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WO/2024/089380A1 |
A controlled environment agriculture lighting assembly includes RGBs arranged in series with each other, each PCB including a PCB substrate having at least one lighting channel comprising LEDs mounted to the substrate, and a plurality of...
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WO/2024/090410A1 |
Provided is a resin composition with which a novel cured product can be achieved. Also provided are the cured product, a prepreg, a metal-foil-clad laminate board, a resin composite sheet, and a printed wiring board. The resin compositio...
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WO/2024/090990A1 |
Disclosed is an electronic device comprising wirings. The electronic device according to various embodiments of the present invention, which comprises a plurality of wirings carrying DC power and at least one RF signal, may comprise: an ...
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WO/2024/090409A1 |
Provided are: a resin composition capable of providing a novel cured product; a cured product; a prepreg; a metal foil-clad laminate; a resin composite sheet; and a printed wiring board. The present invention provides a resin composition...
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WO/2024/087697A1 |
A layout scheme of a data transmission wiring, and a main board and an electronic device. The data transmission wiring comprises a first clock pair signal line (20), a first data pair signal line (30) and a first matching line (41). The ...
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WO/2024/091846A1 |
Single-chip solutions and related methods that result in much higher capacitance densities than is achievable with current on-chip solutions and which reduce consumption of planar area of a mounting structure. Embodiments of the present ...
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WO/2024/090291A1 |
Provided are an adhesive composition that has excellent adhesion and solder heat resistance, exerts excellent adhesion even after being exposed to high temperatures for a long period of time, and has good circuit embeddability while supp...
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WO/2024/090348A1 |
One embodiment of the present invention provides a stretchable device including: a stretchable base material; a plurality of flexible first conductive parts provided on the stretchable base material and separated from each other; and str...
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WO/2024/088555A1 |
The disclosure relates to a semiconductor package (100) comprising: an integrated circuit (140) comprising at least one first connection terminal (141) and at least one second connection terminal (143); an encapsulant (150) encapsulating...
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WO/2024/090408A1 |
The present invention provides a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, and a printed wiring board. Provided is a resin composition comprising: a polymaleimide compound (A); an...
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WO/2024/090394A1 |
Provided is a laminated structure from which a cured product having a low-roughness surface, excellent plating adhesion, and excellent heat resistance can be formed. The laminated structure according to the present invention comprises a ...
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WO/2024/089948A1 |
Provided is an electronic component and an electronic component mounting structure that can suppress cracking. This electronic component comprises a component body 10 having a length direction L, and a first external electrode 21 and a...
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WO/2024/087201A1 |
Provided is a manufacturing method for a circuit board assembly (100), comprising the steps of: providing a packaging substrate (22), the packaging substrate (22) comprising a base material layer (11), a circuit layer, and a hollow elect...
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WO/2024/088494A1 |
The disclosure relates to a semiconductor package (100) comprising an electronic chip (140);an encapsulant (150) encapsulating at least part of the at least one electronic chip (140); a first metal layer (110) placed upon at least one of...
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WO/2024/088993A1 |
The invention relates to a method for producing an electrical circuit (2) for an electric motor, wherein a printed circuit board (4) with a printed circuit board cutout (16) and an electronic component (6) with an electrical connection (...
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WO/2024/087916A1 |
Disclosed in the present invention are a manufacturing method for a metallic aluminum circuit board, and a metallic aluminum circuit board and a circuit board module. The manufacturing method comprises: preparing an aluminum-coated subst...
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WO/2024/087283A1 |
The present application relates to the technical field of composite materials, and in particular, to a low-transmission-loss copper-based composite material and a preparation method therefor, a PCB and an electronic component. The low-tr...
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WO/2024/092246A1 |
Electronic stickers comprising at least one electronic component and conductive pads in electrical contact with the electronic component are provided. The electronic components are associated with a first side of the sticker, and an adhe...
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WO/2024/090396A1 |
The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according...
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WO/2024/087238A1 |
The present invention relates to a glass-based backlight plate for Mini LED display and a manufacturing method. The glass-based backlight plate comprises two glass circuit boards each having circuit surfaces on both sides, wherein the tw...
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WO/2024/090364A1 |
[Problem] To provide a multilayer body which has excellent heat dissipation performance in the thickness direction, excellent thermal diffusibility in the in-plane direction, and excellent electrical insulation performance in the thickne...
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WO/2024/090510A1 |
[Problem] The present invention provides a multilayer body which is capable of efficiently forming an insulating layer that has achieved a good balance between excellent via formability and high dielectric characteristics. [Solution] D...
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WO/2024/089430A1 |
A switching unit for a power control unit is disclosed, comprising at least one power supply node for connection to a power supply, at least one load node for connection to a load, an electrical current path configured to connect the at ...
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WO/2024/088470A1 |
The aim of the invention is to reduce the complexity required to mechanically connect at least two printed circuit board plug connectors together in a reversible manner. This is achieved by a device (1) which has at least one introductio...
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WO/2024/088486A1 |
The aim of the invention is to provide a reliable measuring behaviour in a wide variety of environmental conditions using structurally simple means. This is achieved in that a sensor (1) for measuring a distance or a position, in particu...
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WO/2024/085620A1 |
A camera module according to an embodiment comprises: a first substrate having a first terminal part; an image sensor disposed on the first substrate; a base disposed on the first substrate; a lens driving device which is disposed on the...
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WO/2024/084847A1 |
In the present invention, a spacer (1) having a columnar shape is mounted such that a circular conductor pattern (5) corresponding to a bottom end surface (1b) of the spacer (1) is formed on a circuit board (4), a resist (6) is formed ar...
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WO/2024/084830A1 |
Provided is an electronic device capable of preventing cracking in a base material that occurs from a starting point between metal wiring patterns in a flexible portion of a multilayer wiring board. An electronic component is mounted on ...
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WO/2024/085511A1 |
A smart IC substrate, according to an embodiment, comprises: a base including a first surface and a second surface opposite the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; an...
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WO/2024/085047A1 |
A multilayer polyimide film (10) comprises a non-thermoplastic polyimide layer (11) and a thermoplastic polyimide layer (12) that is disposed on at least one surface of the non-thermoplastic polyimide layer (11). The thermoplastic polyim...
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WO/2024/051603A9 |
The present application relates to the technical field of electronic devices, provides an electronic device, and solves the problem of interference to antenna signals caused by coupling inside electronic products. The electronic device c...
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WO/2024/085727A1 |
The present invention relates to a board for electronic parts, a method for manufacturing the board for electronic parts, and a display and a semiconductor device which include the board, the board comprising: a substrate including at le...
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WO/2024/082678A1 |
A small-size double-redundancy electric power steering motor controller structure, comprising a sealing cover cap, a ventilation valve, a connector, a power joint connector, a bendable PCBA board, screws, a stud screw, a magnet, a radiat...
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WO/2024/085602A1 |
According to an embodiment of the present disclosure, a relay board for manufacturing a display may comprise: a transparent plate; a transparent buffer material disposed under the plate; and a pattern layer disposed between the plate and...
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WO/2024/084637A1 |
The present invention provides a method for manufacturing a semiconductor device, the method including: a step for preparing a semiconductor package and a motherboard, the semiconductor package having a package substrate and a plurality ...
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WO/2024/085462A1 |
An electronic device according to one embodiment comprises: a housing; a printed circuit board including an insertion hole; at least one electronic component; and a fastening member inserted into the insertion hole, wherein the printed c...
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WO/2024/085476A1 |
An embodiment of the present invention provides a camera actuator comprising: a housing; a mover which is arranged in the housing and includes an optical member; a tilting guide unit connected to the mover in the housing; and a driving u...
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WO/2024/085687A1 |
A circuit board according to an embodiment comprises: an insulating layer; a first pad disposed on the insulating layer; and a protective layer that is disposed on the insulating layer and includes a first open region vertically overlapp...
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WO/2024/083576A1 |
The invention relates to a connector (1) for a printed circuit, the connector (1) comprising: a pin (1A) which extends longitudinally along a main axis (Ap); and a connector head (1B) which is attached to one end (1A.1) of the pin (1A) a...
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WO/2024/084906A1 |
This metallized resin film (10) comprises a resin composition layer (11), an electroless copper plating layer (12), and an adhesion layer (13) sandwiched between the resin composition layer (11) and the electroless copper plating layer (...
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WO/2024/085790A1 |
The present disclosure relates to an oscillator device (1) comprising at least one active circuit device (2), a circuit board (3) and a resonator cavity (4) that comprises a resonator cavity cover (21) and electrically conducting inner w...
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WO/2024/083507A1 |
A method of fabricating a multilayer circuit board is provided which includes forming a layer of a the multilayer circuit board with an internal clearance region having a modified voltage-to-ground clearance of conductive material adjace...
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WO/2024/085564A1 |
An electronic device according to an embodiment of the present disclosure may comprise: a drive unit which includes a camera lens; a housing in which the drive unit is disposed and which encompasses the drive unit; and a printed circuit ...
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WO/2024/047244A3 |
The invention relates to an amplifier circuit (1) for broadband and low-noise amplification of a capacitive current source, preferably a pyroelectric sensor, comprising a signal input (3) that can be connected to the capacitive current s...
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WO/2024/084631A1 |
[Problem] To reduce volume shrinkage during cooling after sintering so as to reduce voids in a silicon nitride sintered body and reduce warpage of the silicon nitride sintered body. [Solution] Provided is a silicon nitride sintered body ...
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WO/2024/080624A1 |
An electronic device may comprise: a first substrate including a first hole; a second substrate including a second hole; a shield can attached to another side opposite to one side of the first substrate facing the second substrate; an in...
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WO/2024/080654A1 |
An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board arranged in the housing; and a battery which is arranged in the housing, and which includes a battery protection circuit ...
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WO/2024/079925A1 |
The present invention relates to a resin composition comprising a maleimide resin that is compatible even when main skeletons are different from each other. The objective of the present invention is to provide: a curable resin compositio...
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WO/2024/079332A1 |
In general terms, the present invention relates to improvements in a printed ink circuit and related assemblies, kits and/or garments. A first aspect of the invention provides an assembly of a fabric base carrying a printed ink circuit c...
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WO/2024/080046A1 |
This battery-monitoring device (100) comprises a wiring substrate (10) in which part of wiring (12) is provided to a substrate surface (S1), circuit components (21, 22) that are connected to the wiring (12) mounted on the substrate surfa...
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