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WO/2024/110676A1 |
The present invention relates to a system for the thermostabilisation of a load within a dielectric fluid, comprising at least one hermetic vessel (2) comprising an effective volume (11) configured to contain the liquid and vapor phase o...
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WO/2024/110151A1 |
The invention relates to a modular field device (1) for determining a process variable, which despite a plastic housing (1), meets EMC technical requirements and is easy to manufacture. The sensor module (13), which is used to determine ...
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WO/2024/111983A1 |
The present invention relates to a manufacturing system and manufacturing method for a vapor chamber. Particularly, the present invention is characterized in that a pair of materials having a plurality of enclosures connected by gates ar...
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WO/2024/103675A1 |
Disclosed in the present invention are a thermal management system and a control method. The thermal management system comprises: a first liquid pipeline, a second liquid pipeline and a switching valve group, the switching valve group be...
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WO/2024/103762A1 |
A liquid cooling unit and a control method therefor. The liquid cooling unit comprises: an evaporator (200), a condenser (300), a liquid return pipeline (400), and a liquid outlet pipeline (500). The liquid return pipeline (400) comprise...
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WO/2024/103560A1 |
A liquid cooling system, and a liquid cooling system control system and method. The liquid cooling system comprises a heat exchange unit and a cooling unit; the cooling unit comprises at least two separated cavities; the cooling unit is ...
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WO/2024/103670A1 |
A siphon cooler and a fin thereof. According to actual design requirements, the siphon cooler can only comprise the fin, or the siphon cooler can comprise both the fin and a heat sink fin. A compensation cavity with a Tesla valve structu...
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WO/2024/103508A1 |
The present invention is applicable to the technical field of LED display screens, and provides an LED display screen with good heat dissipation performance. A heat dissipation box is installed on a front surface of an LED display screen...
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WO/2024/105135A1 |
There is disclosed a data processing apparatus for providing energy to an energy consuming system. The data processing apparatus comprises a portable containerised unit configured to couple to the energy consuming system in use. The port...
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WO/2024/103718A1 |
A liquid-cooling heat dissipation device, a heat dissipation system, and an electronic device, relating to the technical field of heat dissipation. The liquid-cooling heat dissipation device comprises a cold plate; the cold plate compris...
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WO/2024/106330A1 |
A cooling system (A) comprises: an integrated unit (1) formed by integrating an electric vehicle drive unit (2) that includes at least an electric motor (21) for transmitting a driving rotary force to a traveling system of a vehicle, and...
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WO/2024/104067A1 |
A smart cabinet for a data center, comprising a cabinet body (1). A secondary door panel (21) is hingedly connected to one side of an open end of the cabinet body (1) by means of hinges, and a primary door panel (22) is hingedly connecte...
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WO/2024/103662A1 |
The present invention relates to an electronic device aging test apparatus, comprising a box body, a test chamber provided in the box body and provided with an air inlet and an air return port, a circulating air duct provided on the peri...
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WO/2024/106475A1 |
A power supply module (100) comprises: drive substrates (20, 30) that drive an electronic circuit composed of a plurality of electronic components having different heights; a control substrate (40) that controls the drive substrates; and...
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WO/2024/104715A1 |
The invention relates to a power electronic device (2) and to a method for the operation thereof. The invention also relates to a correspondingly configured motor vehicle (1). The power electronic device (2) comprises a semiconductor ele...
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WO/2024/104723A1 |
The invention relates to a housing comprising a housing body (1.4) and a housing cover (1.2), wherein the housing body (1.4) has a cup-like shape with an opening (1.6) and forms an interior (1.3) that can be accessed through the opening ...
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WO/2024/106287A1 |
This power supply module is equipped with: a plurality of drive substrates which each separately drive electronic circuits which each comprise a plurality of electronic components which generate different amounts of heat; a heat-shieldin...
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WO/2024/107706A1 |
In some embodiments, a packaged device can include an electrical device having first and second electrodes implemented on opposite sides of a body. The electrical device can be sandwiched between first and second terminal assemblies, wit...
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WO/2024/103930A1 |
An electronic device (20) and a liquid-cooled cabinet (100). The electronic device (20) comprises a housing (21) and an indicator module (23), wherein the housing (21) is provided with an accommodating cavity (211) and a mounting groove ...
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WO/2024/106641A1 |
The present invention relates to a power semiconductor heat-dissipation plate module used in a fast charging power supply for an electric vehicle and, more specifically, a power semiconductor heat-dissipation plate module used in a fast ...
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WO/2024/108043A1 |
The disclosure provides a system and method for control of a pump in a coolant distribution unit (CDU) for cooling electronic components. In some aspects, the CDU includes a reservoir pump unit (RPU). Aspects of the method include settin...
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WO/2024/099871A1 |
The present disclosure relates to battery compartment assemblies and more specifically to battery compartment assemblies that provide conductive power contacts used to supply to power to, for example, a medical device. The battery compar...
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WO/2024/099704A1 |
The present invention relates to an electronic device (1), which comprises a housing (2) and an electronic assembly (3). The electronic assembly (3) is fixed in the housing (2) by means of a filling compound (4). The filling compound (4)...
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WO/2024/098112A1 |
A cooling tank for cooling computing devices using liquid immersion is disclosed. The cooling tank comprises: a container configured to receive coolant in a cavity of the container; a separation panel dividing the container cavity into a...
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WO/2024/101737A1 |
The present invention relates to a ceramic substrate for a power module and a manufacturing method thereof. A ceramic substrate for a power module according to one embodiment of the present invention may comprise: a ceramic substrate; an...
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WO/2024/098111A1 |
Described embodiments generally relate to a cooling system for cooling computing devices. The cooling system comprises at least one cooling tank configured to hold a first cooling fluid and sized to at least partially immerse at least on...
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WO/2024/103024A1 |
Presented herein are systems, apparatuses, devices, and methods for deactivating high power converters and inverters in shutdown and fault events. An apparatus can include an inverter electrically coupled with a power supply. The inverte...
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WO/2024/102578A1 |
To minimize use of power required for cooling and get ahead of temperature buildup, a mode of operation can be established for a cooling element (306) of a device (208, 210) based on one or more non-temperature factor values. For example...
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WO/2024/098549A1 |
A rotating assembly (10). The rotating assembly (10) comprises: a first rotating shaft assembly (100), a first fixing plate (200) sleeved on the first rotating shaft assembly (100), and a second fixing plate (300) sleeved on the first ro...
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WO/2024/100994A1 |
The present invention improves the cooling performance of a semiconductor chip that is cooled by a Peltier element, while making an electrical connection to the outside possible. A Peltier element according to the present invention is ...
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WO/2024/102003A1 |
An adapter handset (10) is provided for electrically interfacing with a desk controller (2) of an electrically powered sit-stand desk (1). The adapter handset (10) includes a multi-pin handset connector (7) and a processor (4). The desk ...
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WO/2024/098849A1 |
A thermal management system (100) and a vehicle. The thermal management system (100) comprises: a battery temperature control loop (10), a chiller heat exchanger (101) being disposed on the battery temperature control loop (10); and an e...
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WO/2024/098592A1 |
Disclosed in the present application are a liquid-cooling heat dissipation plate and a liquid-cooling electronic device. The liquid-cooling heat dissipation plate comprises a cooling plate unit, a liquid inlet and a liquid outlet being f...
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WO/2024/016744A9 |
Embodiments of the present application provide a foldable screen device, which at least comprises a housing, an electric connecting wire, and a shaping part. The housing comprises a rotating shaft assembly, a frame body, and an accommoda...
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WO/2024/098925A1 |
Embodiments of the present application disclose a computing device and a computing node, wherein the computing device may specifically be a server or the like, and accordingly, the computing node may specifically be a server node or the ...
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WO/2024/098110A1 |
Embodiments generally relate to systems for cooling computing devices using liquid immersion. An example system includes: a plurality of open cooling tanks, each cooling tank defining an interior volume to receive computing devices and t...
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WO/2024/098790A1 |
The present application relates to an electronic assembly and an electronic device. The electronic assembly comprises a liquid cooling heat dissipation module and a plurality of floating modules, wherein the plurality of floating modules...
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WO/2024/099236A1 |
An in-vehicle heat-pipe heat dissipation controller, and a vehicle, which relate to the technical field of controllers, and aim to solve the problem of an increase in the maintenance costs caused by the short circuit of a circuit board a...
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WO/2024/099817A1 |
The present disclosure relates to battery compartment assemblies and more specifically to battery compartment assemblies that provide conductive battery contacts used to facilitate the supply of power to, for example, a medical device. T...
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WO/2024/098476A1 |
Provided are a water-cooling system and method for a traction converter, and a controller and a traction system. The water-cooling system comprises: a water pump (1), which is used for providing a cooling liquid for the water-cooling sys...
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WO/2024/102562A1 |
An assembly for two (or more) DC/DC converters located in a common enclosure, where the DC/DC converters share a heat sink assembly, such as a shared dual-sided heat sink assembly. The techniques efficiently package the components of the...
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WO/2023/064270A9 |
The present disclosure refers to methods of employing a computer comprising a pulse width modulated controlled cooling fan in an immersion cooling process. The present disclosure also refers to devices therefore. Such methods and devices...
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WO/2024/095685A1 |
A cooling module according to the present invention includes: a substrate on which a driver for energizing an auxiliary machine installed on a vehicle is mounted; and a module housing for holding the substrate. The module housing has a f...
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WO/2024/093214A1 |
The present application belongs to the field of communication equipment and discloses a chip heat dissipation assembly and an electronic device. The chip heat dissipation assembly comprises: a circuit board, a chip assembly, a supporting...
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WO/2024/093433A1 |
A wireless charging base (100) and a wireless charging system, which relate to the technical field of charging devices, and aim to solve the problem of how to achieve heat dissipation of an electric device (200) during charging to ensure...
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WO/2024/095653A1 |
[Problem] To achieve both simplification of a device and high cooling efficiency of insulating oil that has received heat. [Solution] This cooling device cools a power semiconductor apparatus. The cooling device includes: a tank which ac...
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WO/2024/097055A1 |
Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at le...
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WO/2024/093695A1 |
A liquid-cooling heat dissipation module embedded with a three-dimensional vapor chamber element, the module comprising a three-dimensional vapor chamber element and a semi-open shell, wherein the three-dimensional vapor chamber element ...
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WO/2024/096302A1 |
An inverter unit that drives a compressor motor comprises, in order for a plurality of inverter elements installed on a seating surface of an inverter housing to be individually fixed to the seating surface, an insulating member which is...
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WO/2024/094807A1 |
The invention relates to a cooling device (1) which comprises at least one central electronics unit (2), which comprises at least two active units (3-8) arranged at a distance from the central electronics unit (2) and which comprises at ...
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