Title:
ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/188506
Kind Code:
A1
Abstract:
The present invention provides: a resin composition for forming a low-dielectric adhesive layer that has excellent 5G-compatible electrical properties (low-dielectric properties), ensures high adhesiveness, and exhibits a small linear coefficient of thermal expansion (CTE); and an adhesive composition containing said resin composition. This adhesive composition contains a resin composition containing: a maleimide resin (A) having a molecular weight of 1,000 or more; a benzoxazine resin (B); and an alkenyl resin (C) having a 1-alkenyl group. In the resin composition, the mix ratio of the benzoxazine resin (B) and the alkenyl resin (C) is 1:10 to 10:1.
Inventors:
MOMMA SHIORI (JP)
YOSHIDA KAZUYOSHI (JP)
KATAGIRI WATARU (JP)
YOSHIDA KAZUYOSHI (JP)
KATAGIRI WATARU (JP)
Application Number:
PCT/JP2022/041028
Publication Date:
October 05, 2023
Filing Date:
November 02, 2022
Export Citation:
Assignee:
SHIN ETSU POLYMER CO LTD (JP)
International Classes:
C09J201/06; B32B27/00; B32B27/34; C09J7/30; C09J179/02; C09J201/02; H05K1/03
Foreign References:
| US20180371243A1 | 2018-12-27 | |||
| CN113045896A | 2021-06-29 | |||
| CN103265791A | 2013-08-28 | |||
| JP2016196549A | 2016-11-24 | |||
| JP2021152182A | 2021-09-30 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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