Title:
SMART IC SUBSTRATE, SMART IC MODULE, AND IC CARD COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2024/085511
Kind Code:
A1
Abstract:
A smart IC substrate, according to an embodiment, comprises: a base including a first surface and a second surface opposite the first surface; a bonding layer disposed on the first surface; a metal layer disposed on the bonding layer; and a plating layer disposed on one surface of the metal layer, wherein the metal layer includes an aluminum (Al)-copper (Cu) alloy or an aluminum (Al)-copper (Cu)-A alloy.
Inventors:
JO MIN SUNG (KR)
ROH MYOUNG LAE (KR)
LEE TAE JIN (KR)
SOHN SEOK SU (KR)
CHUNG HYUN (KR)
JANG TAE JIN (KR)
ROH MYOUNG LAE (KR)
LEE TAE JIN (KR)
SOHN SEOK SU (KR)
CHUNG HYUN (KR)
JANG TAE JIN (KR)
Application Number:
PCT/KR2023/015369
Publication Date:
April 25, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
UNIV KOREA RES & BUS FOUND (KR)
UNIV KOREA RES & BUS FOUND (KR)
International Classes:
G06K19/077; C22C21/12; H01L23/00; H01L23/12; H05K1/09
Domestic Patent References:
| WO2018035258A1 | 2018-02-22 |
Foreign References:
| KR20220032774A | 2022-03-15 | |||
| US20190341345A1 | 2019-11-07 | |||
| KR20140078105A | 2014-06-25 | |||
| KR20020005596A | 2002-01-17 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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