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JP6639711B2 |
To provide a coverlay film indicating a low dielectric constant and a low dielectric loss tangent in a region of a frequency of 1 to 20 GHz.A coverlay film contains: a polyimide insulation layer (A); and a polyimide adhesion layer (B) pr...
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JP2020012026A |
To provide an adhesive composition which has good adhesiveness to a substrate such as an LCP and is excellent in low dielectric characteristics.The adhesive composition contains (A) a bismaleimide resin represented by general formula (1)...
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JP6613894B2 |
The present invention provides: a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive for...
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JP6600167B2 |
To provide a resin composition capable of suppressing increase in electric resistance value of a junction of an electronic component and a substrate in a durability test under high temperature and high humidity, and a conductive adhesive...
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JP2019183030A |
To provide a composition for detachment capable of preventing generation of residue derived from an adhesive on a substrate.There is provided a composition for detachment for detaching an adhesive, containing a first solvent and a second...
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JPWO2018105126A1 |
The composition contains metal particles capable of transitional liquid phase sintering and a thermoplastic resin having a thermal decomposition rate of 2.0% by mass or less measured under a thermogravimetric analyzer under a nitrogen st...
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JP6593649B2 |
Provided is an adhesive composition capable of forming an adhesive layer (a cured product) having excellent room temperature adhesiveness, moisture absorption solder heat resistance, and low dielectric characteristics. In addition, the c...
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JP6594799B2 |
To provide a heat-conductive adhesive composition which is excellent in heat conductivity, adhesiveness and heat resistance when cured, and is also excellent in storage stability before curing; a heat-conductive adhesive sheet using the ...
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JP6592640B1 |
Adhesive composition with adhesiveness, insulation reliability, flame retardancy, B-stage adhesive film brittleness resistance, improved heat resistance of humidified solder, and excellent flow-out property and B-stage adhesive film temp...
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JP2019172894A |
To provide a silicone-modified polyimide resin composition excellent in coating property, good in adhesiveness with a variety of metal frames and a semiconductor element, and giving a cured product high in moisture-proof property, exhibi...
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JP2019173023A |
To provide a sheet for semiconductor bonding that has excellent thermal conductivity and electric conductivity, and is optimal for joining of a power semiconductor element to an element support member.A sheet for semiconductor bonding is...
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JP2019172892A |
To provide a polyimide resin composition excellent in coating property, good in adhesiveness to a metal frame, a semiconductor device and the like, and giving a cured product high in moisture-proof property, exhibiting low elasticity, an...
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JP6575220B2 |
Provided is a semiconductor device capable of self-repairing cracks or peels occurring in sealing materials. A semiconductor module includes a member including a semiconductor element, an insulating substrate bonded onto one surface of t...
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JP6558055B2 |
Provided are: a resin composition which forms an insulating layer having excellent adhesion to a conductor layer even if having low illumination and having a high glass transition point: and an adhesive film, a prepreg, a printed wiring ...
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JP2019116619A |
To provide an adhesive composition for printed wiring board excellent in heat resistance.An adhesive composition for printed wiring board is blended with siloxane-modified polyimide which is represented by formulae (1) and (2) and has an...
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JP2019091934A |
To provide a circuit board which shows a low dielectric constant and a low dielectric loss tangent in a frequency region of 1-20 GHz.A circuit board comprises a polyimide insulating layer, a circuit wiring layer and a coverlay film. Supp...
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JP6529931B2 |
One aspect of the invention relates to a tissue adhesive medical product comprising at least 1% by weight of dry matter of an electrophilically activated polyoxazoline (EL-POX), said EL-POX comprising at least 2 electrophilic groups, inc...
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JP6527893B2 |
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JP6517034B2 |
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JP6515180B2 |
The present invention provides a film for circuit boards, which has low dielectric constant and low dielectric loss tangent, while having small dimensional change rate. The present invention is able to solve the above-described problem b...
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JP6514040B2 |
To provide a resin composition for semiconductor bonding which has a low elastic modulus and excellent adhesiveness and exhibits good curability even in the atmosphere, and to provide a semiconductor device having excellent solder reflow...
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JP2019067929A |
To provide a coverlay film which enables the achievement of both of colorability and an excellent high-frequency transmission property.A coverlay film comprises a polyimide insulator layer and a polyimide adhesive layer. The polyimide in...
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JP2019511587A |
(A) One or more bismaleimides (BMIs), nadiimides, or itaconimide oligomers, (B) at least one ethylenically unsaturated comonomer (eg, acrylate, methacrylate, vinyl ether, vinyl ester, styrene compound, allyl compound) , A comonomer selec...
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JP2019065258A |
To provide an aqueous adhesive composition excellent in adhesive strength and water resistance.The aqueous adhesive composition contains a polyamine (salt) (A), a resin (B), and water. The resin (B) is a resin containing formaldehyde and...
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JP6504050B2 |
The present invention provides an adhesive composition having excellent strength in a cracked state, and is an adhesive composition characterized by containing a polyimide (A),a polyfunctional epoxy compound (B), an epoxy curing agent (C...
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JP6497991B2 |
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JP6488170B2 |
To provide a coverlay film showing a low dielectric constant and a low dielectric loss tangent in the region of a frequence 1 to 20GHz.A circuit board includes polyimide insulation layer, a circuit wiring layer laminated on at least one ...
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JP6487829B2 |
To provide a thermal conductive thermosetting adhesive composition which is excellent in thermal conductivity and insulation properties, and can keep excellent insulation properties even at high temperature, and to provide a thermal cond...
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JP6474664B2 |
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JP2019026813A |
To provide a resin composition which is further excellent in gas barrier property, in particular, water vapor barrier property and oxygen barrier property, compared to a conventional resin composition.A resin composition contains an amin...
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JPWO2017169574A1 |
An object of the present invention is to provide a photosensitive adhesive composition having excellent filler dispersibility at the time of preparing a coating material, and a photosensitive adhesive sheet having high film transparency....
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JP6468440B2 |
The cyanate ester compound of the present invention is obtained by cyanating a modified naphthalene formaldehyde resin.
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JP2019019312A |
To provide a curing agent for adhesive that gives an adhesive composition having excellent adhesiveness.A curing agent for adhesive contains amidoamine containing fatty acid (C8-24) and polyalkylene (C2-3 alkylene) poly (divalent-heptava...
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JP6464721B2 |
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JP6461700B2 |
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JP6462702B2 |
The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a power semiconductor device on to a metal lead frame, which is also lead-free and places little bur...
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JP2019001875A |
To provide a temporary adhesive that has excellent adhesiveness, peelability and chemical resistance, suppresses peeling when an organic solvent is used in an electronic component processing step, and allows peeling after the processing ...
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JP6447973B2 |
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JP6436081B2 |
The present invention provides a photosensitive resin composition comprising: an alkali-soluble resin having a phenolic hydroxyl group as an end group (A); a radiation-polymerizable compound (B); and a photoinitiator (C), a film adhesive...
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JP6432620B2 |
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JP6433287B2 |
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JP2018188626A |
To provide a silicone-modified polyimide resin composition that gives a cured product having excellent application properties, having excellent adhesion to various metal frames and epoxy sealing resins, having high moisture proofness, an...
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JPWO2017135354A1 |
Provided is an aqueous adhesive capable of firmly adhering polyethylene to a plastic or metal other than polyethylene or a metal oxide. By adding a small amount of oxazoline group-containing polymer (0.01 parts by weight or more and less...
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JP6429803B2 |
A maleimide film that utilizes maleimide resin, which shows high heat history resistance and is highly reliable, and an adhesive film with dicing tape comprising the maleimide film laminated on to a dicing tape, are provided. Specificall...
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JP2018168369A |
To provide a polyimide, an adhesive, a film-like adhesive, an adhesion layer, an adhesive sheet, a copper foil with resin, a copper-clad laminate, a printed wiring board, and a multilayer wiring board and a method of producing the same.T...
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JP2018531317A |
The present invention provides compositions that include die adhesives, coatings and underfills. The compositions are useful in the fields of electronics packaging and composites. In particular, the present invention provides an epoxy-ma...
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JP6402860B2 |
Novel thermosetting resin composition is provided. A thermosetting resin composition containing a polymer having a repeating structural unit of the following Formula (1-a): (wherein each of R1 and R2 is independently a hydrogen atom, a C...
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JP6402716B2 |
A polyimide resin containing a repeating structural unit of the following formula (1), a repeating structural unit of the following formula (2), and a repeating structural unit of the following formula (A) or a repeating structural unit ...
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JP6395730B2 |
An adhesive film that can solve the problem of pickup defect and improve the yield rate of semiconductor packages is provided. Specifically, it is an adhesive film, which comprises: (A) a bismaleimide resin; (B) a radical initiator; and ...
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JP6391597B2 |
A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness is provided. Specifically, it is a conductive adhesive composition, which comprises (A) a thermosetting resin; (C) a fill...
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