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WO/2022/007534A1 |
Disclosed is a one-step post-plating treatment method for electroplating a brass steel wire, comprising the following steps: electroplating the surface of a steel wire with a brass alloy; immediately washing the electroplated steel wire ...
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WO/2022/004290A1 |
Provided are: a chemically amplified photosensitive composition with which a plating mold capable of forming a plated object having uniform dimensions can be formed by a photolithography method; a photosensitive dry film comprising a pho...
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WO/2021/259528A1 |
The invention relates to a shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, use of a shield body system, and a method for a chemical and/or electrolytic surface treatment of a subs...
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WO/2021/261348A1 |
A corrosion-resistant terminal material for an aluminum core wire, having excellent plating adhesion and a high corrosion-preventive effect, the corrosion-resistant terminal material having: a base material (2), at least the surface of w...
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WO/2021/255699A1 |
The present invention relates to a process for passivating a tinplate comprising the following steps: a. subjecting the tinplate to at least one cathodic electrolytic treatment in an aqueous solution containing at least one sulphate of a...
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WO/2021/248848A1 |
A method for manufacturing perforated copper coil for a shielded cathode plate. The method comprises the following steps: imprinting a shielding point on a separator according to an expected distribution mode, attaching the separator to ...
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WO/2021/247182A1 |
An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, w...
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WO/2021/241776A1 |
The present invention relates to a method for manufacturing a painless injection needle that manufactures a painless injection needle having an outer diameter of 0.2 mm or less by means of a progressive stamping die process and a plating...
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WO/2021/241865A1 |
The present invention relates to an electrolytic nickel plating surface modifier comprising a carboxyl group-containing compound and an electrolytic nickel plating solution comprising the electrolytic nickel plating surface modifier. Whe...
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WO/2021/236398A1 |
Nanotwinned copper and non-nanotwinned copper may be electroplated to form mixed crystal structures such as 2-in-1 copper via and RDL structures or 2-in-1 copper via and pillar structures. Nanotwinned copper may be electroplated on a non...
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WO/2021/234875A1 |
The printed wiring board according to the present disclosure comprises a base material layer which has insulation properties, a first conductive layer which is laminated on a front surface of the base material layer directly or indirectl...
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WO/2021/230309A1 |
This steel sheet for hot stamping is sequentially provided, in the following order, with: a base material; an Al-Si alloy plating layer that has an Al content of 75% by mass or more and an Si content of 3% by mass or more, with the total...
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WO/2021/231122A1 |
Various embodiments include methods and apparatuses to moisturize a substrate prior to an electrochemical deposition process. In one embodiment, a method to control substrate wettability includes placing a substrate in a humidification e...
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WO/2021/227762A1 |
Provided is a spreader plate in an electrochemical deposition device. The spreader plate comprises: an accommodation housing, wherein the accommodation housing comprises a first wall, a second wall arranged opposite the first wall, and a...
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WO/2021/228604A1 |
The disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a rotatable substrate, an electrochemical deposition system for a chemical and/or electrolytic surface treatment of...
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WO/2021/229481A1 |
The present invention describes a copper/Tin-based alloy containing Pt and optionally Zn and/or Pd having colorimetric coordinates that can be modulated from white to yellow to pink and exhibiting striking hardness and thus wear resistan...
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WO/2021/225827A1 |
Disclosed are apparatus, systems, and methods for electroplating cobalt, nickel, and alloys thereof in interconnect features of partially or fully fabricated electronic devices. During electroplating, cobalt, nickel, or alloys thereof fi...
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WO/2021/225259A1 |
The present invention relates to a multilayer copper foil, a method for manufacturing same, and an electroplating apparatus therefor. A multilayer copper foil according to an aspect of the present invention comprises: a recrystallization...
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WO/2021/221872A1 |
Sequential electrodeposition of metals into through-mask features on a semiconductor substrate is conducted such as to reduce the deleterious consequences of lipseal's pressure onto the mask material. In a first electroplating step, a fi...
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WO/2021/220524A1 |
The purpose of the present invention is to provide a novel composite copper member. More specifically, a composite copper member which comprises a copper member and a layer formed on at least a part of the surface of the copper member an...
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WO/2021/215940A1 |
In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer havi...
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WO/2021/215939A1 |
In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period t...
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WO/2021/214392A1 |
An object comprising a chromium-based coating on a substrate is disclosed. The chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises at least one...
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WO/2021/214389A1 |
An object comprising a chromium-based coating on a substrate is disclosed, wherein the chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises 87 â...
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WO/2021/214390A1 |
An object comprising a chromium-based coating on a substrate is disclosed. The chromium is electroplated from an aqueous electroplating bath comprising trivalent chromium cations, wherein the chromium-based coating comprises: a first chr...
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WO/2021/208651A1 |
The present invention relates to the field of porous material preparation, and in particular, to a method for preparing an ultrahigh-strength titanium alloy porous material on the basis of an additive manufacturing technology. According ...
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WO/2021/211967A1 |
Articles and methods for depositing iron alloy coatings onto metal wires for wireless recharging devices are generally described.
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WO/2021/207254A1 |
Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features havin...
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WO/2021/206092A1 |
A filament according to the present invention including a plating film, in which: the plating film contains copper, zinc and cobalt; when the total of the content ratios of copper, zinc and cobalt in the plating film is 100% by mass, the...
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WO/2021/201330A1 |
The present invention relates to a partial plating jig for an impeller, and the partial plating jig for an impeller, according to the present invention, comprises: a shaft axially passing through an impeller; a first cover fixed to the s...
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WO/2021/196518A1 |
The present invention relates to the technical field of electro-catalytic electrode preparation and provides a lead dioxide-carbon nanotube adsorptive submicron electrochemical reactor as well as a preparation method therefor and an appl...
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WO/2021/199468A1 |
The purpose of the present invention is to provide: a laminate which does not contain hexavalent chromium and has excellent corrosion resistance and abrasion resistance; and a laminate manufacturing method. To achieve the purpose, a lami...
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WO/2021/200412A1 |
Provided is an Fe-electroplated steel sheet having exceptional chemical conversion processing properties, exceptional post-coating corrosion resistance evaluated through a warm salt water immersion test, and exceptional characteristics f...
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WO/2021/193246A1 |
Provided is a roughened copper foil which, when used in a copper-cladded laminate board or a printed wiring board, can achieve both of excellent transmission properties and high peel strength. The roughened copper foil has a roughened su...
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WO/2021/191955A1 |
This hot-stamp molded article is provided with a base material and, as an upper layer of the base material, a Zn-based plating layer that is provided in contact with the base material and that contains Zn and Ni. The area of the Zn-based...
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WO/2021/193038A1 |
Provided are: a raw cold-rolled steel plate with an iron-based coating that has excellent plating appearance and plating adhesion when molten zinc plating is applied after annealing, and that also has excellent chemical treatability when...
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WO/2021/192698A1 |
Provided is a porous metal body in the shape of a flat plate having a three-dimensional net-like skeleton, the porous metal body comprising a plurality of cells, wherein expressions (1) and (2) below are satisfied. (1): 0.4≤cell diamet...
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WO/2021/191334A1 |
The invention relates to a method for electrodepositing a grey or black layer on an electrical circuit. Said electrical circuit is, for example, a printed circuit-type electrical circuit for producing a module designed to be integrated i...
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WO/2021/190804A1 |
The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate. The method for a chemic...
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WO/2021/193863A1 |
A surface-treated copper foil for printed wiring boards according to the present invention has a surface-treated coating film which has a roughened layer comprising roughening particles formed on at least one surface of a copper foil bas...
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WO/2021/193781A1 |
Provided is a PCB terminal including a rod-like base material and a plating layer covering a predetermined region of the base material, wherein the base material is composed of a copper alloy containing more than 20 mass% of zinc, the pl...
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WO/2021/184114A1 |
An apparatus and system for in-situ electropolishing and/or for in-situ electroforming a structural or functional reinforcement layer such as a sleeve of a selected metallic material on the internal surfaces of metallic tubular conduits ...
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WO/2021/185914A1 |
The invention relates to a method for producing markings on galvanized steel strip or steel plate, wherein a metal salt solution, more particularly an inorganic metal salt solution, is applied to regions of the steel surface, and the ste...
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WO/2021/182240A1 |
Provided are a metal material and connection terminal that are resistant to sulfide blackening even with the surfacemost exposure of an Ag-Sn alloy layer. Also provided is a method for producing a metal material that is capable of produc...
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WO/2021/180375A1 |
The invention relates to an electrical contact part comprising a carrier substrate made from a metal material, a metal coating applied to the carrier substrate, and a coating blocker material applied to the carrier substrate in a sub-reg...
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WO/2021/180980A1 |
This invention relates to a method for passivating a tinplate strip after electrodepositing the tin layer or tin layers, or after an optional flow-melting of the electrodeposited tin layer or tin layers, and an apparatus for producing sa...
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WO/2021/181901A1 |
Provided are: a silver-plated material having superior fretting wear properties than ever before; and a method for manufacturing the silver-plated material. The silver-plated material is manufactured by forming a base plating layer 12 ma...
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WO/2021/177013A1 |
Provided are a filled microstructure and a conveyance method whereby damage during conveyance is inhibited and both ease of processing and filling defect prevention are achieved. The filled microstructure has: a first metal portion that ...
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WO/2021/177231A1 |
A Ni-plated steel sheet according to one embodiment of the present invention comprises a base steel sheet and a Ni-plated layer provided to a surface of the base steel sheet. The Ni-plated layer includes a Ni-Fe alloy layer formed on the...
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WO/2021/177035A1 |
A plating treatment device (1) according to one aspect of the present disclosure comprises a substrate holding part (10), a first electrode, a second electrode, and a voltage application part (30). The substrate holding part (10) holds a...
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