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WO/2018/211951A1 |
Provided is a low-roughness roughened copper foil which is suitable for formation of a thin wire circuit, and which, when used in a SAP method, can impart, to a laminate, a surface profile that is excellent not only in etching property r...
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WO/2018/212174A1 |
Provided is a tin-plated copper terminal material having: a substrate of copper or copper alloy; an intermediate zinc layer of zinc alloy that is formed on top of the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer...
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WO/2018/211740A1 |
Provided is an aluminum plating film which consists chiefly of aluminum and which has, between coated surfaces at both ends in the thickness direction thereof, an interposition layer containing a metal that has a lower ionization tendenc...
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WO/2018/207786A1 |
An electrolytic copper foil having a glossy surface and a deposition surface. This electrolytic copper foil has a roughened layer on the glossy surface side thereof. The root mean square height Sq of the glossy surface is no more than 0....
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WO/2018/207788A1 |
An electrolytic copper foil having a surface treatment layer on the glossy surface side thereof. In this electrolytic copper foil, the root mean square height Sq of the surface of the surface treatment layer is no more than 0.550 µm and...
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WO/2018/207785A1 |
An electrolytic copper foil having a surface treatment layer on the glossy surface side thereof. In this electrolytic copper foil, the root mean square height Sq of the surface of the surface treatment layer is no more than 0.550 µm and...
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WO/2018/205307A1 |
The present invention provides a refractory metal or stainless steel having an electroplated layer on the surface thereof, comprising a substrate, and an electroplated layer formed on the surface of the substrate. The substrate comprises...
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WO/2018/203126A1 |
The present invention relates a method for the manufacture of a galvannealed steel sheet.
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WO/2018/203097A1 |
The present invention relates a method for the manufacture of a galvannealed steel sheet.
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WO/2018/198065A1 |
The present invention relates to a method for depositing a coating (1) of an item including a substrate (5) and, specifically, to a method for hardening a layer of gold forming a coating on the substrate, the method comprising the steps ...
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WO/2018/200990A1 |
Disclosed herein are articles having an edge that is partially, or entirely sealed with one or more coatings including a polymeric material. The article may include a coating selected so that one surface (e.g., a face surface) has a desi...
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WO/2018/199610A1 |
The present invention relates to a porous acupuncture needle and a manufacturing method therefor and, more specifically, to: a porous acupuncture needle plated with porous needle-integrated noble metal nanoparticles, obtained by manufact...
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WO/2018/198905A1 |
The purpose of the present invention is to eliminate adhesion defects caused by press joining of a copper foil with a resin, the copper foil subjected to a silane coupling treatment with an olefin-based silane coupling agent on a roughen...
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WO/2018/190202A1 |
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material (5) includes: a substrate (51) that includes one or mo...
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WO/2018/189901A1 |
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material 5 includes: a substrate 51 that includes one or more s...
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WO/2018/189916A1 |
This electroplating method includes: a stirring step in which a group of substrates (51) that have settled in an electrolytic solution in an electroplating tank (10) are made to flow in a circumferential direction along an inner wall (19...
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WO/2018/190839A1 |
The present subject matter relates to treating alloy substrates having oxidized layers. An anodized alloy substrate is contacted with an alkaline mixture including titanium to form a processed substrate. The anodized alloy substrate incl...
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WO/2018/190804A1 |
The present subject matter relates to polymer coating of a metal alloy substrate. The metal alloy substrate has an electrolytically deposited nano-ion polymer layer thereon. The nano-ion polymer layer is of a polyacrylic material or an e...
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WO/2018/185154A1 |
The present invention relates to a method for electrolytically depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps (a) providing an aqueous deposition bath with a pH in the range from ...
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WO/2018/180507A1 |
The present invention provides: a traverse coil of a copper or copper-alloy sheet that is unlikely to produce metallic powder as a result of friction with a tension pad; and a production method therefor. This copper or copper-alloy sheet...
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WO/2018/178390A1 |
The present invention relates to a method for increasing the corrosion resistance of a chrome‐plated substrate wherein at least one part of a chrome‐plated surface of a chrome-plated substrate is dipped into an electrolyte comprising...
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WO/2018/181399A1 |
This plated wire rod material (10) is provided with: a base material (1) that is formed of aluminum or an aluminum alloy; and a surface treatment film (2) that covers the base material (1) and comprises one or more metal layers. Among th...
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WO/2018/178022A1 |
The invention relates to a method for producing electrically conductive structures, preferably conducting track structures, by means of laser light on a non-conductive carrier material (LDS method), characterized in that a non-conductive...
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WO/2018/181950A1 |
Provided is a surface-treated metal plate provided with a metal plate and a nickel-cobalt binary alloy layer formed on the metal plate, wherein the nickel-cobalt binary alloy layer is provided with an oxide coating film having a thicknes...
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WO/2018/180868A1 |
In one aspect of this manufacturing method for an electronic component, a first metal layer is formed on a substrate, a second metal layer is formed on the first metal layer, a mask made of an organic resin layer is formed on the second ...
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WO/2018/179904A1 |
To provide a metalized film with which it is possible to form a flat and smooth thin copper film on a flat and smooth fluorine resin using a physical vapor deposition method and to ensure adhesion strength between the fluorine resin and ...
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WO/2018/181926A1 |
Provided is a metal oxide film-including alloy member with which it is possible to form a film with a simple method at low cost, and with which it is possible to suppress the volatilization of Cr, which causes degradation in fuel cells, ...
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WO/2018/181726A1 |
This surface-treated copper foil (11) has, at least on one surface of a copper foil substrate, a surface-treatment film including at least a roughened surface on which roughening particles (111) are formed. When a cross-section of the su...
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WO/2018/175975A1 |
Described herein are coated lift plungers, which have improved hardness, durability, and corrosion resistance, as well as methods of making, reworking, and using the same.
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WO/2018/171513A1 |
Disclosed are a barrel plating barrel, a barrel plating apparatus, a barrel plating system, and a barrel plating production line. Insofar as the barrel plating barrel is in a material-discharging state, workpieces being plated are paddle...
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WO/2018/173995A1 |
In order to provide a composite chrome plating film having excellent wear resistance and little aggression toward a mating material (sliding member), and a piston ring having the film, the present invention is configured so that hard par...
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WO/2018/166047A1 |
A method for electroplating a contact strip (100). The method comprises the following steps: dividing a contact strip (100) into a waste material region (A), a contact region (B), and a non-contact region (C) sequentially distributed fro...
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WO/2018/169250A1 |
A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30µm or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer porti...
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WO/2018/168129A1 |
According to the present invention, plating is formed on one side of a negative electrode by: coating the one side of the negative electrode with a paste formed by mixing particles in a plating liquid; disposing, on one side of a positiv...
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WO/2018/169746A1 |
Layer-by-layer thickness control of an electroplated film can be achieved by using a cyclic deposition process. The cyclic process involves forming a layer (or partial layer) of hydrogen on a surface of the substrate, then displacing the...
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WO/2018/163541A1 |
The wire rod for an oblique-coil spring according to the present invention is provided with a core wire comprising steel having a pearlite structure, a copper plating layer comprising copper or a copper alloy covering the outer circumfer...
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WO/2018/165329A1 |
Methods and apparatus for electroplating substrates are described herein. In some cases, an ionically resistive element is positioned near the substrate, creating a cross flow manifold between the ionically resistive element and the subs...
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WO/2018/164491A1 |
The present invention relates to a 3D printing device using selective electrochemical deposition, which can increase the rate of 3D printing of a metal product to be laminated on a substrate, by selectively electrodepositing a metal raw ...
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WO/2018/164127A1 |
[Problem] To provide corrosion-resistant terminal material with which galvanic corrosion does not arise easily by using copper or a copper alloy base material as a terminal to which an end of wire having an aluminum core wire is crimped,...
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WO/2018/159760A1 |
A surface-treated steel sheet according to one embodiment of the present invention comprises a steel sheet base material and a plating layer; and the plating layer comprises an Ni-Co alloy plating layer, an Ni-Fe alloy layer and an Ni la...
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WO/2018/153755A1 |
The invention relates to a method for coating a steel sheet or steel strip to which an aluminium-based coating is applied in a dip-coating process and the surface of the coating is freed of a naturally occurring aluminium oxide layer. In...
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WO/2018/066007A9 |
The present invention concerns a method to obtain the coloration on an object, the method comprising a processing phase of the object by galvanic deposition and a following phase of heat treatment which foresees the heating of the object...
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WO/2018/151389A1 |
The present invention relates to a polymer-metal catalyst hybrid material for water oxidation catalytic reaction, and a preparation method therefor and, more specifically, provides: a polymer-metal catalyst hybrid material capable of pro...
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WO/2018/150641A1 |
Provided is a metallic material for an electronic component, said metallic material having low adhesive wear properties. A metallic material for an electronic component comprises: a substrate; a lower layer constituted by one or more ele...
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WO/2018/142955A1 |
The electrolytic treatment device (1, 1A) pertaining to an embodiment of the present invention performs electrolytic treatment of a treatment substrate, and is provided with a substrate retaining part (10) and an electrolytic treatment p...
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WO/2018/142430A1 |
The present invention refers to a galvanic deposition process for obtaining the deposit of ruthenium and/or of its alloys, on an object in order to obtain final ruthenium layers with particular colorations, otherwise not obtainable with ...
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WO/2018/139628A1 |
Provided is: a terminal material for a connector terminal, which uses a copper or copper alloy substrate and is free from the occurrence of electrical corrosion, said connector terminal being crimped to an end of an electric wire that is...
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WO/2018/140750A1 |
Disclosed herein are a system and method for electroplating an alpha emitting radionuclide, such as an actinide, for use in alpha spectroscopy. The electrodeposition system for electroplating an alpha emitting radionuclide can include an...
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WO/2018/139615A1 |
Provided is a plated steel wire that has, on the surface of a steel wire, a coating film layer containing Zn and at least any element selected from the element group consisting of Co, Cr, Cu, Ni, P, Sn, Mn, and Fe. The content in the coa...
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WO/2018/138928A1 |
Provided is a surface-treated plated material, in which formation of whiskers is suppressed, which maintains good solderability and low contact resistance even when exposed to high temperature environments, and for which the insertion fo...
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