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Patent Searching and Data


Title:
PRODUCTION METHOD FOR HIGH HEAT-RESISTANT ELECTRODEPOSITED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2022/041533
Kind Code:
A1
Abstract:
Disclosed in the present invention is a production method for a high heat-resistant electrodeposited copper foil, comprising the following steps: raw foil manufacturing, pickling and water washing, primary coarsening and water washing, secondary coarsening and water washing, primary curing and water washing, secondary curing and water washing, heat-resistant treatment and water washing, anti-oxidation treatment and water washing, applying a silane coupling agent, and baking and winding. By means of the reasonable adjustment of electrolyte parameters and a mixed additive, the present invention generates an electrodeposited copper foil having certain roughness; and by means of the treatment of a special surface electroplating process, the high-temperature resistance of the copper foil is improved, and the binding force, chemical resistance, and high-temperature anti-oxidation performance of the copper foil and a PCB substrate at a high temperature are improved.

Inventors:
FAN YUANPENG (CN)
DONG CHAOLONG (CN)
Application Number:
PCT/CN2020/132526
Publication Date:
March 03, 2022
Filing Date:
November 28, 2020
Export Citation:
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Assignee:
JIUJIANG DEFU TECH CO LTD (CN)
International Classes:
C25D1/04; C25D3/38; C25D5/12; C25D7/06
Foreign References:
CN106011965A2016-10-12
CN103397342A2013-11-20
CN110093640A2019-08-06
CN1545570A2004-11-10
CN101981230A2011-02-23
CN111041530A2020-04-21
Attorney, Agent or Firm:
BEIJING SHENGFANZHIRONG INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
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