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WO/2022/101474A1 |
The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper a...
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WO/2022/099982A1 |
Provided in the present application are a circuit board soaking apparatus and circuit board processing equipment. The circuit board soaking apparatus comprises a soaking tank, a rotating mechanism, a clamping mechanism, and a vibrating m...
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WO/2022/097487A1 |
Provided is a simple metal film formation method for forming a metal film on a three-dimensional molded article, the metal film having high adhesion between a base material and a metal film, without requiring the formation of a surface-m...
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WO/2022/097486A1 |
Provided is a printed wiring board manufacturing method with which it is possible to obtain wiring having a rectangular cross-section shape that is favorable as a circuit wiring, said printed wiring board: not requiring the formation of ...
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WO/2022/097732A1 |
Provided is a steel sheet having excellent crack-resistance characteristic against resistance welding in a welded portion, even when crystal orientations of a Fe-based electroplating layer and a Si-containing cold-rolled steel sheet are ...
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WO/2022/097734A1 |
To provide an Fe-electroplated steel sheet having excellent resistance welding fracture resistance characteristics in a welded part when another sheet assembled therewith is a zinc-plated steel sheet. An Fe-electroplated steel sheet ha...
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WO/2022/097735A1 |
Provided is a zinc plated steel sheet that has excellent weld crack resistance in a welded area even when a high proportion of crystal orientations are unified between an Fe electroplating layer and a cold-rolled steel sheet at an interf...
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WO/2022/097733A1 |
Provided is a zinc alloy-plated steel sheet that exhibits excellent resistance to cracking in resistance welding in a weld, even in a case where, at an interface between an Fe-based electroplating layer and a cold rolled steel sheet, cry...
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WO/2022/097738A1 |
Provided is a Fe-based electroplated steel sheet having excellent chemical conversion treatability, or plating appearance when performing hot-dip galvanized plating, as well as having an excellent crack-resistant characteristic against r...
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WO/2022/097736A1 |
The present invention provides a steel sheet having a superior anti resistance-welding-cracking property at a welded section. Provided is a galvanized steel sheet including: a Si-containing cold-rolled steel sheet containing 0.1 to 3.0 m...
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WO/2022/088216A1 |
The present application provides a chemical nickel-plating process for a steel sheet, a phosphorus-nickel-plated steel sheet and a vapor chamber. The chemical nickel-plating process for a steel sheet comprises the following steps: provid...
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WO/2022/089232A1 |
Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper el...
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WO/2022/091529A1 |
Provided are a hot-pressed member, a steel sheet for hot-pressing, and methods for producing the hot-pressed member and the steel sheet. A hot-pressed member according to the present invention comprises: a solid solution phase in which Z...
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WO/2022/091480A1 |
The present invention addresses the problem of providing: a hot-pressed member having excellent post-coating corrosion resistance and resistance spot weldability; and a manufacturing method therefor. The present invention also addresses ...
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WO/2022/085412A1 |
The present invention provides a novel battery container which is obtained by welding plated steel sheets, which has sufficient long-term sealing characteristics, and in which a base-material metal of the plated steel sheets is prevented...
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WO/2022/085374A1 |
[Problem] The purpose of the present invention is to manufacture, at low cost with simple steps, a conductive film that suppresses lowering of solder wettability over time in cases such as when being stored for a long period of time. [So...
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WO/2022/085464A1 |
[Problem] The present invention addresses the problem of obtaining a conductive film in which the migration of copper into a gold layer is suppressed, discoloration of the gold layer over time is suppressed, and cracks in the gold layer ...
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WO/2022/082933A1 |
A production method for an ultrathin high-strength electronic copper foil, comprising the following steps: preparing an electrolyte, adding a mixed additive, manufacturing an isolation layer by using a copper foil having the thickness of...
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WO/2022/086891A1 |
Exemplary methods of electroplating may include delivering a current from a power supply through a plating bath of an electroplating chamber for a first period of time. The current delivered may be or include a pulsed current at a duty c...
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WO/2022/077614A1 |
A method for improving surface evenness of electroplated platinum and a polishing device used by the method. The method comprises the following steps: S1. performing drilling wave crest polishing; S2. performing visual inspection and det...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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WO/2022/081080A1 |
A wire comprising a silver-based wire core having a double-layer coating comprised of a 1 to 100 nm thick inner layer of palladium or nickel and an adjacent 1 to 250 nm thick outer layer of gold, wherein the wire exhibits at least one of...
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WO/2022/074221A1 |
The invention relates to a process for fabricating a 3D–NAND flash memory comprising a first step of electrodepositing an alloy of copper and of a dopant metal selected from manganese and zinc followed by a second step of annealing the...
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WO/2022/073575A1 |
The invention relates to an electrically conducting material (1) comprising a substrate (10) of copper or a copper alloy and a coating (2) of at least one layer (21, 22), wherein the coating (2) has an outermost layer (21) of which at le...
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WO/2022/065455A1 |
A structure comprises a conductive substrate and metal deposits disposed in an island configuration on the conductive substrate.
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WO/2022/057414A1 |
A composite machining method and device for an inner surface texture of a bush of a radial sliding bearing. The surface of a workpiece to be machined is machined by means of laser to obtain a micron-grade texture, the workpiece the surfa...
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WO/2022/054953A1 |
The present invention provides: a plated material which has low insertion force (low friction) and durability at high temperatures; and an electronic component. A plated material which is provided with: a base plating layer that is compo...
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WO/2022/054873A1 |
The present invention discloses a method for producing a wiring board, said method comprising: a step wherein the surface of a metal layer that is exposed in an opening is pretreated by being brought into contact with a pretreatment liqu...
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WO/2022/050001A1 |
The purpose of the present invention is to provide a copper foil, with which a wiring board capable of exhibiting both RF characteristics and a high peeling strength can be fabricated using a resin base material made of LCP. The copper f...
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WO/2022/041533A1 |
Disclosed in the present invention is a production method for a high heat-resistant electrodeposited copper foil, comprising the following steps: raw foil manufacturing, pickling and water washing, primary coarsening and water washing, s...
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WO/2022/044451A1 |
Provided is a shock absorber, and a manufacturing method thereof, in which trivalent chromium is used and in which both a high degree of hardness and low friction are achieved at a high level without utilizing hexavalent chromium that ca...
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WO/2022/037315A1 |
The present invention relates to the field of micro composite machining in special machining technology. Disclosed are a method and apparatus for laser electrochemical composite deposition using a rifling hollow rotating electrode. A las...
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WO/2022/036237A1 |
An electrochemical deposition system configured for electrochemical plating of a substrate includes a chamber, an electrode, a plating cup and a controller. The chamber holds a plating bath. The electrode is disposed in the plating bath....
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WO/2022/030644A1 |
[Problem] To provide: a copper-clad layered body which, when applied to a flexible circuit board, is capable of suppressing transmission loss and achieving good volume resistivity and high adhesion between a low-dielectric resin film and...
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WO/2022/032048A1 |
A process for producing a cube textured foil is described. The process includes providing a cube textured metal foil M. The process further includes electroplating an epitaxial layer of an alloy on the foil M, whereby the epitaxial layer...
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WO/2022/030645A1 |
[Problem] To provide a copper-clad laminate capable of simultaneously achieving good volume resistivity in an electroless copper plating layer of a low dielectric resin film and suppression of transmission loss when applied to a flexible...
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WO/2022/029392A1 |
The invention relates to a process for coating a substrate using a thermal barrier, comprising at least the following steps: – a step of creating a first roughness on the surface of the substrate by means of at least a chemical or elec...
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WO/2022/022967A1 |
The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate and a manufacturing method for a distribution system for a process fluid for a chemical and/or electr...
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WO/2022/020894A1 |
The present invention relates to a method for forming a multidimensional structure, comprising: providing an electrode and a substrate in a fluid, wherein the fluid comprises an electrolyte and a precursor agent dispersed therein; applyi...
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WO/2022/018896A1 |
This terminal material for connectors comprises: a substrate having at least a surface made of copper or a copper alloy; and a silver-nickel-potassium alloy plating layer formed on at least a portion of the substrate, wherein the silver-...
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WO/2022/019059A1 |
[Problem] To provide a sliding member comprising an overlay capable of realizing good fatigue resistance while preventing peeling between layers. [Solution] A sliding member comprising an overlay formed by a Bi-Sb alloy plating film, whe...
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WO/2022/018225A1 |
The invention relates to a method for producing a zinc coating optimized for coefficient of friction on a steel component. In order to provide such a method resulting in a coating having good corrosion protection properties, good adhesio...
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WO/2022/013387A1 |
This invention relates to a method for the electrodeposition of a functional or decorative chromium layer onto a metallic substrate in an electrodeposition process from a halide-ion free and boric acid free aqueous electrolyte solution a...
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WO/2022/014125A1 |
To provide a steel sheet dehydrogenation device, a system for manufacturing a steel sheet, and a method for manufacturing a steel sheet, whereby it is possible to manufacture a steel sheet having exceptional hydrogen embrittlement resist...
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WO/2022/012993A1 |
The present invention relates to an electrolyte and its use in a process for fabricating copper interconnects. The electrolyte of pH greater than 6.0 comprises copper ions, manganese or zinc ions, and ethylenediamine which complexes the ...
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WO/2022/014316A1 |
A plating electrode (100) comprises a nozzle (1) and a retaining part (2). The nozzle (1) includes a tip section (1e). The nozzle (1) is for supplying a plating solution (PS) through the tip section (1e). The retaining part (2) covers th...
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WO/2022/013354A1 |
A method of forming a multilayered zinc alloy coating comprises steps of providing a bath of an aqueous electrolyte including zinc and a second electrodepositable component in an electrolytic cell having an anode and a cathode; applying ...
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WO/2022/009675A1 |
A flexible printed wiring board according to an aspect of the present disclosure comprises a base film and a plurality of wires that are disposed on the surface of the base film, wherein each of the wires has an end surface along the lon...
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WO/2022/007505A1 |
Disclosed in the present invention is a cleaning method used for replacing phosphating for thermal diffusion electroplated wire, where a phosphorus-free cleaning solution is used to clean a steel wire, the phosphorus-free cleaning soluti...
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WO/2022/008439A1 |
The invention relates to process for manufacturing a thin and stable copper film on a porous aluminum oxide (PAO) film on an aluminum alloy substrate. Initially, anodization of the aluminum alloy substrate results in a regularly ordered ...
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