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WO/2021/101028A1 |
A method for manufacturing an electrode lead, according to an embodiment of the present invention for addressing an issue, comprises the steps of: manufacturing a first electrode lead and a second electrode lead, respectively; and formin...
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WO/2021/100212A1 |
A Ni-plated steel sheet according to one aspect of the present invention comprises a base steel sheet and a Ni-based coating layer arranged on a surface of the base steel sheet, wherein the distribution of the carbon concentration as obs...
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WO/2021/097988A1 |
Disclosed in the present invention is a manufacturing method for a hub type electroplating ultrathin diamond cutting disc, comprising the following steps of: forming a layer of insulating electrophoretic paint on a surface of an alloy sh...
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WO/2021/102415A1 |
Metastable alloys have recently emerged as high-performance catalysts, extending the toolbox of binary alloy materials that can be utilized to mediate electrocatalytic reactions. In particular, nanostructured metastable ordered intermeta...
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WO/2021/101909A1 |
An interconnect structure of a semiconductor device includes a conductive via and a barrier layer lining an interface between a dielectric layer and the conductive via. The barrier layer is selectively deposited along sidewalls of a rece...
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WO/2021/099389A1 |
The invention relates to a distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution system for chemical and/or electrolytic surface treatment of a substrate in a process flui...
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WO/2021/100211A1 |
An Ni-plated steel sheet according to one aspect of the present invention comprises a parent-material steel sheet, and an Ni-based coating layer arranged on the surface of the parent-material steel sheet, the Ni-plated steel sheet being ...
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WO/2021/091250A1 |
One embodiment of the present invention provides an electrolytic copper foil including a copper layer and having a weight deviation of 5% or less in the width direction calculated by following Equation 1, a tensile strength of 25 to 62 k...
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WO/2021/090229A1 |
There are described a process and plant for anodizing, preferably continuously, aluminium or aluminium alloy profiles by means of an electrolyte solution, wherein the plant comprises: - support means of the profiles, adapted to support t...
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WO/2021/084853A1 |
This metal material for a sliding contact has a substrate formed from copper or a copper alloy, and a Pd-containing layer that is formed as an outermost layer on at least one part of the substrate and that contains 95 mass% or more of Pd...
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WO/2021/081924A1 |
In one example, an electronic device housing may include a substrate, a micro-arc oxidation layer formed on a surface of the substrate, and an electroless plating layer formed on the micro-arc oxidation layer. Example electroless plating...
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WO/2021/083943A1 |
Method of manufacturing a single-side-contacted photovoltaic device (1), comprising the steps of: a) providing a photovoltaically-active substrate (3) defining a plurality of alternating hole collecting zones (3a) and electron collecting...
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WO/2021/079279A1 |
The present invention concerns a process for producing a zinc-plated steel substrate comprising the following steps: a. providing a plasma electrolytic apparatus comprising a liquid electrolyte, at least one steel substrate to be plated ...
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WO/2021/075221A1 |
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional el...
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WO/2021/075222A1 |
Provided is a chip component comprising a terminal electrode structure that can prevent both solder leaching and separation. A chip resistor 10 comprises: an insulation substrate 1 that has a resistive element 3, which is a functional el...
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WO/2021/070640A1 |
The purpose of the present invention is to provide: a high-strength steel sheet, which has a yield point elongation (YP-EL) of at least 1.0% and a tensile strength (TS) of at least 980 MPa and has excellent uniform ductility, bendability...
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WO/2021/071885A1 |
Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a subs...
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WO/2021/070639A1 |
The purpose of the present invention is to provide: a high-strength steel sheet having a yield elongation (YP-EL) of 1% or more and a tensile strength (TS) of 980 MPa or more, and also having excellent uniform ductility, bendability and ...
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WO/2021/066297A1 |
A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polycarbonate resin; about 5 parts by weight to about 55 parts by weight of a glycol-modified polyester resin having about 20 mol% to ab...
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WO/2021/065866A1 |
This terminal material has: a substrate in which at least the surface thereof is made of Cu or a Cu alloy; a Ni layer provided on the substrate and having a thickness of 0.1-1.0 µm; an Cu-Sn intermetallic compound layer provided on the ...
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WO/2021/067419A1 |
Undesired deposition of metals on a lipseal (lipseal plate-out) during electrodeposition of metals on semiconductor substrates is minimized or eliminated by minimizing or eliminating ionic current directed at a lipseal. For example, elec...
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WO/2021/058706A1 |
The present invention relates to methods for producing metal foam bodies in which metal-containing powders which may comprise aluminium and chromium or molybdenum are applied to metal foam bodies which may comprise nickel, cobalt, copper...
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WO/2021/054105A1 |
Provided is a pin terminal comprising a rod-shaped substrate and a plating layer covering a prescribed region of the substrate, wherein: the constituent material of the substrate is pure copper or a copper alloy; the plating layer compri...
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WO/2021/054106A1 |
This pin terminal comprises a rod-like base material and a plating layer that covers a predetermined region of the base material, wherein: a constituent material of the base material is pure copper or a copper alloy; the plating layer co...
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WO/2021/054107A1 |
This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or copper alloy; the plating layer ...
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WO/2021/054108A1 |
This pin terminal is provided with a rod-like substrate and a plating layer that covers a prescribed region of the substrate, wherein: the substrate is composed of a material that is either pure copper or a copper alloy; the plating laye...
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WO/2021/052182A1 |
An electroplated matte-tin product surface treatment method, capable of heating electroplated matte-tin on the surface of a product to form bright tin. The surface treatment method comprises: heating the surface of an electroplated matte...
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WO/2021/054109A1 |
This pin terminal comprises a stick-shaped substrate and a plated layer that covers a prescribed area of the substrate, wherein: the plated layer comprises a tin-based layer formed of a metal including tin; one end of the substrate inclu...
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WO/2021/048343A1 |
A device for a cell of an apparatus for wet processing of a planar workpiece, comprises a structure comprising first and second walls (13a, b). The workpiece is movable in a central plane (4) through a space (3) between the first and sec...
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WO/2021/049064A1 |
According to the present invention, a heterocyclic compound having a structure in which a benzene ring and a nitrogen-containing heterocycle are are fused through condensation is added to a sulfuric acid solution that contains, as an oxi...
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WO/2021/048184A1 |
The invention relates to the field of liquid phase synthesis of diamond or all other allotropic forms of carbon and more particularly to a method for liquid phase synthesis of carbonaceous films, according to which a voltage is applied, ...
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WO/2021/045346A1 |
According to various embodiments of the present invention, an electronic device may comprise: a housing comprising a first surface, a second surface, and a side surface surrounding the space between the first surface and the second surfa...
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WO/2021/041371A1 |
Disclosed is a copper coated stainless-steel hydrophobic mesh and a method for synthesizing the hydrophobic mesh. In the method, a stainless-steel mesh is sonicated in a solution of acetone and ethanol, and then electroplated in a copper...
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WO/2021/031507A1 |
A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrrate to form a polyamic acid (PAA) anchoring layer on a...
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WO/2021/028779A1 |
A process for forming and regenerating a copper cathode (1) for an electrochemical cell (10) for the production of industrial products, for example syngas, comprises an operating step of anodising a copper substrate (2) in a solution con...
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WO/2021/030313A1 |
The multi-layer metal article (10) includes a metal base (12) formed from a first metal and at least one interlayer (14) formed on an upper surface (18) of the metal base (12). The at least one interlayer (14) is formed from a second met...
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WO/2021/029254A1 |
Provided is a terminal material for connectors, the terminal material comprising a base material in which at least a surface layer is made from copper or a copper alloy, a nickel plating layer which covers the surface of the base materia...
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WO/2021/023778A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating a steel strip, in particular for the motor vehicle industry, comprising a coating based on zinc and/or a zinc alloy, by means of pulse techno...
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WO/2021/022800A1 |
A surface preparation method capable of preparing various nanowire structures, belonging to the technical field of surface treatment. In said method, a template-assisted electroplating method is used to form, by changing the hole spacing...
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WO/2021/023783A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...
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WO/2021/023789A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...
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WO/2021/025071A1 |
Provided is a copper alloy sheet in which a central part in the sheet thickness direction contains more than 2.0% (mass%; hereinafter the same) and not more than 32.5% of Zn, 0.1-0.9% of Sn, not less than 0.05% and less than 1.0% of Ni, ...
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WO/2021/024729A1 |
This chromium plated product is characterized by being provided with: a substrate; a lustrous nickel plated layer formed on the substrate; a titanium-containing nickel plated layer formed on the lustrous nickel plated layer; and a trival...
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WO/2021/023779A1 |
The present invention relates to a galvanic method and to a system for electrolytically coating an electrically conductive strip and/or an electrically conductive woven material that is in the form of a strip, preferably a metallic strip...
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WO/2021/019829A1 |
The present invention addresses the problem of providing: a hot-pressed member which has excellent post-coating corrosion resistance, particularly excellent post-coating corrosion resistance when a zirconium chemical conversion treatment...
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WO/2021/020002A1 |
Provided is a slide member having an overlay on a bearing alloy. The overlay has a thickness T and has a sliding surface and an interface with respect to the bearing alloy. The overlay includes an intermetallic compound and a matrix of B...
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WO/2021/020338A1 |
[Problem] To provide a roughened nickel-plated material in which the formation unevenness such as the unevenness of a roughened nickel plating layer and the formation of grooves is reduced. [Solution] A roughened nickel-plated material c...
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WO/2021/019907A1 |
Provided are: a composite plated material in which a composite plating film that comprises a composite material comprising a silver layer and carbon particles contained in the silver layer is formed on a base material, and in which the f...
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WO/2021/015783A1 |
The present disclosure is drawn to a multi-color electronic housing. The multi-color electronic housing can include a metal alloy having a first portion that can be milled, plasma-treated, and can include an electrodeposited colorant the...
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WO/2021/008635A2 |
Disclosed is an inductance device electrode preparation method, comprising: S1, surface insulation treatment, specifically: placing an inductance device in a obliquely rotating spray pot body, and using a fixed spray gun to perform therm...
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