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Patent Searching and Data


Matches 201 - 250 out of 100,538

Document Document Title
WO/2024/058464A1
An electronic device according to an embodiment comprises a layer comprising a display including a first display area, a second display area, and a third display area located between the first display area and the second display area, a ...  
WO/2024/058191A1
An electrical junction box (100) is equipped with a housing in which a plurality of bus bars (10) are housed and dissipates heat from the bus bars (10) to the outside via the housing. The electrical junction box (100) comprises: a first ...  
WO/2024/054082A1
The present invention relates to a heat dissipation apparatus for an electronic device. In particular, the heat dissipation apparatus comprises: a heat conduction panel body having formed therein a refrigerant flow space in which, while ...  
WO/2024/051332A1
A vapor chamber (100), an electronic device and a chip packaging structure. The vapor chamber (100) comprises a housing (1), wherein a cavity (11) is formed in the housing (1); a cooling liquid is accommodated in the cavity (11); the hou...  
WO/2024/050793A1
The present application provides a power unit, a heat dissipation circulation system, and a device movable in a water body. The power unit comprises a motor, a driver, an internal circulation assembly, and an external circulation assembl...  
WO/2024/054116A1
A system (100) for cooling at least one computing device using water, the system (100) comprising: a body of water (400) defining a first waterline (401); a structure (300) at least partially submerged in the body of water (400) and comp...  
WO/2024/052473A1
According to an embodiment a method is disclosed for designing a heat sink (500- 508) comprising a container with means to guide a coolant from an inlet (100) to an outlet (200) designed to exchange heat with a component comprising the s...  
WO/2024/053837A1
An electronic device according to an embodiment may comprise: a substrate; a first integrated circuit connected to the substrate; a second integrated circuit connected to the substrate via the first integrated circuit and arranged over o...  
WO/2024/051230A1
Embodiments of the present application provide a server and a cabinet server. The server comprises at least one mainboard, at least one adapter board, at least one processor, and at least one memory board. The adapter board and the proce...  
WO/2024/053911A1
An electronic device according to an embodiment comprises: a hinge structure which includes a first hinge plate, a second hinge plate rotatable with respect to the first hinge plate, and a third hinge plate separated from the second hing...  
WO/2024/050646A1
A cooling arrangement for a wireless power transfer system comprising a transmitter and a receiver for receiving electrical power from a transmitter is provided. The cooling arrangement comprises a housing arrangement for enclosing a rec...  
WO/2024/054117A1
A container (100) for housing a first data centre (200) and connecting to a heat exchanger (400) in use, the container (100) comprising: an outer shell (100') defining an inside (100'') of the container (100) and an outside (100''') of t...  
WO/2024/051092A1
Provided are a power apparatus, a heat dissipation circulation system, and a water-area movable equipment. The power apparatus comprises a motor, a driver, an inner circulation assembly, and an outer circulation assembly. The motor is us...  
WO/2024/053246A1
This control device comprises: a plurality of circuit boards; a plurality of heat-conducting sections connected with the plurality of circuit boards; and at least one cooling section that is arranged on one end side of the plurality of c...  
WO/2024/052044A1
A power module (100) comprising a semiconductor module component (10) and an alignment part (20) is provided, wherein the alignment part (20) is fixed on a lateral top surface (10T) of the semiconductor module component (10) and comprise...  
WO/2024/053737A1
A server cooling system according to the present invention includes: a rack; a plurality of servers accommodated in the rack so as to be arranged in a vertical direction and each having a heat generating element; and a cooling device cap...  
WO/2024/045743A1
Disclosed in the embodiments of the present application are a heat sink and an electronic device. The disclosed heat sink comprises a base, a condensation portion and an isolation portion, wherein the base is provided with an evaporation...  
WO/2024/047810A1
The purpose of the present invention is to reliably take countermeasures against heat for electronic components mounted on a plurality of circuit boards provided to an electronic control device. An electronic control device 100 comprises...  
WO/2024/046338A1
A screen support structure (100) and a manufacturing method therefor, a display assembly (200), and an electronic device (500). The screen support structure (100) comprises a base material layer (10), an electrically conductive layer (30...  
WO/2024/047564A1
A device for thermal management is described. The device includes an insulation layer that contains aerogels and binder. The first insulation layer may have a shape of a sheet or a strip. In some configurations, the device also includes ...  
WO/2024/047565A1
A device includes an enclosure for one or more electronic devices. The enclosure includes an insulation layer that includes aerogels and binder. The insulation layer may have a thermal conductivity of less than 30 mW / m·K at 25°C.  
WO/2024/046633A1
The invention relates to a filter assembly (40) of an electronic assembly (50), comprising a first busbar (1), a second busbar (2), and a capacitor (3), wherein the capacitor (3) is directly connected to each of the two busbars (1, 2) by...  
WO/2024/047044A1
A housing (1) for an electronic device comprises an outer housing part (20), a carrier element (10) that is received in the outer housing part (20) and is designed to support the electronic device (90), and a spring element (14) that is ...  
WO/2024/048319A1
Provided is a light-radiating device that can efficiently cool a light source and can be arranged near a peripheral device. A light-radiating device according to the present invention radiates light that has a prescribed line width in ...  
WO/2024/047809A1
The purpose of the present invention is to comprehensively perform a noise countermeasure even for electronic components mounted to any of a plurality of circuit boards provided in an electronic control device. This electronic control de...  
WO/2024/048902A1
An electronic device is provided. The electronic device may comprise a printed circuit board (PCB) including a first surface and a second surface opposite to the first surface. The electronic device may comprise a processor on the second...  
WO/2024/044843A1
A cover for video processing equipment may include one or more integrated displays. A rack-mount chassis for such equipment may be mountable to an equipment rack, and be designed to accommodate video cards that support processing of vide...  
WO/2024/050175A1
A cooler for power electronics comprises: first mounting surfaces for first power electronics modules, respectively; second mounting surfaces for second power electronics modules, respectively, each of the first mounting surfaces being p...  
WO/2024/046165A1
An air conditioning device, which relates to the technical field of air conditioners, and is used for solving the technical problems of failure of and damage to an electronic element easily caused by condensation which is generated by me...  
WO/2024/048358A1
This laminate comprises: a first base material; a heat transfer particle-containing layer that is disposed on the first base material, and contains heat transfer particles; and a second base material that is disposed on the heat transfer...  
WO/2024/047252A1
The present invention relates to a cooling device (1) for cooling at least one computer server for a data center, the device (1) comprising: - a phase change material (5) configured to exchange heat with at least one of the components of...  
WO/2024/046439A1
The present application relates to the technical field of photoelectric modules. Disclosed are a heat dissipation architecture of a photoelectric module and an electronic device. The heat dissipation architecture comprises: an electrical...  
WO/2024/045297A1
The present application discloses a unitary air conditioner. The unitary air conditioner comprises a housing, a first heat exchanger, a first fan and an electric control device; the housing is provided with an outdoor air outlet and an o...  
WO/2024/048742A1
A seal structure for a housing with an opening for introduction of a cable, the seal structure comprising a first seal rubber and a second seal rubber arranged at the opening, the first seal rubber and the second seal rubber each having ...  
WO/2024/045966A1
A server cooling system (1000), relating to the technical field of server heat dissipation, and solving the problems that existing server cooling systems have high manufacturing costs, large maintenance workload, and high energy consumpt...  
WO/2024/045737A1
An optical module housing (11), comprising a housing body (110) and a clad layer (120), wherein the clad layer (120) is located on the surface of the housing body (110); and at least in a contact area (11a), the roughness Ra of the clad ...  
WO/2024/049544A1
Various aspects include devices, systems, and methods for providing support for an immersion coolant tank drawer with a support bracket. The support bracket includes a slide bar having a proximal end and a distal end. The proximal end is...  
WO/2024/048484A1
The present invention relates to a heat sink (1) comprising a base section (20) including a first surface (21) and a second surface (22) opposing to the first surface (21) and to which heating elements (100) are thermally connected, and ...  
WO/2024/049078A1
A wireless power transmission device can be provided. The wireless power transmission device may comprise: a housing including a front plate and a frame, which surrounds at least a part of the front plate and includes an edge area includ...  
WO/2024/049857A1
Described herein are examples of devices which include a cooling housing. The cooling housing includes a containment area. The containment includes a heat source to be cooled. The housing includes a heat exchanger coupled to the housing....  
WO/2024/045736A1
A vapor chamber assembly (V) having a two-phase flow cycle of two working fluids, the vapor chamber assembly comprising a first bracket (1), a second bracket (2) parallel to the first bracket (1), and at least one first heat pipe (3), wh...  
WO/2024/047226A1
A pump (103) for a processor cooling system through which working fluid is circulated to cool a processor, the pump (103) comprising: a processor heat exchanger (105); a casing (107) configured to be coupled to the processor heat exchang...  
WO/2024/045793A1
The present invention relates to the technical field of battery cases. Provided is a vertically-arranged wireless charging battery box. The wireless charging battery box comprises a tray member, a frame member, a bottom protection plate,...  
WO/2024/045230A1
The present application relates to a lifting/lowering assembly of an electronic device and the electronic device. The lifting/lowering assembly comprises: a first mounting frame and a second mounting frame which are oppositely arranged i...  
WO/2024/045981A1
The present application provides a power device and a photovoltaic system, for use in improving the heat dissipation performance of power devices, thereby improving the use reliability of the power devices. The power device comprises a h...  
WO/2024/047089A1
The invention relates to a vehicle device (1 ) comprising a housing (2), in which at least one printed circuit board (7) is arranged, and comprising a fan (3), which is arranged outside the housing (2), and with an electric cable (11), w...  
WO/2024/042738A1
A liquid immersion cooling device that cools a heating element provided on a substrate, the liquid immersion cooling device comprising: a casing that houses the substrate inside and stores a refrigerant in the lower part of the inside; a...  
WO/2024/041078A1
Embodiments of the present application relate to the technical field of heat dissipation, and provide a heat dissipation module and an electronic device. The heat dissipation module comprises a first cooling pipeline, a second cooling pi...  
WO/2024/041985A1
The invention relates to a heat sink (10) for an electronic component, having a metal foam, the metal foam having: - at least one first region (1) having a first density, and - at least one second region (2) having at least one second de...  
WO/2024/043471A1
This display device may comprise: a housing; a display module arranged inside the housing; and a control assembly for controlling the display module. The display module can comprise: a display panel; a chassis for covering the rear of th...  

Matches 201 - 250 out of 100,538