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WO/2021/171551A1 |
An object with a metal film is provided with a substrate containing a resin or a glass, a metal film covering at least part of the substrate, a first layer that is between the substrate and the metal film and contains an oxide of a metal...
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WO/2021/171818A1 |
The present invention provides: a silver-plated material which has higher hardness than ever before, while having excellent wear resistance; and a method for producing this silver-plated material. A method for producing a silver-plated m...
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WO/2021/171808A1 |
Provided are: a metal-filled microstructure that suppresses defects in the filling of a plurality of pores with metal as well as defects in the structure of conductors formed from the metal; a production method for the metal-filled micro...
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WO/2021/170851A1 |
The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a subst...
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WO/2021/170460A1 |
The invention relates to a piston ring having a main body. The main body has an inner peripheral surface, a first flank surface, a second flank surface and an outer peripheral surface. A first hard chromium layer having a network of crac...
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WO/2021/170861A1 |
The invention relates to a method of conditioning the surface of a steel strip coated with an electrolytically deposited zinc alloy anticorrosion layer, which is subjected to an increase in temperature to alter the steel microstructure, ...
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WO/2021/166467A1 |
Provided are: a metal body for which whisker generation as a result of being subjected to external stress is suppressed, and which can be easily manufactured; a fitting-type connection terminal; and a metal body formation method. This me...
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WO/2021/166581A1 |
A terminal material for a connector, the terminal material comprising a substrate in which at least a surface layer thereof comprises copper or a copper alloy, a nickel plating layer that comprises nickel or a nickel alloy and is formed ...
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WO/2021/164474A1 |
Provided are a coating conductive device, a coating system and a coating method for a conductive film (50), belonging to the technical field of preparation of conductive thin films. The coating conductive device is used for electrically ...
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WO/2021/157504A1 |
A plating method according to one embodiment of the present invention includes a substrate holding step, a first supply step, a second supply step and a voltage applying step. The substrate holding step is for holding a substrate. The fi...
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WO/2021/158402A1 |
Methods, inks, apparatus, and systems for forming metal features on semiconductor substrates are provided herein. Advantageously, the techniques herein do not require the use of photoresist, and can be accomplished without many of the pr...
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WO/2021/157362A1 |
Provided is a roughened copper foil which can achieve both of excellent etching properties and high share strength in the processing of a copper clad laminate plate or the manufacture of a printed wiring board. The roughened copper foil ...
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WO/2021/153160A1 |
One mode of this tin or tin alloy electroplating solution contains: a soluble salt (A) including at least a first tin salt; one or more compounds (B) selected from the group consisting of organic acids, inorganic acids, and salts thereof...
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WO/2021/151652A1 |
The invention relates to sheet metal packaging products, in particular tinplate or electrolytically chrome-plated sheet steel (ECCS), consisting of a sheet steel substrate (S) with a thickness in the region of 0.1 mm to 0.6 mm and a coat...
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WO/2021/154240A1 |
The present disclosure relates to a coating of a press hardened steel strip, the coating providing cathodic protection. The coating of the post-press hardened steel strip comprises zinc, aluminum, and at least one element selected from m...
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WO/2021/153112A1 |
Provided is a method for manufacturing a metal-filled microstructure in which metal filling defects in a plurality of pores are suppressed when the metal is filled in the plurality of pores. The method for manufacturing a metal-filled mi...
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WO/2021/149821A1 |
Provided is a roughened nickel-plated sheet that has, as the surfacemost layer on at least one side of a metal substrate, a roughened nickel layer formed from a plurality of nickel projections. In observation using a focused ion beam mil...
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WO/2021/149725A1 |
Provided is a stainless steel material which contains Cu that is an antibacterial component, has excellent antibacterial properties and excellent antiviral properties, and has a color tone of a stainless steel.　The present invention is...
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WO/2021/150849A1 |
A decorative component includes a plateable resin body portion that is light- transmissive. A thin intermediate layer of material is electrolessly deposited over the body portion. The intermediate layer is laser ablated to selectively re...
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WO/2021/144375A1 |
The invention relates to a method for etching or dissolving a hard material coating on a base body, characterised in that the hard material coating is treated in an aqueous solution. The aqueous solution comprises ferrate and a strong base.
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WO/2021/144481A1 |
The present invention relates to a method for platinum-plating titanium lugs, which comprises steps of pre-treating the surface of the titanium lug before a step of electrodepositing the platinum, and to an electrochemical cell in which ...
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WO/2021/142357A1 |
A method of electroplating metal into features of a partially fabricated electronic device on a substrate having high open area portions is provided. The method includes initiating a bulk electrofill phase with a pulse at a high level of...
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WO/2021/140855A1 |
Provided is a flexible printed circuit board comprising a base film that has a hole for forming a through hole and further comprising a coil shaped circuit layer that is laminated on at least one surface side of the base film, wherein: t...
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WO/2021/142187A1 |
A system for printing metal interconnects on a substrate includes an anode substrate. A plurality of anodes are arranged on one side of the anode substrate with a first predetermined gap between adjacent ones of the plurality of anodes. ...
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WO/2021/140688A1 |
Provided are: composite plated materials in which a composite plating layer formed from a composite material in which carbon particles are contained within an Ag layer is formed on a base material, the composite plated material being suc...
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WO/2021/134794A1 |
An array substrate, a manufacturing method therefor, and a backlight module. Before electroplating a first metal layer (15) on a pattern of a seed layer (11), the method further comprises: forming, on a side of a base substrate (10) havi...
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WO/2021/131359A1 |
In order to avoid damage to an electronic component caused by corrosion, there are provided a surface-treated copper foil and a method for manufacturing the same, the surface-treated copper foil being such that it is possible to maintain...
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WO/2021/132191A1 |
The purpose of the present invention is to provide a novel composite copper member which is treated with a silane coupling agent. This composite copper member comprises a layer, which contains needle-like copper oxide, in at least a part...
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WO/2021/133455A2 |
A process of enhancing surface adhesion of polyetherimides for metal plating includes contacting sulfuric acid with a surface of a polyetherimide substrate for a first dwell time to form a pre-etched polyetherimide substrate, contacting ...
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WO/2021/125635A1 |
The present invention provides an electrogalvanized steel sheet and a method for manufacturing same, the electrogalvanized steel sheet having superb whiteness, and an attractive exterior surface due to reduction in surface scales.
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WO/2021/125525A1 |
The present invention relates to a cold-rolled steel sheet comprising: a base steel sheet; and a nickel or nickel alloy coating layer formed on the base steel sheet, wherein the adhesion amount of the nickel or nickel alloy is 50mg/m 2 o...
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WO/2021/125410A1 |
Disclosed are: a surface-treated copper foil for a secondary battery negative electrode collector; a method for producing same; and a negative electrode for a secondary battery including same, wherein needle-shaped copper particles havin...
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WO/2021/123312A1 |
This invention relates to a method for manufacturing a laminated tinplate for packaging applications, the laminated tinplate comprising a tinplate sheet and a thermoplastic laminate layer that covers at least one side of the tinplate ste...
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WO/2021/125959A1 |
Process of electroforming a metal structure, in particular a structure with a tip protruding from adjacent outer layers. The process comprises the following steps; - a first layer is deposited on a substrate followed by one or more next ...
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WO/2021/124510A1 |
[Problem] To provide a Sn-plated steel sheet that makes it possible to obtain excellent yellowing resistance, coating film adhesion, and sulphide blackening resistance without performing conventional chromate treatment. [Solution] This S...
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WO/2021/116318A1 |
The invention allows the phosphating of flat steel products to be carried out within a short time in the production of flat steel products that are provided with a Zn-based protective layer. For this purpose, according to the invention a...
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WO/2021/115261A1 |
A method for surface metallization of an oscillator and a metallized oscillator. The method comprises: using an acid copper process to electroplate copper on a nickel layer in an electroplating zone of an oscillator body so as to form a ...
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WO/2021/117339A1 |
A surface-treated copper foil comprising a copper foil and a surface treatment layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the load area ratio SMr2 that separates a protruding valley and t...
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WO/2021/117338A1 |
This surface-treated copper foil comprises: a copper foil; and a surface-treatment layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the load area ratio SMr1 that divides a protruding peak porti...
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WO/2021/117698A1 |
Provided is a copper alloy sheet in which surface discoloration or an increase in contact electric resistance is suppressed, and the copper alloy sheet has excellent plating film adhesion, by a configuration in which the center Mg concen...
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WO/2021/118972A1 |
An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH a...
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WO/2021/110872A1 |
A tape for manufacturing an electrical circuit with electrical contact pads, comprising: - a flexible dielectric substrate (4), - a copper foil (10) covering at least partially the dielectric substrate (4), the copper foil (10) having an...
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WO/2021/107161A1 |
A nickel-plated steel plate according to an embodiment of the present invention comprises a base material steel plate and a nickel-plated layer provided to a surface of the base material steel plate, and the ratio of tin content to nicke...
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WO/2021/107397A1 |
The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method for manufacturing the carrier foil-attached metal foil, and a laminate for forming a prin...
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WO/2021/108466A1 |
An electroplating cup assembly comprises a cup bottom, a lip seal, and an electrical contact structure. The cup bottom at least partially defines an opening configured to allow exposure of a wafer positioned in the cup assembly to an ele...
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WO/2021/107100A1 |
This method of manufacturing a plated member comprises a plating step for plating a member to be plated while jetting and stirring the member together with an electrolytic solution from a bottom part to the upper side, inside a basket of...
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WO/2021/104911A1 |
The present disclosure relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a device for chemical and/or electrolytic surface treatment of a substrate in a process fluid,...
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WO/2021/106920A1 |
A method for suppressing a biofilm, said method being characterized by irradiating ultrasonic waves having a frequency of from 20 kHz to 100 kHz within a plating tank, a recovery tank and a water washing tank, which are used for a wet pl...
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WO/2021/101676A1 |
A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monol...
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WO/2021/101177A1 |
Provided in one embodiment of the present invention is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 ...
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