provide a resin composition that can rapidly cure and that allows for the production of a low-elasticity cured product.　The resin composition according to the present invention inclu...
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WO/2021/107428A1 |
The present invention relates to a method for manufacturing an ultra-low-temperature, fast-curable epoxy resin and a powder coating composition comprising a resin manufactured thereby and, specifically, to a method for manufacturing an u...
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WO/2021/106962A1 |
The present invention addresses the problem of providing a resin composition which is excellent in terms of adhesiveness and moist heat resistance and which, when cured under high-temperature, high-humidity conditions, is inhibited from ...
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WO/2021/106847A1 |
[Problem] To provide an adhesive film that has high adhesiveness with respect to metal substrates and resin substrates such as polyimides, that enables a high solder heat resistance to be achieved, and that provides excellent film handli...
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WO/2021/106848A1 |
[Problem] To provide an adhesive composition which has a high adhesion to a metal substrate and a resin substrate such as a liquid crystal polymer or syndiotactic polystyrene as well as to a conventional polyimide or polyester film, and ...
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WO/2021/108035A1 |
Disclosed herein are thermal interface material comprising liquid epoxy resin that is free of aromatic groups and high loading of aluminum trihydroxide and the use thereof in battery powered vehicles.
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WO/2021/097853A1 |
A single-component normal-temperature curable encapsulating material, comprising a mixture of the following substances: a carrier medium and a phase change substance, wherein every 100 parts by weight of the mixture contains 20-60 parts ...
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WO/2021/097901A1 |
The present invention relates to a UV viscosity-reducing composition and a UV viscosity-reducing adhesive tape. The UV viscosity-reducing composition of the present invention comprises, by weight, the following components in parts by wei...
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WO/2021/096654A1 |
An adhesive composition comprising 100 parts by weight of an epoxy resin composition; 30- 400 pbw of a curing composition comprising a monoanhydride and an aromatic dianhydride of formula (2) as provided herein; and a curing catalyst, wh...
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WO/2021/092879A1 |
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a...
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WO/2021/095677A1 |
The present invention addresses the problem of providing an epoxy resin composition which produces a rapidly-cured product that shows little coloration. The present invention is an epoxy resin composition which shows little coloration or...
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WO/2021/096526A1 |
A two-part adhesive composition for the bonding of a low surface energy polymer to a substrate material, the adhesive comprising: a part A including one or more of an epoxy having at least two epoxy groups per molecule or a reaction prod...
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WO/2021/096556A1 |
An ultraviolet-curable (UV-curable) adhesive composition is disclosed. The adhesive composition comprises: A) an epoxy curing agent component; B) a microencapsulated epoxy resin component; C) an expansion agent component; D) a binder com...
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WO/2021/083632A1 |
A composition curable cationically in a moisture-induced manner comprises at least one cationically polymerizable component (A) and at least one moisture-latent initiator for cationic polymerization (B), wherein the polymerizable compone...
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WO/2021/085008A1 |
Provided is an adhesive sheet for devices, having a curable adhesive layer comprising component (A) and component (B), and having a component (A) content of at least 3.0 mass% in the curable adhesive layer. The adhesive sheet for devices...
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WO/2021/087238A1 |
Disclosed herein is a solvent-based bonding primer composition containing one or more organic solvents, one or more epoxy resins, one or more curing agents, a silane compound, and a low amount of core-shell rubber particles in nanometer ...
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WO/2021/079670A1 |
As an adhesive composition which exhibits excellent long term durability in moist heat environments and excellent adhesive properties, the present invention provides an adhesive composition for a flexible printed wiring board, which cont...
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WO/2021/078955A1 |
The invention relates to an adhesion-promoting composition for a textile material, comprising a salt of lignosulphonate, an epoxy hardener for said salt, comprising at least two epoxide units, and an elastomer latex. The lignosulphonate ...
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WO/2021/077817A1 |
A precast ultra-high-performance concrete steel bridge deck pavement structure and a preparation method. The pavement structure has a total thickness of 5-8 mm, and sequentially consists of a steel slab base layer (1), a high-toughness r...
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WO/2021/079968A1 |
This adhesive agent composition contains a thermosetting adhesive agent component and metal particles. The adhesive agent component contains an epoxy resin, a phenol resin, and an elastomer. The metal particles are at least one of a silv...
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