Title:
RESIN COMPOSITION, CURED MATERIAL, SHEET, LAMINATE, AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/025123
Kind Code:
A1
Abstract:
A resin composition comprises (A) a bismaleimide resin formed by reacting aromatic tetracarboxylic acid (a1), a dimer diamine (a2), and maleic anhydride (a3); and (B) an inorganic filler that has been surface-treated with a silane compound. The content of the inorganic filler (B) is 5-55 mass% with respect to the total amount of the solid fraction in the composition.
Inventors:
SATO KITARU (JP)
KAMEI JUNICHI (JP)
KOMIYA SOUICHIROU (JP)
KAMEI JUNICHI (JP)
KOMIYA SOUICHIROU (JP)
Application Number:
PCT/JP2021/027925
Publication Date:
February 03, 2022
Filing Date:
July 28, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L79/00; B32B27/34; C09J7/35; C09J11/04; C09J179/04; H05K1/03
Domestic Patent References:
| WO2019188187A1 | 2019-10-03 |
Foreign References:
| JP2006218767A | 2006-08-24 | |||
| JP2017125128A | 2017-07-20 | |||
| JP2019173010A | 2019-10-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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