Title:
INSULATING ADHESIVE FILM MATERIAL FOR PREPARING FINE CIRCUIT AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/050710
Kind Code:
A1
Abstract:
Disclosed in the present invention are an insulating adhesive film material for preparing a fine circuit and a preparation method therefor. Specifically, the insulating adhesive film material is composed of a polymer compound, which is composed of an adhesive film layer and a carrier film, and a polymer protection film, which covers the surface of the adhesive film layer by means of hot pressing or rolling, wherein the polymer protection film has a roughness Ra of 5 nm to 1 μm, a thermal expansion coefficient of 10-300 ppm/K, a softening temperature point of 40-350ºC, and elongation at break of 10-1000%. In the present invention, the polymer protection film is found to have a proper thermal expansion coefficient, a proper softening point and proper elongation at break, and thus can guarantee the processability of the insulating adhesive film.
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Inventors:
SUN RONG (CN)
YU JUNYI (CN)
LUO SUIBIN (CN)
YU SHUHUI (CN)
YU JUNYI (CN)
LUO SUIBIN (CN)
YU SHUHUI (CN)
Application Number:
PCT/CN2022/117467
Publication Date:
March 14, 2024
Filing Date:
September 07, 2022
Export Citation:
Assignee:
SHENZHEN INSTITUTE OF ADVANCED ELECTRONIC MAT (CN)
International Classes:
C09J163/00; C09J7/20; C09J7/30; C09J11/04; C09J11/08
Foreign References:
| CN112662334A | 2021-04-16 | |||
| CN110511718A | 2019-11-29 | |||
| CN111087843A | 2020-05-01 | |||
| CN112724867A | 2021-04-30 | |||
| CN112724868A | 2021-04-30 | |||
| CN114479734A | 2022-05-13 | |||
| CN114891454A | 2022-08-12 | |||
| JP2010090283A | 2010-04-22 | |||
| KR20180124250A | 2018-11-21 |
Attorney, Agent or Firm:
BEIJING CHENGHUI LAW FIRM (CN)
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