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WO/2024/090569A1 |
The present invention provides a surface-treated steel sheet including a steel sheet and an Fe-Ni diffusion layer that is formed on at least one outermost surface of the steel sheet, wherein the ratio IB/IA of the maximum diffraction int...
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WO/2024/089029A1 |
The invention relates to a method for producing a functional structure, having the steps of: providing a main part of the functional structure; and applying at least one metal layer onto a surface of the main part, wherein the surface of...
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WO/2024/087141A1 |
The present application belongs to the technical field of automobile plastic parts electroplating. Disclosed is an electroplating device for automobile plastic parts. The electroplating device comprises an automobile plastic parts electr...
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WO/2024/089343A1 |
The invention relates to a method for forming a coating (50) on a surface of a metal substrate (10), the method (2000) comprising at least the following steps: a) depositing a hafnium layer (20), the thickness e1 of which is between 0.2 ...
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WO/2024/090570A1 |
The present invention provides an Ni-plated steel sheet which comprises a steel sheet and an Fe-Ni diffusion layer that is formed on at least one surface of the steel sheet, wherein: the average crystal grain size in the outermost surfac...
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WO/2024/082755A1 |
The present application relates to the technical field of alloy materials, and in particular, to a tin plate and a manufacturing method therefor. According to the provided manufacturing method for the tin plate, a component design of low...
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WO/2024/085554A1 |
Disclosed are a plating apparatus for manufacturing an integrated circuit (IC) chip, a plating method for manufacturing an IC chip, and an IC chip manufacturing method using same. The disclosed plating apparatus for manufacturing an IC c...
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WO/2024/081584A1 |
A copper electrolyte comprising a copper salt, a source of halide ions, and a reaction product of an amine or sulfur-containing compound with 2,3-epoxy-1-propanol for producing a nanotwinned copper deposit, optionally in combination with...
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WO/2024/077660A1 |
The present invention relates to the technical field of preparation of dividing lines for dividing semiconductor wafer rods into chips, and provides a pre-plating treatment process and apparatus for a raw material line of a semiconductor...
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WO/2024/081507A1 |
Examples are disclosed that relate to irrigating an ion exchange membrane in an electrodeposition system. In one example, the electrodeposition system comprises a fluid distribution system comprising a membrane assembly that comprises a ...
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WO/2024/075513A1 |
The present invention provides a nickel-plated aluminum member (plated member) which has improved uniformity and adhesion of plating and can be produced through a pretreatment for plating performed by a dry process. The present inventi...
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WO/2024/075698A1 |
A composite material obtained by forming, on a material, a composite film comprising a silver layer containing carbon particles, wherein the crystallite size of the silver in the composite film is greater than 40nm and no greater than 70...
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WO/2024/075533A1 |
Provided are a device for forming a metal coating and a method for forming a metal coating, the device and method making it less likely for tarnishing of a metal coating to occur. This device 1 for forming a metal coating comprises an el...
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WO/2024/070245A1 |
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2 and has a...
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WO/2024/070246A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
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WO/2024/067514A1 |
The present application relates to the technical field of photovoltaics, and discloses a solar cell electroplating device and a solar cell electroplating method. A first conductive assembly and a second conductive assembly are respective...
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WO/2024/070247A1 |
Provided is a surface-treated copper foil that has a copper foil and a surface-treated layer which has been formed on at least one surface of the copper foil. The peak material volume Vmp of the surface-treated layer is 0.022-0.060 μm3/...
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WO/2024/068704A1 |
An apparatus for electrolytically coating metal wires arranged in a web also called a 'plating section' is presented. Compared to prior art plating sections, the apparatus is provided with one or more ultrasound emission boxes that hang ...
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WO/2024/072389A1 |
A method of preparing a non-conductive substrate to allow metal plating thereon and a two-part gel coating composition. The method includes the steps of a) contacting the non- conductive substrate with a conditioner comprising: a high mo...
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WO/2024/070248A1 |
Provided is a surface-treated copper foil comprising a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The actual volume Vmc of a core portion of the surface-treated layer is 0.35 to 0.55 μｍ3...
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WO/2024/068552A1 |
Porous metal plate material and process for producing such a material. The material comprises a perforated metal base plate and an electrodeposited layer with pin-shaped protrusions on at least one side of the perforated base plate made ...
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WO/2024/062909A1 |
This terminal material comprises, in the following order, a base material which comprises copper or a copper alloy, one or more underlayers which are constituted by one or more element selected from the group consisting of Ni, Co, and Fe...
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WO/2024/053207A1 |
Provided is a steel sheet for hot pressing that has excellent rapid heating compatibility, that can prevent liquid metal embrittlement cracking, and that has excellent post-hot-pressing coating adhesion. The steel sheet for hot pressing ...
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WO/2024/051135A1 |
A method for improving a silicon-wafer cleaning effect. The method is characterized by comprising the following steps: step I, a pre-cleaned silicon wafer being put into a first feeding tank (1), wherein the silicon wafer is immersed und...
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WO/2024/046395A1 |
Embodiments of the present application provide a leveling agent, particularly a polypyridine compound. The polypyridine compound comprises a structural unit as shown in formula (I) or a protonation product of the structural unit as shown...
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WO/2024/049027A1 |
A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper f...
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WO/2024/042700A1 |
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed ...
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WO/2024/041062A1 |
Provided in the present invention is an electroplating process of a zinc-nickel alloy coating on the surface of a sintered neodymium-iron-boron material. By means of a multilayer electroplating method, bottom zinc is firstly electroplate...
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WO/2024/042914A1 |
This conductive material has, in the following order: a base material composed of copper or a copper alloy; a base layer that is at least one layer made of at least one selected from the group consisting of Ni, Co, and Fe; a Cu-Sn alloy ...
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WO/2024/040888A1 |
The present application relates to the processing field of circuit boards. Disclosed are a method for plating edge connectors on a circuit board with gold, and a circuit board. The method comprises the following steps: filling gaps betwe...
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WO/2024/037008A1 |
Disclosed in the present invention are a cathode conductive device and electroplating equipment. The cathode conductive device comprises: a conductive section rack; an upper conductive tank assembly which comprises an upper conductive ta...
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WO/2024/027108A1 |
The present invention relates to an electrode having an integrated composite structure of a matrix and a catalyst layer, and a preparation method therefor. The method comprises the following steps: (1) carrying out impurity removal treat...
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WO/2024/022201A1 |
The present disclosure provides an electroplating apparatus, a multi-channel electroplating apparatus group, and an electroplating reaction system. The electroplating apparatus comprises: a cathode control member, a cathode chamber frame...
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WO/2024/021198A1 |
Embodiments of the present description provide a probe treatment method and a probe. The probe treatment method comprises: covering a photosensitive film, exposing a probe part to be treated, developing the exposed probe part, and electr...
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WO/2024/021403A1 |
The present invention relates to a nickel-based alloy composite electrode having a gradient component structure, and a preparation method therefor and a use thereof. The method comprises: placing a nickel matrix in a weak acid solution f...
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WO/2024/018005A1 |
The invention concerns a treated copper foil for use in a secondary battery with a first side and a second side opposite to the first side. The treated copper foil comprises a copper foil with two opposite surfaces and a treatment stack ...
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WO/2024/016070A1 |
Articles including anisotropic electrodeposited layers of fine-grained alloys of Co, Cu, Fe, Ni and/or Zn with minor additions of B, O, P and S that provide high strength, ductility and heat-resistance, are disclosed as well as a process...
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WO/2024/016069A1 |
Articles including electrodeposited layers of fine-grained alloys of Ni, Cu, Co, Fe and Zn with minor additions of B, O, P and S that provide high strength, ductility and thermal stability, are disclosed. The disclosure further relates t...
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WO/2024/014372A1 |
The purpose of the present invention is to produce a galvanized steel plate that is free from unplating and has stable quality. A method for heating a steel plate, the method including heating the obverse and reverse sides of a steel pla...
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WO/2024/014450A1 |
Provided is a sliding member having excellent peeling resistance against a plating layer even when sliding under high surface pressure exceeding 1.5 GPa in terms of hertzian surface pressure. A sliding member (1) comprises: a substrate (...
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WO/2024/014371A1 |
The purpose of the present invention is to manufacture a zinc-plated steel sheet that is free of pickups and that has a stable quality. In this method for heating a steel plate, a steel plate passes through a direct-fired heating furnace...
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WO/2024/008562A1 |
The present invention provides a new use of a polyaminoamide comprising a group of formula N1 [B-A-B'-Z]n[Y-Z]m (N1) in a composition for electrodepositing nanotwinned copper, that is obtainable by reacting a diamine compound comprising ...
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WO/2024/003123A1 |
The disclosure relates to a polymeric article, comprising a thermoplastic polymer composition, wherein the thermoplastic polymer composition includes (i) a copolymer (A) comprising polymeric units derived from a vinyl aromatic monomer, a...
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WO/2023/245868A1 |
The present invention relates to the technical field of electrocatalysis and electrode design and manufacturing, and in particular, to a macroscopic array electrode and a preparation method therefor and a use thereof. The present inventi...
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WO/2023/247443A1 |
The disclosure relates to a stencil mask, a method for manufacturing the stencil mask and use of the stencil mask in nanoscale device nanofabrication, including imprinting on substrates of deposition patterns for nanoscale devices. One e...
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WO/2023/246731A1 |
A composite current collector, and a preparation method therefor and a use thereof, relating to the technical field of new materials. The composite current collector comprises a polymer substrate layer and a diamond-like carbon layer arr...
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WO/2023/244075A1 |
The present invention relates to a steel sheet that can be used for automobiles, etc., and relates to a steel sheet that can ensure improved plating characteristics, and a manufacturing method therefor.
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WO/2023/243170A1 |
Provided is a metal pipe for an oil well, the metal pipe comprising a Zn-Ni alloy plating layer having excellent seizure resistance. A metal pipe (1) for an oil well according to the present disclosure comprises a pipe body (10) includ...
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WO/2023/239209A1 |
The present invention relates to: a hot-dip plated steel sheet having excellent plating quality; a steel sheet for plating, for manufacturing same; and respective methods for manufacturing same. A steel sheet for hot press forming, accor...
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WO/2023/239211A1 |
The present invention relates to a hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for producing same, and a method for manufacturing same. A steel sheet for plating according to one aspect of t...
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