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WO/2008/023670A1 |
Disclosed is a circuit connecting material for electrically connecting a first circuit member, wherein a first circuit electrode is formed on a major surface of a first circuit board, with a second circuit member, wherein a second circui...
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WO2007018120A9 |
Disclosed is an adhesive film containing a polyimide resin (A) and a thermosetting resin (B), which is characterized in that the polyimide resin (A) contains a polyimide resin having a repeating unit represented by the formula (I) below ...
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WO/2008/015852A1 |
An adhesion composition comprising (a) a thermoplastic resin, (b) a radically polymerizable compound having one or more fluorene structure in the molecule, and (c) a radical polymerization initiator.
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WO/2008/015759A1 |
This invention provides a film adhesive that can simultaneously satisfy process characteristics and reflow resistance requirements. The film adhesive is used for bonding a semiconductor element to an adherend and comprises an adhesive la...
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WO/2008/013288A1 |
A laminate of a heat resistant film and a metal foil comprises the heat resistant film and the metal foil laminated on each other via a layer of a cured product of a terminal-modified oligomer, and has the metal foil on one surface or bo...
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WO/2008/010494A1 |
Disclosed are: a polyimide resin which is soluble in an organic solvent and has a low water-absorption coefficient, excellent thermoplasticity, high heat resistance and excellent adhesion properties; a process for producing the polyimide...
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WO/2008/011452A1 |
Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and elect...
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WO/2008/010514A1 |
Disclosed is a thermocurable polyimide resin composition which can be formed into an adhesive layer for a metal-clad laminate only by removing a solvent without the need of employing a step of imidization at 300˚C or higher, which is th...
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WO/2008/004615A1 |
A polyimide resin having good solubility in a solvent, good heat resistance, a low water-absorption rate, and excellent adhesion properties; a process for producing the polyimide resin; a film comprising the polyimide resin; and a metal-...
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WO/2007/114081A1 |
Disclosed is an adhesive for metal laminates which has excellent heat resistance and desmear property and enables to bond a polymer film substrate and a metal foil at a low temperature. Also disclosed is a metal laminate using such an ad...
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WO/2007/114462A1 |
Disclosed is a resin composition characterized by containing (A) a polymerized product of a bismaleimide compound and a diamine compound, (B) an epoxy resin having 2 or more epoxy groups in a molecule, (C) a curing agent and (D) a polyet...
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WO/2007/108284A1 |
Disclosed is an adhesive film having slippability which can be suitably used as an FPC board even when a dense circuit pattern is formed thereon. Specifically disclosed is an adhesive film obtained by arranging a thermoplastic polyimide ...
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WO/2007/099801A1 |
A process for producing a multilayered polyimide film which is even in film thickness in the film-width direction and in dimensional change and has a thermoplastic polyimide layer or the like serving as an adhesive layer. The process for...
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WO/2007/100013A1 |
Housing for displays which is further enhanced in the adhesion to a glass member constituting the housing and which is sealed with such adhesion characteristics as to exhibit improved long-term durability even under high temperature and ...
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WO/2007/100016A1 |
This invention provides an envelope for a display, which, even when used in an atmosphere which undergoes a temperature change, does not substantially cause any lowering in strength of a sealed part and has improved practical durability,...
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WO/2007/095670A1 |
This invention relates to a primer composition for wood comprising a waterborne composition comprising polyamine and having a pH of at least 11.5 and a method of improving the bonding of wood with coatings such as electrostatic coatings,...
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WO/2007/097365A1 |
A pressure-sensitive adhesive layer of pressure-sensitive adhesive sheet is prepared by the use of a pressure-sensitive adhesive composition comprising (A) polyrotaxane having a linear-chain molecule passing through opening portions of a...
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WO/2007/094276A1 |
Disclosed is a curable composition which is excellent in surface curability and deep-section curability without using an organotin curing catalyst which is pointed out to be toxic. This curable composition enables to obtain a cured produ...
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WO/2007/086434A1 |
A laminate produced by coextrusion molding and including a fluorocopolymer having excellent interlaminar adhesion strength. The laminate can be made satisfactorily usable even at high temperatures or in applications where it comes into c...
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WO/2007/083623A1 |
Disclosed is a polyimide resin adhesive containing (a) a solvent-soluble polyimide and (b) at least one of alkylated melamine resins and alkylated urea resins. Also disclosed is a metal polyimide laminate obtained by using such a polyimi...
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WO/2007/075716A1 |
Provided is a heat-resistant masking tape suitable for electronics applications comprising a polyetherimide polymer film having a first surface and a second surface, an adhesive on the first surface, and a low adhesion agent on the secon...
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WO/2007/055176A1 |
A pressure-sensitive adhesive base characterized by comprising a polymer having carboxy groups in the molecule and a crosslinking agent which crosslinks the polymer. It is further characterized in that the crosslinking agent is a compoun...
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WO/2007/040261A1 |
The invention aims at providing a carbodiimide-modified polyolefin adhesive which is excellent in both bond strength under room-temperature atmosphere and bond strength under high-temperature atmosphere even when the molding is conducted...
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WO/2007/029534A1 |
Disclosed is a method for producing a polyamide acid containing ultrafine metal particles, which is characterized in that metal ions are adsorbed onto polyamide acid fine particles by bringing an aqueous solution containing a water-solub...
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WO/2007/029609A1 |
Provided is a heat resistant adhesive sheet for suppressing fluctuation of dimensional stability of a flexible printed board, especially a double layer flexible printed board, demand of which is further increasing recently and in which h...
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WO/2007/010902A1 |
Disclosed are: an adhesive film for use in a semiconductor, which enables the firm adhesion of a lead frame to a semiconductor chip at a lower gluing temperature than that for a conventional adhesive film comprising a polyimide resin wit...
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WO/2007/004569A1 |
A photosensitive adhesive composition comprising (A) polyimide of 80 to 180 mg/KOH acid value having carboxyl as a side chain, (B) radiation-polymerizable compound and (C) photopolymerization initiator.
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WO/2006/137369A1 |
Disclosed is a highly reliable material for flexible printed wiring boards which enables fine wiring. Specifically disclosed are a compound represented by the general formula (I) below, and a resin composition containing such a compound ...
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WO/2006/132165A1 |
[PROBLEMS] To provided an adhesive composition for semiconductor that that permits handling without the occurrence of cracking or peeling even after flexing and at the time of laminating, permits laminating on the electrode side of a sem...
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WO/2006/115146A1 |
Disclosed is an easily processable adhesive sheet with a base which is used for flexible printed circuit boards. This adhesive sheet is prevented from dropping resin composition particles during processing of a multilayer flexible printe...
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WO/2006/082828A1 |
With respect to the dimensional change of flexible metal-clad laminate, although attention has been drawn to only the direction of film flow (referred to as MD direction) and the transverse direction of film (referred to as TD direction)...
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WO/2006/064700A1 |
This invention provides a polyimide multilayered adhesive film, which can accurately measure the thickness of each layer by a infrared absorption method, and a process for producing the same. The adhesive film comprises a highly heat-res...
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WO/2006/033267A1 |
A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal strain to be imposed on the material; and an adhesive film and a flexible metal-clad laminate each ...
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WO/2006/019650A1 |
Polymer bonding compositions having greater than about 1 milliequivalent primary amine/100 grams of the polymer, more preferably greater than about 3 milliequivalent non-tertiary amine/100 grams of the polymer. Preferably the polymer is ...
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WO/2006/013950A1 |
A material for plating which can be suitably used in printed wiring board manufacture and the like, the material for plating and a solution having excellent adhesion to an electroless plating film formed on the material surface even when...
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WO/2006/011404A1 |
Disclosed is an adhesive film which enables to obtain a flexible metal clad laminate which is suppressed in dimensional change when produced by heat roll lamination. Such an adhesive film comprises a heat-resistant layer containing a hig...
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WO/2005/113696A1 |
Disclosed is an adhesive tape serving as a dicing tape in a dicing step which has excellent dicing properties and pick-up properties. Also disclosed is a bonding tape exhibiting excellent bonding reliability in a step for bonding a semic...
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WO/2005/111165A1 |
Disclosed is a method for producing an adhesive film having remarkably higher productivity than the conventional methods. Specifically disclosed is a method for producing an adhesive film by forming an adhesive layer containing a thermop...
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WO/2005/111164A1 |
An adhesive film with which a flexible metal-clad laminate inhibited from suffering a dimensional change is obtained through laminating; and a flexible metal-clad laminate comprising the adhesive film and a metal foil bonded thereto. The...
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WO/2005/105943A1 |
A resin paste for die bonding which can be easily supplied/applied by a printing method. The resin paste for die bonding comprises: a polyimide resin (PI) obtained by reacting one or more tetracarboxylic dianhydrides (A) comprising a tet...
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WO/2005/090508A1 |
A reactive hot melt composition, having a softening point of at least 50 °C, and being curable on heating to a temperature of 150 °C. The composition comprises a blend of (a) a macrocyclic oligomer having a softening point of at least ...
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WO/2005/085384A1 |
Difunctional oxazoline resins, which may be produced in a convenient one-step reaction from an arylalkylene dinitrile by reaction with an amino alcohol, are used in compositions with an additional curable compound or resin containing one...
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WO/2005/083771A1 |
An assembly of a semiconductor die attached to a substrate is made with a composition comprising compounds that contain an oxazoline functionality and an electron acceptor or an electron donor functionality. Electron donor functionalitie...
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WO/2005/068193A1 |
An adhesive film from which there can be obtained a flexible metal-clad laminate having any occurrence of dimensional change suppressed in the fabrication according to laminating method. There is provided an adhesive film comprising a po...
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WO/2004/101701A1 |
An adhesive resin composition for use in preparing an adhesive agent in the form of a film being excellent in the adhesiveness at a low temperature and in the resistance to heat; an adhesive agent in the form of a film comprising the adh...
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WO/2004/099331A2 |
The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended ma...
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WO/2004/088707A1 |
A nonlead organic sealing material capable of sealing at below 400°C and excelling in high-temperature strength. In particular, an organic sealing material for sealing constituent members of a vacuum envelope of an image display unit, w...
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WO/2003/102049A1 |
The adhesive resin of the invention consists of a polyimide resin obtained by reacting a diamine component containing the compound (1) as the essential component with a tetracarboxylic acid dianhydride component. (1) The diamine componen...
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WO/2003/082940A1 |
In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the mac...
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WO/2003/068703A1 |
The invention relates to aqueous dispersions consisting of polycarbodiimides which essentially carry no carboxyl groups. Said polycarbodiimides are characterised in that (I) they are obtained from polyisocyanates of general formula (I) w...
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