TEMPORARY BONDING METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE FOR TEMPORARY BONDING, AND LAMINATE FOR DEVICE WAFER PROCESSING

WIPO Patent Application WO/2021/251018

A1

The present invention is a temporarily bonding method for bonding, to a support body via a temporary bonding layer, a wafer comprising a first principal surface including a circuit and a second principal surface that is to be processed and is on the opposite side from the first principal surface, wherein the temporary bonding method is characterized by performing temporary bonding of the first principal surface of the wafer and the support body via the temporary bonding layer that includes a dry adhesive fiber structure having a plurality of columnar structures. This configuration enables the provision of a method for temporary bonding by which the wafer and the support body can be temporarily bonded with ample strength, the wafer can be easily separated from the support body, and temporary bonding and separation can be repeated.

OOWADA TAMOTSU (JP)
TAGAMI SHOHEI (JP)
MUTO MITSUO (JP)
TANABE MASAHITO (JP)

PCT/JP2021/016677

December 16, 2021

April 26, 2021

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SHINETSU CHEMICAL CO (JP)

C09J179/08; C09J183/04; C09J201/00; H01L21/02

WO2009128342A1

2009-10-22

JP2019504497A	2019-02-14
JP3220830U	2019-04-11
US20190088524A1	2019-03-21
JP2004064040A	2004-02-26
JP2006328104A	2006-12-07
US7541264B2	2009-06-02
US20150368519A1	2015-12-24
US9566722B2	2017-02-14

APPLIED MATERIAL & INTERFACES, vol. 1, no. 4, 2009, pages 849 - 855
J. ADHESION SCI. TECHNOL., vol. 17, no. 8, pages 1055 - 1073

YOSHIMIYA Mikio et al. (JP)

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