Title:
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2024/085687
Kind Code:
A1
Abstract:
A circuit board according to an embodiment comprises: an insulating layer; a first pad disposed on the insulating layer; and a protective layer that is disposed on the insulating layer and includes a first open region vertically overlapping the first pad. The horizontal width of the first open region is less than the horizontal width of the first pad, and the inner wall forming the first open region of the protective layer includes a first inner wall and a second inner wall having a stepped portion along the horizontal direction.
Inventors:
LIM SAE HOON (KR)
MYEONG SE HO (KR)
YUN NAM GYU (KR)
MYEONG SE HO (KR)
YUN NAM GYU (KR)
Application Number:
PCT/KR2023/016272
Publication Date:
April 25, 2024
Filing Date:
October 19, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K3/28; H01L23/00; H01L23/12; H01L23/498; H01L25/065; H05K1/11
Foreign References:
| JP2001223291A | 2001-08-17 | |||
| KR102422055B1 | 2022-07-18 | |||
| KR101973427B1 | 2019-04-29 | |||
| JP2001230339A | 2001-08-24 | |||
| JP2011238951A | 2011-11-24 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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