Title:
MULTILAYER POLYIMIDE FILM, METAL-CLAD LAMINATED PLATE, AND METHOD FOR PRODUCING MULTILAYER POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2022/080314
Kind Code:
A1
Abstract:
This multilayer polyimide film (10) comprises: a non-thermoplastic polyimide layer (11); and an adhesive layer (12) which is disposed on at least one surface of the non-thermoplastic polyimide layer (11) and includes polyimide. The non-thermoplastic polyimide has a dielectric loss tangent of 0.0030 or less at a frequency of 10 GHz, a temperature of 23 °C, and a relative humidity of 50%. The adhesive layer (12) does not have a melting peak or has a melting heat of 1.0 J/g or less at a melting peak in a temperature range of 100-420 °C. The polyimide included in the adhesive layer (12) has: at least one tetracarboxylic dianhydride residue selected from the group consisting of a pyromellitic acid dianhydride residue and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride residue; and at least one diamine residue selected from the group consisting of a 1,3-bis(4-aminophenoxy)benzene residue and a 4,4'-diamino-2,2'-dimethylbiphenyl residue.
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Inventors:
KONO FUMIYA (JP)
AKIYAMA TAKAYOSHI (JP)
AKISADA MAMI (JP)
UNO MARI (JP)
AKIYAMA TAKAYOSHI (JP)
AKISADA MAMI (JP)
UNO MARI (JP)
Application Number:
PCT/JP2021/037569
Publication Date:
April 21, 2022
Filing Date:
October 11, 2021
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/34; B32B7/025; B32B15/088; C08G73/10; C09J7/25; C09J7/30; C09J179/08; H05K1/03
Domestic Patent References:
| WO2018061727A1 | 2018-04-05 |
Foreign References:
| JP2018145303A | 2018-09-20 | |||
| JP2019014062A | 2019-01-31 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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