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WO/2024/002227A1 |
A configuration method for a composite flexible circuit substrate based on stainless steel metal, comprising: configuring a stainless steel metal base layer (10) having a coefficient of thermal expansion of less than 16*10-6 m/mk as a su...
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WO/2024/004456A1 |
[Problem] To provide a structure that reflects use of a fibrous body based on the technical concept of using turbulence to perform cooling. [Solution] A unit according to the present invention includes a cooling liquid, an electrical cir...
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WO/2024/000549A1 |
A control system, a display apparatus and a dimming method, which are applied to the field of vehicle-mounted display screens. The control system comprises: a timing control sub-circuit, a gamma register sub-circuit, a source driving sub...
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WO/2023/207285A9 |
A display module and a display apparatus. The display module comprises a display panel, a circuit board, an electronic device, a copper foil, and a graphite film. The circuit board is electrically connected with the display panel. The ci...
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WO/2024/004258A1 |
This cooling device comprises: a heating unit in which a storage space for storing a refrigerant in a liquid phase is provided, and which is thermally connected to a heat-generating body and has a heat transfer surface for transmitting t...
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WO/2024/002000A1 |
The present application provides a calculating system, a control apparatus, a heat dissipation method and a storage medium, which may correspondingly control an opening degree of a flow regulating valve on the basis of a service executio...
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WO/2024/003316A1 |
The invention relates to a switching cell (100) comprising: - power modules (102); - an upper busbar (130) and a lower busbar (128), which are connected to each of the power modules (102) in order to distribute a DC voltage (UDC) thereto...
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WO/2024/004459A1 |
[Problem] To provide a novel structure for a mode of use of a fibrous body. [Solution] This unit comprises an electric circuit unit, a cooler through which a cooling fluid passes, and a fibrous body. The electric circuit unit is cooled b...
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WO/2024/002030A1 |
Provided in the present application are an air cooling module, a server, and a functional module mounting and dismounting method. The air cooling module is configured to mount a fan onto a shell having a functional module, and comprises ...
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WO/2024/002324A1 |
The present application relates to a heat sink, a circuit board module and an electronic device. The heat sink is configured for the heat dissipation of an electronic component. The heat sink comprises a base, a plurality of fins, and a ...
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WO/2024/001162A1 |
The present application discloses a heat sink (100) and a communication device. The heat sink (100) comprises a heat dissipation substrate (110) and a plurality of heat dissipation fins (120). The heat dissipation substrate (110) is used...
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WO/2024/003000A1 |
The invention relates to a machine tool device (10), comprising a housing unit (12), which has at least one handle section (14) and at least one drive section (16), a drive unit (18) for driving a tool (20), a tool holder (22) for connec...
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WO/2024/004457A1 |
[Problem] To provide a structure that reflects a mode of utilization of a fibrous body based on the technological concept of performing cooling by utilizing a turbulence effect. [Solution] This unit comprises a coolant fluid, an electric...
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WO/2024/002193A1 |
The embodiments of the present disclosure relate to an indirect evaporative cooling system and a control method, belonging to the technical field of refrigeration apparatuses. The indirect evaporative cooling system comprises an air-to-a...
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WO/2024/004322A1 |
Provided is an electric wire holding structure that, by having a simple configuration, makes it possible for electric wires to be routed without interfering with the movement of a movable member. The electric wire holding structure compr...
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WO/2024/001748A1 |
Disclosed in the present application are a liquid cooling optical module and an apparatus. The liquid cooling optical module comprises a heating assembly (200) and a liquid cooling shell (100), wherein one end of the heating assembly (20...
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WO/2024/005401A1 |
An electronic device according to an embodiment of the present disclosure may comprise: a printed circuit board; an electronic component disposed on one surface of the printed circuit board; a shield frame disposed on the one surface of ...
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WO/2024/001375A1 |
Provided in the present application are an energy recovery device and an electronic apparatus. The energy recovery device comprises a thermoelectric conversion unit, a heat dissipation assembly, a power storage unit, and a heating unit, ...
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WO/2024/004355A1 |
This heat control structure comprises: a plurality of sheet-like or plate-like graphite members; a first holding member that holds the plurality of graphite members at a first end portion in the longitudinal direction of the plurality of...
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WO/2024/000890A1 |
A liquid cooling apparatus. The liquid cooling apparatus comprises a housing, at least two cover plates, and at least one condenser; the housing is provided with at least two independent compartments, and liquid accommodating regions for...
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WO/2024/004592A1 |
A connector device (1) comprises: a circuit board (10) to which a main ground circuit (12) is provided; and a connector (20) installed on the circuit board (10). The connector (20) has a sub-substrate (35), an IC (36) mounted to the sub-...
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WO/2024/002089A1 |
A control method for a refrigeration and freezing device (100), and a refrigeration and freezing device (100). The refrigeration and freezing device (100) comprises a cabinet body (110) defining at least one storage compartment, an elect...
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WO/2024/002586A1 |
The invention relates to a system for pressing an electronic board onto a metal block (29A, 29B) provided with one or more side support members (30). The system comprises: - a cradle (31) housing the electronic board intended to be press...
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WO/2024/002588A1 |
Disclosed is a computer system capable of generating heat comprising: - a box, - a water circuit capable of being connected at the inlet and at the outlet to an external water network, this water circuit comprising metal pipes inside the...
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WO/2024/001179A1 |
Embodiments of the present application provide a heat conduction plate, a heat dissipation apparatus, and an electronic device. The heat conduction plate comprises a heat conduction plate body, and a first heat dissipation area (10), a s...
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WO/2024/004727A1 |
Disclosed is a circuit structure capable of reducing a mounting area occupied by a heat transfer member in a housing and improving heat radiation efficiency of a heat generating component using an energization busbar. A circuit structu...
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WO/2024/004591A1 |
A connector device (1) is provided with a circuit board (10) and a connector (20) installed on the circuit board (10). The connector (20) has an outer conductor (33) that can be electrically continuous with a shield layer (92) of a shiel...
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WO/2024/004728A1 |
Disclosed is a circuit structure that makes it possible to directly draw heat without requiring a busbar to be routed from a terminal section of a heat-generating component, and to build a heat dissipation route for a heat-generating com...
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WO/2024/003325A1 |
The invention relates to a switching cell (100) comprising: - at least one power module (102) comprising a housing (305), a switch (306, 308) in the housing (305), and a pin (312) for controlling the switch (306, 308), the control pin (3...
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WO/2024/004460A1 |
[Problem] To provide a novel structure of a usage state of a fiber body. [Solution] This unit has a housing having a spiral groove formed such that a cooling liquid flows along the circumferential direction, a rotary-electric machine tha...
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WO/2024/004655A1 |
This cooler comprises: a housing that includes an opening, an inner space section, and a bottom section; and a partition wall that extends up from the bottom section in a first direction and is accommodated in the inner space section. Th...
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WO/2024/004324A1 |
The present disclosure provides an electronic control device in which the heat dissipation property of electronic components is improved while suppressing radiation noise. This electronic control device comprises: a circuit board 110 whi...
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WO/2024/001199A1 |
Embodiments of the present application provide a vapor chamber, a heat sink, and an electronic device. The vapor chamber comprises: a bottom plate, a top plate, side plates and a backflow piece. The bottom plate comprises a first heat di...
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WO/2024/001042A1 |
Provided in the present invention is a sliding-rail cabinet. The cabinet comprises a cabinet body, wherein a plurality of apparatus boxes are arranged in the cabinet body, and two ends of each apparatus box are connected to the cabinet b...
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WO/2024/005976A1 |
A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing syste...
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WO/2023/248811A1 |
One embodiment of the present disclosure provides a wire harness that makes it possible to suppress the damage of an electric wire member due to a twist caused in association with the opening/closing of an opening/closing body. The wire ...
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WO/2023/248235A1 |
The present invention provides an electronic component enclosure (100) and a method (1100) of assembling thereof. The enclosure (100) comprises a casing (102) for accommodating Printed Circuit Board (PCB) (104) having electronic componen...
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WO/2023/248566A1 |
In the present invention, an electric power conversion device comprises a semiconductor module that has a built-in semiconductor element, a flat tube in which a coolant flows, and a pair of headers that are mounted to both ends of the fl...
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WO/2023/250109A1 |
A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. E...
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WO/2023/248999A1 |
A semiconductor module according to one aspect of the present disclosure comprises a semiconductor device, a cooling plate, and a flow path forming member. The cooling plate is provided on one main surface of the semiconductor device. Th...
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WO/2023/249691A1 |
The disclosed technology is generally directed to vapor-air transition detection for two-phase liquid immersion cooling. In one example of the technology, a first device is cooled via two-phase liquid immersion cooling, such that the fir...
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WO/2023/247219A1 |
A circuit board arrangement (14) comprises a first circuit board section (140A), a second circuit board section (140B), and a standoff element (2) comprising a body (20) having a first end (21) and a second end (22). The standoff element...
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WO/2023/249381A1 |
An electronic device according to various embodiments disclosed in the present document may comprise: a first housing; a second housing rotatably connected to the first housing; a display disposed on the front surface of the electronic d...
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WO/2023/247063A1 |
The invention relates to a cooling system (1) for the liquid immersion cooling of electronic components (2), comprising - a container (3) having a container wall (31) which, in the interior, can be filled with two-phase heat transfer flu...
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WO/2023/246717A1 |
Disclosed are a liquid cooling system control method and apparatus, a device, and a system, relating to the field of computers. The method comprises determining a cooling policy according to energy consumption parameters of a heat dissip...
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WO/2023/249767A1 |
A power controller allocates input power to a datacenter between computing power for computing services, backup power, and overhead power for overhead systems. The power controller reallocates the overhead power and/or the backup power t...
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WO/2023/248989A1 |
A cooling device, according to one embodiment of the present disclosure, is for cooling heating elements, and comprises: a housing; a first flow path; and a second flow path. The housing has an inflow port and an outflow port for a refri...
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WO/2023/246095A1 |
The present application provides a heat dissipation device and communication equipment comprising same. The heat dissipation device comprises: a substrate (100); and a plurality of heat dissipation fins (200), at least one surface of eac...
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WO/2023/246229A1 |
A liquid cooling device, comprising: a housing (1) having an accommodating chamber (11) and a cooling component (2) accommodated in the accommodating chamber (11). The housing (1) has assembly seams (12) being in communication with the a...
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WO/2023/245360A1 |
The present disclosure relates to a heat dissipation part and a manufacturing method therefor, a middle frame part, a housing part, and a terminal device. The heat dissipation part comprises a heat dissipation assembly and a heat dissipa...
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