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WO/2024/079579A1 |
A board comprising cellulose-containing materials, such as vegetable fibres and/or wood chips and/or wood pieces, and a cured glue that bonds these cellulose-containing materials to one another, wherein the cured glue is obtained by the ...
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WO/2024/063112A1 |
The purpose of the present invention is to provide a resin composition which can suppress the occurrence of voids and floating during heat treatment and can be easily peeled after the heat treatment. Moreover, another purpose of the pres...
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WO/2024/057206A1 |
Adhesive compositions, articles, and methods are described. The electronic may comprise: i) a conductive metallic substrate; ii) an insulating resin layer; and iii) and an adhesive layer disposed between the substrate and insulating resi...
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WO/2024/058061A1 |
A polyimide resin having a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine, wherein the structural unit A includes a structural unit (A1) derived from a compound represented by ...
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WO/2024/050892A1 |
A resin composition and an adhesive. The resin composition is composed of the following components: benzoxazine, which is a synthetic product of a primary amine-terminated flexible polyimide oligomer, an aldehyde compound and a monofunct...
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WO/2024/014123A1 |
This thermoplastic resin composition contains: a crystalline thermoplastic polyimide resin (A) which contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2) and in whic...
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WO/2023/247431A1 |
Described herein is a process for producing a lignocellulosic composite, a binder composition suitable for use in said process, as well as a lignocellulosic composite which can be produced by the process of the invention, and its use. Mo...
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WO/2023/228509A1 |
Provided are a resin composition having an excellent potential while maintaining excellent heat tolerance, as well as a cured substance, a sealing material, an adhesive, an insulating material, a coating material, a prepreg, a multilayer...
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WO/2023/212501A1 |
The present application is directed to creping adhesives. The adhesive forms from a solution/dispersion of a polyelectrolyte complex that is composed of a mixture of one or more cationic polyelectrolytes, and one or more anionic polyelec...
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WO/2023/188507A1 |
The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, suppresses the occurrence of a...
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WO/2023/188506A1 |
The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, and exhibits a small linear co...
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WO/2023/170501A1 |
Curable bonding compositions include a free radically polymerizable bis- maleimide resin, a polymerizable siloxane -based release agent, and an optional thermal or ultraviolet free radical initiator. The curable composition is a coatable...
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WO/2023/167080A1 |
[Problem] To provide: an adhesive agent composition having excellent heat resistance and adhesive strength, a low dielectric constant and dielectric loss tangent, and excellent dielectric properties; an adhesive sheet containing the same...
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WO/2023/149581A1 |
The purpose of the present invention is to provide: a surface treatment solution that does not contain Si atoms and shows almost no deterioration in adhesion even when applied to the surface of a resin and left on the surface-treated res...
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WO/2023/115264A1 |
A conductive adhesive (4), an electrochemical device, and an electronic device. The conductive adhesive (4) comprises a matrix and a conductive filler, wherein the matrix comprises modified epoxy resin, polyurethane, and polyimide. The c...
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WO/2023/120234A1 |
Provided is a polymeric compound represented by formula (1) (in formula (1), R1, R2, R3 and R4 each independently represent a methyl group, an ethyl group, an isopropyl group, or a tertiary butyl group; X's each independently represent a...
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WO/2023/111782A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a maleimide-terminated polyamide-imide polymer. The present disclosure further relates to an adhesive composition comprisi...
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WO/2023/100461A1 |
The present invention addresses the problem of making it possible to reliably achieve strong adhesion between a substrate and a print layer during use, to make it easier to remove/separate a print layer from a resin substrate and a seala...
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WO/2023/074534A1 |
A polyamic acid varnish according to the present disclosure contains a polyamic acid. The monomers that constitute this polyamic acid include: a monomer (A) that has a C4-12 linear alkylene group but does not have an ester bond, an amide...
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WO/2023/068109A1 |
The purpose of the present invention is to provide a curable resin composition which makes it possible to obtain a cured product having excellent conductivity and curing properties.　The present invention is a curable resin composition ...
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WO/2023/054418A1 |
The present invention addresses the problem of making it possible to bond a print layer to a base material securely when the invention is used, and also makes it possible, after the invention is used, to more easily separate/detach the p...
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WO/2023/056263A1 |
The present disclosure relates to polyimides including diaminopentane. In particular examples, the polyimide can be provided as a stretched film.
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WO/2023/041443A1 |
The present invention relates to a one-pot process for the production of polycarbodiimide cured polymers, comprising a reaction of (a) at least one polycarbodiimide with two or more carbodiimide functionalities per molecule, (b) at least...
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WO/2023/032888A1 |
The present invention addresses the problem of providing an adhesive which exhibits adhesive properties and heat resistance and is capable of transferring/mounting a large number of semiconductor elements all at once even in a step in wh...
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WO/2023/020226A1 |
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silico...
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WO/2023/017876A1 |
The present invention is applicable in the field of substrates for high-frequency circuits, and for example, relates to a composite polyimide substrate, a composite polyimide composition, and a printed circuit board using same. The compo...
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WO/2023/282318A1 |
[Problem] To provide an adhesive composition which has high adhesiveness to not only conventional polyimides and liquid-crystal polymers but also metal substrates, can attain high soldering heat resistance, and is excellent in terms of l...
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WO/2022/261654A1 |
A polyimide material is obtained from a first monomer and a second monomer. The first monomer includes an ester-containing dianhydride. The second monomer includes a diamine. The polyimide material has desirable optical, structural, ther...
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WO/2022/255141A1 |
Provided is an adhesive composition that is for forming a low-dielectric adhesive layer having both heat resistance and chemical resistance (solvent resistance), that exhibits excellent adhesiveness even with respect to a low-dielectric ...
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WO/2022/255137A1 |
The present invention provides an adhesive composition for forming a low-dielectric adhesive layer that has both heat resistance and chemical resistance (solvent resistance), the adhesive composition exhibiting favorable adhesion to a lo...
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WO/2022/236819A1 |
Provided are an amidoamine composition, an adhesive composition comprising the amidoamine composition, and a method for preparing the amidoamine composition. The amidoamine composition contains a polyamidoamine and an ammonium salt of an...
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WO/2022/220253A1 |
The purpose of the present invention is to provide a curable resin composition that has excellent heat resistance, thermal conductivity, and adhesiveness. Another purpose of the present invention is to provide a cured product of said cur...
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WO/2022/202416A1 |
The polyamide acid composition according to the present disclosure comprises a polyamide acid. The monomers constituting the polyamide acid include, relative to the total monomers, 30-95 mol% of monomer (A) that has a diphenyl ether skel...
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WO/2022/201620A1 |
This resin composition comprises a bismaleimide compound (A) including a constituent unit represented by formula (1) and containing maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from th...
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WO/2022/201619A1 |
Provided is a thermally curable resin composition which can give cured objects having low-dielectric characteristics, high heat resistance, a low modulus, and a low water absorption and which has satisfactory adhesiveness to substrates.ã...
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WO/2022/204695A1 |
The invention features an aqueous adhesive composition including an alkali soluble acrylic copolymer, polyethylene imine, and a silane adhesion promoter. The aqueous adhesive compositions of this invention are stable and are particularly...
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WO/2022/183481A1 |
The present invention relates to a curable adhesive composition comprising (A) at least one maleimide compound, (B) at least one thiol compound having at least two mercapto groups and no siloxane group in the molecule; (C) at least one l...
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WO/2022/169193A1 |
The present invention provides: a multilayer polyimide film having a thickness of at least 50 μm, and including at least two polyimide unit films comprising a polyimide core layer and adhesive layers laminated on one or both surfaces of...
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WO/2022/141817A1 |
The present invention provides a resin composition and an adhesive film and a cover film comprising same. The resin composition comprises the following components in parts by weight: 40-80 parts of a polyamide imide resin, 10-40 parts of...
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WO/2022/141816A1 |
Provided are a resin composition, a resin adhesive film, and an application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 par...
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WO/2022/136612A1 |
The present invention relates to a binder composition comprising component A comprising polymer(s) A1 and optionally component B comprising component B1 which is selected from the group consisting of a mono-saccharides, disaccharides, hy...
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WO/2022/138132A1 |
This adhesive composition comprises a copolymer (A), a crosslinking agent (B), and an aqueous medium, wherein: the copolymer (A) has a structural unit derived from a monomer (a1), a structural unit derived from a monomer (a2) having a ca...
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WO/2022/090842A1 |
A multiple-part curable composition, a cured composition formed by combining and reacting the multiple-part curable composition, and a method of providing a cured composition are described. The multiple-part curable composition contains ...
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WO/2022/080314A1 |
This multilayer polyimide film (10) comprises: a non-thermoplastic polyimide layer (11); and an adhesive layer (12) which is disposed on at least one surface of the non-thermoplastic polyimide layer (11) and includes polyimide. The non-t...
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WO/2022/065388A1 |
One purpose of the present invention is to provide a provisional fixation material which is able to be easily separated after high-temperature processing even in cases where the high-temperature processing at 300°C or higher is carried ...
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WO/2022/050564A1 |
The present invention relates to a composite and a method for preparing same. A composite according to an embodiment of the present invention comprises: a base powder; an adhesive disposed on the surface of the base powder; and functiona...
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WO/2022/035925A1 |
A waterborne, two-part adhesive composition having improved wet tack properties is disclosed. The two-part adhesive composition is particularly suitable for making laminates, including paperboard products.
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WO/2022/025123A1 |
A resin composition comprises (A) a bismaleimide resin formed by reacting aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and maleic anhydride (a3); and (B) an inorganic filler that has been surface-treated with a silane compou...
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WO/2021/251018A1 |
The present invention is a temporarily bonding method for bonding, to a support body via a temporary bonding layer, a wafer comprising a first principal surface including a circuit and a second principal surface that is to be processed a...
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WO/2021/241359A1 |
The present invention provides: an adhesive sheet which sufficiently and stably adheres to the back surface of a lead frame and the back surface of a sealing resin, and is not separated therefrom before a separation step even if subjecte...
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