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WO/2024/095685A1 |
A cooling module according to the present invention includes: a substrate on which a driver for energizing an auxiliary machine installed on a vehicle is mounted; and a module housing for holding the substrate. The module housing has a f...
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WO/2024/093214A1 |
The present application belongs to the field of communication equipment and discloses a chip heat dissipation assembly and an electronic device. The chip heat dissipation assembly comprises: a circuit board, a chip assembly, a supporting...
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WO/2024/093433A1 |
A wireless charging base (100) and a wireless charging system, which relate to the technical field of charging devices, and aim to solve the problem of how to achieve heat dissipation of an electric device (200) during charging to ensure...
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WO/2024/095653A1 |
[Problem] To achieve both simplification of a device and high cooling efficiency of insulating oil that has received heat. [Solution] This cooling device cools a power semiconductor apparatus. The cooling device includes: a tank which ac...
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WO/2024/097055A1 |
Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at le...
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WO/2024/093695A1 |
A liquid-cooling heat dissipation module embedded with a three-dimensional vapor chamber element, the module comprising a three-dimensional vapor chamber element and a semi-open shell, wherein the three-dimensional vapor chamber element ...
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WO/2024/096302A1 |
An inverter unit that drives a compressor motor comprises, in order for a plurality of inverter elements installed on a seating surface of an inverter housing to be individually fixed to the seating surface, an insulating member which is...
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WO/2024/094807A1 |
The invention relates to a cooling device (1) which comprises at least one central electronics unit (2), which comprises at least two active units (3-8) arranged at a distance from the central electronics unit (2) and which comprises at ...
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WO/2024/093168A1 |
The present application provides a directional temperature control intelligent cabinet and a micro data center. The intelligent cabinet comprises an integrated cabinet and a plurality of IT cabinets, wherein the bottom of the integrated ...
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WO/2024/093689A1 |
A three-dimensional vapor chamber element and a manufacturing method therefor. The three-dimensional vapor chamber element comprises an upper cover, a lower cover, a porous capillary structure, and a working fluid; the upper cover compri...
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WO/2024/093506A1 |
An enclosure (100) and an electronic device (1000), which are used for reducing the effect of the environment on the temperature of the electronic device (1000), and improving the thermal experience of electronic products and the use exp...
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WO/2024/094026A1 |
A heat dissipation system and an electronic device. The heat dissipation system comprises: a mounting box (31), the mounting box (31) being used for accommodating a circuit board of a circuit board assembly; and a fan assembly (41), comp...
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WO/2024/093228A1 |
Disclosed in the present invention are an energy storage system and a thermal management apparatus thereof. The thermal management apparatus of the energy storage system comprises: at least one heat exchange module, and a cooling module,...
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WO/2024/093169A1 |
Provided in the present application are an intelligent cabinet and a micro data center. The intelligent cabinet comprises a main cabinet body composed of a frame assembly and a support assembly, wherein a mounting space is formed inside ...
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WO/2024/094299A1 |
Embodiments described herein relate to methods and apparatus for monitoring flow devices. In one aspect there is provided a method comprising driving a first said airflow device (120a) at a predetermined level to generate an airflow (425...
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WO/2024/092973A1 |
A heat transfer apparatus (400) and an electronic device. The electronic device comprises a rotary shaft mechanism (200), and a first main body (110) and a second main body (120) which are connected to each other in a rotational manner b...
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WO/2024/092617A1 |
A heat exchange apparatus(100) and a method for manufacturing the heat exchange apparatus(100). The heat exchange apparatus(100) comprises a first heat conducting member(101) having a first side(1011) and a second side(1012) opposite to ...
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WO/2024/093243A1 |
The present application provides an electronic assembly and a terminal device. The electronic assembly comprises: a first component; a second component, an accommodating space being formed between the second component and the first compo...
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WO/2024/090444A1 |
An information processing device according to the present disclosure comprises: an information acquisition unit which can acquire a plurality of pieces of information related to a vehicle; an inference unit which calculates index values ...
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WO/2023/226608A9 |
Provided in an embodiment of the present application is an electronic device, comprising at least a shell and a first display. The shell comprises a first frame body, a second frame body, and a hinge. The hinge is connected to the first ...
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WO/2024/090236A1 |
The present invention is a heat transfer member which is applied to a cooling device (100), which cools an object-to-be-cooled (70) in a state of being immersed in a liquid refrigerant and promotes heat transfer to the refrigerant from t...
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WO/2024/090334A1 |
This projection display device (100) comprises a reflective liquid crystal display element (1), a heat sink (2), a heat generation source (3), and a cooling fan (5). In at least one direction among the long side direction and the short s...
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WO/2024/091980A1 |
A cold plate assembly includes a thermally conductive cold plate having a first surface attachable to a heat generating electronic component of an information processing system. An opposite second surface includes an array of hollow rise...
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WO/2024/091605A1 |
A method and apparatus for an evaporator assembly are provided. The evaporator assembly includes an evaporator body, a coating basin, and a porous media. The evaporator body includes an evaporator sidewall, an evaporator volume defined b...
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WO/2024/090390A1 |
This information processing device comprises: a first processor for outputting point information obtained by capturing an imaged object as a point, from an image of the object imaged using a first camera; and a second processor for outpu...
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WO/2024/087284A1 |
The present invention relates to the technical field of cable trays. Specifically, disclosed is a dustproof cable tray, comprising first partition plates. Fixing backets are fixedly connected to two ends of the lower surface of each firs...
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WO/2024/089674A1 |
A cooling device for a solid-state electronics component is provided for electronics one or more electronics components that heats during The cooling device includes a chamber having a first region defining a pool with a heat conducting ...
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WO/2024/087148A1 |
A hybrid cooling unit and a cooling mechanism. The hybrid cooling unit comprises a heat dissipation housing (1), a mounting housing (2), and a phase change material (3). The heat dissipation housing (1) has a recessed-protruding shape; a...
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WO/2024/087606A1 |
A noise reduction apparatus and a communication device. The noise reduction apparatus comprises: a support frame (100), which has an air inlet and an air outlet; a first noise reduction module (200), which is arranged at the air inlet of...
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WO/2024/088250A1 |
A heat dissipation apparatus (1), an electronic device (2), and an electric device (3). The heat dissipation apparatus (1) comprises a liquid cooling plate (11) and heat exchange fins (12). The liquid cooling plate (11) is provided with ...
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WO/2024/091967A1 |
A cold plate assembly has a cold plate that is resistant to corrosion and particulate fouling, allowing direct use of facility-grade cooling liquid and omission of a secondary coolant loop that uses a purified liquid coolant. The cold pl...
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WO/2024/090328A1 |
This information processing device comprises: a first processor that outputs point information which is obtained by capturing, from an image of an object imaged by a first camera, the imaged object as points; a second processor that outp...
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WO/2024/090931A1 |
The present invention relates to a turbo compressor comprising: a motor having a rotary shaft, with one end portion coupled to an impeller, in order to rotate the impeller; a cooling-air path through which cooling gas accommodated therei...
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WO/2024/089552A1 |
An optical system includes a sealed enclosure partially filled with hot coolant defining a headspace above the coolant, a first optical connector disposed in the headspace, and a temperature regulating system. The first optical connector...
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WO/2024/090878A1 |
The present invention relates to a composite heat dissipation hybrid TIM sheet which is disposed between a heat sink and a heat source and composed of a heat-conductive sheet in which an auxiliary layer comprising a TIM layer or a heat-d...
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WO/2024/091481A1 |
Embodiments of the present invention provide a cooling module for cooling heatgenerating electronic devices in an immersion cooling system. The cooling module includes an integrated pump, which draws immersion fluid from the surrounding ...
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WO/2024/090389A1 |
This cooling execution device comprises: an acquiring unit for acquiring a detection result obtained by detecting an object relating to operation of a control device which is mounted in a vehicle and which controls automated driving of t...
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WO/2024/091859A1 |
The present disclosure provides systems and method for cooling a heat source. The system may include a container and a heat exchanger. The heat exchanger may be a liquid-liquid heat exchanger configured to remove heat from a liquid conta...
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WO/2024/088702A1 |
Disclosed is a heat sink (1) for cooling an electrical and/or electronic assembly (4), in particular for electric vehicles or hybrid vehicles, the heat sink having a support surface (32) for supporting the electrical and/or electronic as...
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WO/2024/090719A1 |
The electronic device may comprise: a first structure having a first fastening structure; a second structure disposed on the top of the first structure and having a second fastening structure; a third structure disposed on the top of the...
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WO/2024/089145A1 |
The invention relates to a cooler (KL) for coupling a power electronics module (LM), having: - a first cooler part (KT1) and a second cooler part (KT2) which together circumferentially enclose a cooling channel (KK) for conducting a cool...
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WO/2024/084388A1 |
Methods and systems for cooling conditioned spaces (e.g., data centers) are provided. The cooling system includes a radiative cooling component disposed outside of the housing and including a radiative cooling surface configured to provi...
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WO/2024/085324A1 |
The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat d...
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WO/2024/085958A1 |
A cooling system may include a tank filled with a first cooling fluid. The cooling system may include a container including a chamber, the chamber receiving a heat-generating component, the container being sealed, the container being at ...
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WO/2024/083749A1 |
The invention relates to a housing (10) for an electronic power device (1) of an electric powertrain, for example for an inverter, the housing (1) comprising a body (13) including a bottom (11) and a set of peripheral walls (12) which de...
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WO/2024/086772A1 |
Systems, methods, and devices are provided for extended thermal transfer from a heat plane. Consistent with this disclosure, a device can include at least one cooling device configured to transfer heat to a fluid, where the cooling devic...
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WO/2024/082915A1 |
Provided in the present application is a heat dissipation device, comprising an evaporator and a condenser. The evaporator comprises a casing and a partition plate; the casing is provided with a sealed inner chamber; the partition plate ...
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WO/2024/085051A1 |
A heat dissipation substrate comprising: a base body that contains a carbon material; a cover member that is positioned on the outer surface of the base body; and a pipe mounting part that is a groove or a through hole positioned across ...
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WO/2024/082678A1 |
A small-size double-redundancy electric power steering motor controller structure, comprising a sealing cover cap, a ventilation valve, a connector, a power joint connector, a bendable PCBA board, screws, a stud screw, a magnet, a radiat...
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WO/2024/085103A1 |
This radiation cooling structure is provided with a reflective layer (13) and a transparent protective layer (14) provided on the reflective layer. A relief surface (16) configured by providing a large number of protrusions (15) differen...
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