Title:
LAMINATED FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053232
Kind Code:
A1
Abstract:
This laminated film comprises in the order given: an adhesive layer containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having two carboxyl groups; a pressure-sensitive adhesive layer; and a base material layer, wherein the flux compound contains at least one compound selected from the group consisting of compounds having an aromatic ring, compounds having an aliphatic ring, and compounds for which the number of constituent atoms in the main chain is 4, 6, 8 or more.
Inventors:
IIHOSHI AKIHITO (JP)
MIYAHARA MASANOBU (JP)
SATO MAKOTO (JP)
MASUNO DAISUKE (JP)
KAWAMATA RYUTA (JP)
MIYAHARA MASANOBU (JP)
SATO MAKOTO (JP)
MASUNO DAISUKE (JP)
KAWAMATA RYUTA (JP)
Application Number:
PCT/JP2023/025165
Publication Date:
March 14, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/35; C09J11/06; C09J163/00; H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| WO2021065518A1 | 2021-04-08 | |||
| WO2022059095A1 | 2022-03-24 |
Foreign References:
| JP2013207177A | 2013-10-07 | |||
| JP2012038975A | 2012-02-23 | |||
| JP2011148934A | 2011-08-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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