LOW-TRANSMISSION-LOSS COPPER-BASED COMPOSITE MATERIAL AND PREPARATION METHOD THEREFOR, PCB AND ELECTRONIC COMPONENT

WIPO Patent Application WO/2024/087283

A1

The present application relates to the technical field of composite materials, and in particular, to a low-transmission-loss copper-based composite material and a preparation method therefor, a PCB and an electronic component. The low-transmission-loss copper-based composite material comprises a plurality of laminated units which are sequentially and repeatedly stacked in a preset direction; each laminated unit comprises a conductor layer and an insulating layer covering the surface of the conductor layer in the preset direction, wherein the conductor layer comprises a single crystal copper layer. According to the low-transmission-loss copper-based composite material provided by the present application, the effective area of signal transmission of the low-transmission-loss copper-based composite material can be effectively increased, and the transmission loss of the entire low-transmission-loss copper-based composite material can be effectively reduced without reducing the surface roughness of the single crystal copper layer, thereby facilitating the application of the low-transmission-loss copper-based composite material in high-frequency and high-speed signal transmission.

DING ZHIQIANG (CN)
ZHANG ZHIQIANG (CN)
HE MENGLIN (CN)
HUANG ZHI (CN)
YUE XIANGBIN (CN)
WANG ENGE (CN)

PCT/CN2022/133747

May 02, 2024

November 23, 2022

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SONGSHAN LAKE MAT LAB (CN)
ZHONGKE CRYSTAL MAT DONGGUAN CO LIMITED (CN)

H05K1/09; H05K1/02; H05K3/00

CN108698375A	2018-10-23
CN113873750A	2021-12-31
CN203282767U	2013-11-13
CN213339709U	2021-06-01

CHOFN INTELLECTUAL PROPERTY (CN)

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