Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/038816
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide an epoxy-based adhesive which exhibits good toughness and heat resistance, while having excellent adhesion to a base material. [Solution] An adhesive composition which contains (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) a thixotropic agent and (E) a polyester, wherein: the polyester (E) comprises, as a constituent unit, a component that has a phenolic hydroxyl group; and the content of the polyester resin (E) is 1-30 parts by mass relative to 100 parts by mass of the epoxy resin (A). A multilayer body which has an adhesive layer that is obtained by curing this adhesive composition.
Inventors:
SHIBA TAKUYA (JP)
Application Number:
PCT/JP2023/029133
Publication Date:
February 22, 2024
Filing Date:
August 09, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J11/04; C09J7/30; C09J11/06; C09J11/08; C09J163/00; C09J167/02
Domestic Patent References:
| WO2019188641A1 | 2019-10-03 |
Foreign References:
| JP2002302663A | 2002-10-18 | |||
| JP2021088649A | 2021-06-10 | |||
| JP2015187271A | 2015-10-29 | |||
| JP2022078847A | 2022-05-25 | |||
| JP2015514140A | 2015-05-18 |
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