Title:
MANUFACTURING METHOD FOR METALLIC ALUMINUM CIRCUIT BOARD, AND METALLIC ALUMINUM CIRCUIT BOARD AND CIRCUIT BOARD MODULE
Document Type and Number:
WIPO Patent Application WO/2024/087916
Kind Code:
A1
Abstract:
Disclosed in the present invention are a manufacturing method for a metallic aluminum circuit board, and a metallic aluminum circuit board and a circuit board module. The manufacturing method comprises: preparing an aluminum-coated substrate, wherein the aluminum-coated substrate comprises an insulating substrate layer and a front-face aluminum layer located on one face of the insulating substrate layer; manufacturing anti-etching ink on the front-face aluminum layer, and covering the aluminum layer where a circuit and a conductive wire need to be formed; etching the aluminum-coated substrate using an etching method, and etching the front-face aluminum layer to form a front-face aluminum circuit layer and an aluminum conductive wire, wherein all the circuits of the front-face aluminum circuit layer are interconnected and conducting by means of the aluminum conductive wire; removing the anti-etching ink; manufacturing a front-face solder mask on the front-face aluminum circuit layer, wherein the front-face solder mask partially covers the front-face aluminum circuit layer, so as to expose an aluminum pad; electroplating the aluminum pad with a tinphilic metal using an electroplating method; and disconnecting the aluminum conductive wire. Therefore, it is ensured that a pad has good solderability, and the manufacturing cost of a circuit board is also greatly reduced.
Inventors:
WANG DINGFENG (CN)
DAI HONGXIN (CN)
XU LEI (CN)
WANG SHENGQI (CN)
XU WENHONG (CN)
DAI HONGXIN (CN)
XU LEI (CN)
WANG SHENGQI (CN)
XU WENHONG (CN)
Application Number:
PCT/CN2023/118177
Publication Date:
May 02, 2024
Filing Date:
September 12, 2023
Export Citation:
Assignee:
WANG DINGFENG (CN)
International Classes:
H05K1/11; H05K3/18; H05K3/28; H05K3/34
Attorney, Agent or Firm:
ZHONGSHAN QIANWEN IP LAW (CN)
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