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WO/2023/247443A1 |
The disclosure relates to a stencil mask, a method for manufacturing the stencil mask and use of the stencil mask in nanoscale device nanofabrication, including imprinting on substrates of deposition patterns for nanoscale devices. One e...
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WO/2023/246731A1 |
A composite current collector, and a preparation method therefor and a use thereof, relating to the technical field of new materials. The composite current collector comprises a polymer substrate layer and a diamond-like carbon layer arr...
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WO/2023/244075A1 |
The present invention relates to a steel sheet that can be used for automobiles, etc., and relates to a steel sheet that can ensure improved plating characteristics, and a manufacturing method therefor.
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WO/2023/243170A1 |
Provided is a metal pipe for an oil well, the metal pipe comprising a Zn-Ni alloy plating layer having excellent seizure resistance. A metal pipe (1) for an oil well according to the present disclosure comprises a pipe body (10) includ...
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WO/2023/239209A1 |
The present invention relates to: a hot-dip plated steel sheet having excellent plating quality; a steel sheet for plating, for manufacturing same; and respective methods for manufacturing same. A steel sheet for hot press forming, accor...
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WO/2023/239211A1 |
The present invention relates to a hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for producing same, and a method for manufacturing same. A steel sheet for plating according to one aspect of t...
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WO/2023/239208A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating to manufacture same, and methods for manufacturing same. The steel sheet for plating, according t...
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WO/2023/239206A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a plating steel sheet for manufacturing same, and manufacturing methods therefor. A plating steel sheet according to one as...
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WO/2023/239207A1 |
The present invention relates to a hot-dipped steel sheet having excellent plating quality, a plating steel sheet for manufacturing same, and a manufacturing method therefor. A steel sheet for hot press forming, according to one aspect o...
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WO/2023/239212A1 |
The present invention relates to a hot-dip galvanized steel sheet having excellent plating quality, a plating steel sheet for manufacturing same, and a manufacturing method therefor. A plating steel sheet according to an aspect of the pr...
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WO/2023/234015A1 |
The present invention provides: a surface-coated material for electrical contacts, the surface-coated material exhibiting excellent bending workability, while having a surface that is provided with a silver-containing layer which is capa...
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WO/2023/230942A1 |
The present invention relates to the field of combined machining in the special machining technology. Disclosed are a method and apparatus for preparing a functional gradient coating by using a laser-tuned current waveform. According to ...
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WO/2023/234770A1 |
The present invention relates to a porous material comprising a porous wall structure defining and separating primary pores that are interconnected across its thickness dimension. The primary pores have a diameter greater than 5 µm and ...
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WO/2023/232420A1 |
The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substra...
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WO/2023/234564A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit metal raw materials on a substrate using electrochemical additive manufacturing (ECAM). In additio...
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WO/2023/234565A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively build up layers of metal materials on a substrate by using electrochemical additive manufacturing (ECAM). ...
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WO/2023/225279A1 |
Systems and methods for beneficially affecting the surface morphology of electrically conductive materials using electrochemistry are described. The systems and methods for beneficially affecting the surface morphology of electrically co...
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WO/2023/223685A1 |
The present invention addresses the problem of providing a plating film manufacturing method that can provide excellent corrosion resistance to a plated product having a trivalent chromium plating film formed thereon, and that can form a...
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WO/2023/225072A1 |
Described herein are systems, methods, and apparatus related to flow-assisted batteries. In one aspect, a battery includes an electrode, a cathode, and an electrolyte. The electrode comprises an electrically conductive material and serve...
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WO/2023/219264A1 |
A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises the steps of: dissolving copper (Cu) and nickel (Ni) in sulfuric acid to prepare an electrolytic solution containing ...
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WO/2023/217917A1 |
The present invention belongs to the field of catalytic chemistry, and more specifically to catalysed reduction chemical reactions, preferably of CO2 into small molecules. The present invention relates to a new catalyst compound comprisi...
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WO/2023/219269A1 |
A method for controlling the properties of an electrolytic copper foil, according to one embodiment of the present invention, adds a glossiness control agent so as to adjust the glossiness of an electrolytic copper foil, and thus control...
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WO/2023/214401A1 |
The present disclosure provides a catalyst, its preparation and uses thereof, the catalyst comprising a conductive substrate coated by at least two layers including a proximal layer and a distal layer wherein said proximal layer comprise...
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WO/2023/214491A1 |
Provided is a convenient method for manufacturing electronic components with different base materials. This method for manufacturing an electronic component includes a preparation step, a plasma treatment step, a deposition step, and an ...
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WO/2023/214366A1 |
The present invention relates to a method of removing and safe disposal of electrolyte from all types of spent lithium ion batteries in a commercially feasible manner. Electrolyte, lithium hexafluorophosphate (LiPF6) is highly soluble in...
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WO/2023/210832A1 |
[Problem] Provided is a nickel-plated steel sheet in which a plating layer has adhesiveness to a substrate, which has adhesiveness to other members, and the total thickness of which, including the thickness of a roughened layer, is reduc...
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WO/2023/210822A1 |
[Problem] The present invention addresses the problem of: suppressing the occurrence of a crack even in a state where a rolled surface-treated steel sheet is stretched, while maintaining the hardness of the surface of the rolled surface-...
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WO/2023/210821A1 |
[Problem] To provide a surface-treated metal foil having a high yield strength and fatigue strength. [Solution] Provided is a surface-treated metal foil characterized by having a steel sheet and an iron-nickel alloy layer formed on at le...
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WO/2023/201600A1 |
The present application provides a preparation method for an FeCoNiCuZn high entropy alloy and a FeCoNiCuZn high entropy alloy. In the method, an electroplating solution is electroplated by using electrodeposition to obtain the FeCoNiCuZ...
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WO/2023/202267A1 |
The present application discloses a multi-metal compounding method for a polymeric fiber material and a multi-metal composite fiber. The method comprises: etching a polymeric fiber in an etching solution containing an oxidizing acid and ...
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WO/2023/196489A1 |
Disclosed are novel electrolytes based on liquefied gas and high concentration of salt in liquefied gas electrolytes. Unlike common electrolytes, liquefied gas electrolytes utilize solvents which are gaseous under standard conditions. Th...
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WO/2023/195251A1 |
The present invention provides a surface-treated steel sheet which can be produced without using hexavalent chromium, and which exhibits excellent film corrosion resistance, coating corrosion resistance, film wet adhesion, coating materi...
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WO/2022/245576A9 |
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive c...
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WO/2023/195252A1 |
The present invention provides a surface-treated steel sheet that can be produced without the use of hexavalent chromium and that has both excellent adhesiveness to a BPA-free coating material and BPA-free coating corrosion resistance. P...
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WO/2023/195267A1 |
The present invention provides: a lead frame material which has improved resin adhesion in a high-temperature high-humidity environment, while being capable of preventing fall-off of particles during processing; and the like. A lead fr...
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WO/2023/189566A1 |
Provided is a metal foil with a carrier that makes it possible to suppress the occurrence of breakage or cracking of the metal foil during handling. This metal foil with a carrier comprises a carrier, a release layer, and a metal foil in...
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WO/2023/188637A1 |
The present invention provides: a silver-plated material wherein a silver plating film is not easily separated from a base plating film and exhibits excellent adhesion in a high-temperature high-humidity environment in cases where the si...
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WO/2023/189537A1 |
The present invention provides a method for producing a trivalent chromium plated component (100) that is obtained by forming a trivalent chromium plating film (3) on a sliding component of a device in which a fluid is sealed, the method...
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WO/2023/185350A1 |
The present application relates to the field of solar cells, and provides a method for forming a gate line electrode of a photovoltaic device and the photovoltaic device. The method for forming the gate line electrode of the photovoltaic...
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WO/2023/190860A1 |
This surface-treated copper foil has one surface (A) and the other surface (B), wherein the surface (A) satisfies the following requirements (I) and (II). • Requirement (I): on the surface of the surface-treated copper foil, the mirr...
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WO/2023/188446A1 |
[Problem] To provide a silver-plated material that not only has excellent wear resistance but can also keep the peeling resistance of a silver coating layer high, even when exposed to high-temperature/high-humidity environments. [Solutio...
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WO/2023/190833A1 |
Provided is a surface-treated copper foil in which circuit workability is excellent and transmission loss and generation of foreign matter are less likely to occur. When the optical roughness of the surface (20a) of a surface treatment l...
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WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
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WO/2023/185546A1 |
Disclosed in the present invention is an electroplating apparatus, comprising: a film frame, the center of which is provided with a through hole; a conveying branch pipe extending from a side wall of the film frame through hole to the ed...
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WO/2023/189419A1 |
This electrical contact material comprises: a conductive substrate; and a silver-containing layer which contains silver and is provided on at least a part of the surface of the conductive substrate, wherein the average CI value of the si...
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WO/2023/189418A1 |
This electric contact material comprises an electroconductive substrate and a silver-containing layer that contains silver and is disposed at least on a portion of the surface of the electroconductive layer. In a cross section of the ele...
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WO/2023/190805A1 |
The purpose of the present invention is to provide: a novel copper plating solution for PR pulse electrolysis; and a novel copper plating method by means of PR pulse electrolysis. The present invention provides a copper plating solution ...
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WO/2023/189417A1 |
An electric contact material comprising: a conductive base material; and a silver-containing layer that contains silver and that is provided to at least a portion of the surface of the conductive base material, wherein, in a cross sectio...
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WO/2023/190845A1 |
Provided are a copper foil having high adhesion to a coating film, and a light-shielding material having, in addition to excellent light shielding properties, high adhesion to a black coating film and a substrate. A copper foil (1) has, ...
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WO/2023/179704A1 |
Provided are a copper plating additive composition, a copper plating solution, and a copper brush plating method using the same. The copper plating additive composition includes 1, 4-cyclohexanedione monoethylene acetal, potassium phthal...
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