Title:
PLATING APPARATUS FOR MANUFACTURING INTEGRATED CIRCUIT CHIP, PLATING METHOD FOR MANUFACTURING INTEGRATED CIRCUIT CHIP, AND INTEGRATED CIRCUIT CHIP MANUFACTURING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/085554
Kind Code:
A1
Abstract:
Disclosed are a plating apparatus for manufacturing an integrated circuit (IC) chip, a plating method for manufacturing an IC chip, and an IC chip manufacturing method using same. The disclosed plating apparatus for manufacturing an IC chip may comprise: a first plating part which comprises at least one first drum; a second plating part which is disposed so as to be spaced apart from the first plating part, and comprises at least one second drum; and a flexible belt which moves past the first and second drums, over and under, and on which a plurality of IC chip element parts are arranged.
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Inventors:
KANG TAEHYUK (KR)
Application Number:
PCT/KR2023/015903
Publication Date:
April 25, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
AGENCOMM CO LTD (KR)
International Classes:
H01L23/00; C25D5/12; C25D7/00; H01L23/498
Foreign References:
| KR20140064437A | 2014-05-28 | |||
| KR20110126386A | 2011-11-23 | |||
| KR101665103B1 | 2016-10-24 | |||
| KR20120005855A | 2012-01-17 | |||
| KR102528357B1 | 2023-05-03 |
Attorney, Agent or Firm:
YOUNGBEE INTELLECTUAL PROPERTY (KR)
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