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WO/2016/158829A1 |
Provided is a resin composition having long-term heat resistance, with which the rate of change in adhesive strength is low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the ...
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WO/2016/159102A1 |
In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obt...
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WO/2016/129541A1 |
The present invention provides a heat-curable resin composition comprising: (A) a polyimide resin having a structure represented by formula (1-a) and a structure represented by formula (1-b); and (B) at least one heat-curable resin selec...
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WO/2016/129655A1 |
Provided are an interlayer insulating resin film, an interlayer insulating resin film having an adhesive auxiliary layer, and a printed circuit board obtained using the interlayer insulating resin film or the interlayer insulating resin ...
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WO/2016/098533A1 |
A cyanic acid ester compound which has a structure represented by general formula (1). (In the formula, n represents an integer of 1 or more.)
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WO/2016/067925A1 |
Provided is a polycarbonate-imide-based resin paste which is excellent in terms of (1) solubility in nitrogen-free solvents, (2) low-temperature dryability/curability, (3) low warpage, (4) flexing characteristics, (5) printability, and (...
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WO/2016/066023A1 |
Provided is an electrode binder of a lithium ion battery, which is obtained by the polymerization reaction of a diamine monomer comprising BAPP (2,2-bis[4-(4-aminophenoxy)phenyl]propane) and a dianhydride monomer. Also provided is a posi...
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WO/2016/050647A1 |
The invention relates to a floor structure on substrate (1) comprising a primer (2) and, provided on top of the primer, flooring (3) comprising a floor coating or a bonded material, the primer (2) being made of a hot-melt adhesive. The f...
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WO/2016/052491A1 |
[Problem] The objective of the present invention is to provide a polyimide copolymer having good soldering heat resistance and adhesion to metallic foil and various films, and a molded article using said copolymer. [Solution] This polyim...
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WO/2016/031552A1 |
The purpose of the present invention is to provide an electrically conductive adhesive composition which has excellent adhesive properties without containing harmful substances such as solder (lead). Specifically, this electrically condu...
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WO/2016/033522A1 |
A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond f...
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WO/2016/031342A1 |
Provided is an adhesive composition that is highly adhesive not only to conventional polyimide and polyester films but also to low polarity resin base materials such as LCP and metal base materials, can achieve high solder heat resistanc...
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WO/2016/021646A1 |
The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive for...
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WO/2016/013627A1 |
Disclosed is a multilayer polyimide film which comprises a layer (A) containing a thermoplastic polyimide (A) having a glass transition temperature of lower than 240ºC and a layer (B) containing a heat-resistant polyimide (B) having a g...
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WO/2015/182469A1 |
Provided are: a temporary bonding film which enables a stable temporary bonding of a device wafer when the device wafer is subjected to mechanical or chemical processing, and which also enables easy termination of the temporary bonding t...
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WO/2015/182161A1 |
Provided is an adhesive composition using a polyamide-imide resin which is suitable for uses such as flexible printed wiring boards. This adhesive composition in which a polyamide-imide resin and an epoxy resin are combined is characteri...
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WO/2015/177114A1 |
The present invention relates to a water-soluble carbohydrate-polyamino acid-based pre-reacted binder composition,a method of its manufacture, use of the pre-reacted binder composition, a method of manufacturing a collection of matter bo...
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WO/2015/127179A1 |
Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for t...
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WO/2015/107990A1 |
The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A), a polyfunctional epoxy compound (B), an epoxy curing agent (...
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WO/2015/048575A1 |
Curable functionalized imide-linked polyimides compounds have been synthesized that have been found to possess very low dielectric constant and extremely low dissipation factor. These compounds also have a range of high to low modulus, e...
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WO/2015/042391A1 |
The technology is directed towards soy-based adhesive compositions having improved viscosity properties due to the use of soy flour having a particular particle size distribution. These compositions are useful for making lignocellulosic ...
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WO/2015/037555A1 |
A purpose of the present invention is to provide an adhesive composition for printed wiring boards, which exhibits excellent heat resistance. Another purpose of the present invention is to provide: a coverlay for printed wiring boards, w...
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WO/2015/033703A1 |
Provided is an adhesive agent composition which has good pot life properties and good adhesion to a metallic base material and a polyolefin-type resin base material, and comprises a modified polyolefin and a carbodiimide compound. An adh...
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WO/2015/020016A1 |
A polyimide resin containing a repeating constituent unit represented by formula (1), a repeating constituent unit represented by formula (2), and a repeating constituent unit represented by formula (A) or a constituent unit represented ...
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WO/2015/020323A1 |
The present invention relates to an adhesive composition and a composite polarizing plate using same, more specifically to an adhesive composition and a composite polarizing plate using same, in which the adhesive composition is interpos...
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WO/2015/019802A1 |
The objective of the present invention is to obtain a photosensitive resin composition which does not have the defects of conventional technology and which is capable of forming an accurate polyimide pattern easily by a low-temperature p...
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WO/2015/020020A1 |
[1] A polyimide resin composition comprising a polyimide resin (A) and an additive (B), wherein the polyimide resin (A) contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by form...
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WO/2015/013219A1 |
Curable compositions comprising a benzoxazine component, a polyamine component and a fluoropolymer component are described. The compositions may be cured to produce compositions useful in coating, sealants, adhesive and many other applic...
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WO/2014/203735A1 |
[Problem] To provide a novel heat-curable resin composition. [Solution] A heat-curable resin composition which contains a polymer having a repeating structural unit represented by formula (1-a) (wherein R1 and R2 independently represent ...
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WO/2014/181659A1 |
This invention provides a transparent-circuit-board manufacturing method that makes it possible to perform desired patterning in a clean fashion while reducing outgassing due to a temporary affixing material even if a high-temperature tr...
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WO/2014/181658A1 |
This invention provides a transparent-circuit-board manufacturing method that makes it possible to perform desired patterning in a clean fashion while reducing outgassing due to a temporary affixing material even if a high-temperature tr...
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WO/2014/179100A1 |
A polymerizable composition is described comprising a benzoxazine, and a tosylate, which when thermolyzed, forms a (meth)acrylamide, a (meth)acrylate, a vinyl ketone, a vinyl ether or a styrenic compound.
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WO/2014/157151A1 |
A resin according to the present invention is produced by reacting a reaction product, which is a product produced by carrying out a Michael addition reaction between a component (A) as mentioned below and a component (B) as mentioned be...
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WO/2014/115637A1 |
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during co...
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WO/2014/105422A1 |
A polymerizable composition, articles, and methods are provided, wherein the polymerizable composition includes a benzoxazine, an acid-forming peroxide catalyst and optionally a film- forming polymer, a co-catalyst, a curative, or a comb...
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WO/2014/103637A1 |
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent...
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WO/2014/050878A1 |
[Problem] To provide: a highly heat-resistant resin composition which exhibits good adhesiveness at low temperatures of 180°C or less, while being free from the generation of a volatile content due to decomposition or the like even at h...
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WO/2014/050663A1 |
The objective of the present invention is to provide an adhesive sheet that is for semiconductor device production, can be firmly affixed to the pedestal of a semiconductor wafer, and is such that the pedestal is easily separated from th...
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WO/2014/034698A1 |
Provided is an adhesive agent composition containing: the latex of a high saturated nitrile rubber (A) of which the iodine value is 120 or less and which has 10 to 55 weight% of an α,β-ethylene unsaturated nitrile monomer unit, 25 to 8...
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WO/2014/032962A1 |
The present invention relates to flame-retardant polymerizable compositions comprising at least one benzoxazine compound and particular phosphorus-containing polymers. The present invention further provides adhesives, sealants or coating...
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WO/2014/029966A1 |
Polyimide formed from at least one dianhydride and at least one diamine, wherein at least 50 wt.% of the diamine is comprised of dimer fatty diamine, and a process of making the polyimide. The dianhydride is preferably a tetracarboxylic ...
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WO/2014/003056A1 |
This method for producing a semiconductor device provided with a semiconductor element obtained by dividing a semiconductor wafer into individual pieces involves: a temporary securing step in which a temporary securing film (20) is dispo...
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WO/2013/183679A1 |
[Problem] To provide a novel adhesive composition or underfill composition. [Solution] An adhesive composition or underfill composition comprising an organic solvent and a polymer in which repeating units, excluding the terminals, solely...
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WO/2013/183293A1 |
The polyimide resin composition of the present invention at least comprises a polar solvent and a polyimide resin, where the viscosity-average molecular weight of the polyimide resin is 0.6 to 1.60. 95 to 100 mol% of total monomer of the...
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WO/2013/179943A1 |
Bump electrodes can be exposed without damaging the bump electrodes, by using an adhesive sheet for use in the production of a semiconductor device having the bump electrodes, said sheet having an alkali-soluble adhesive film formed upon...
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WO/2013/173742A1 |
in one aspect, adhesives for use with a 3D printer are described herein. In some embodiments, an adhesive for use with a 3D printer comprises a first polymeric component comprising a poly(vinyl alcohol) and a second polymeric component. ...
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WO/2013/132432A9 |
Disclosed are curable polymer compositions, elastomers thereof and release layers useful in the art of printing made of the disclosed elastomers. Disclosed are also intermediate transfer members having a release layer useful in the art o...
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WO/2013/157565A1 |
Provided are a thermal adhesive polyimide film that offers excellent heat resistance and excellent adhesiveness to a metal layer, a method for producing the thermal adhesive polyimide film, and a polyimide/metal laminate using the therma...
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WO/2013/136807A1 |
Provided are a polyimide precursor varnish and polyimide resin that are capable of providing a material having excellent insulating performance and mechanical strength, and further, both heat resistance and low water absorbency; also pro...
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WO/2013/138414A1 |
Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or m...
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