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WO/2017/112906A1 |
An abrasive article can includes a body having an abrasive portion. The abrasive portion can include a filler composition including pyrite, in particular, pyrite having a sulfur content of at least at least 43 wt% for a total weight of t...
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WO/2017/102826A1 |
The present invention concerns a method for polishing a phosphate glass or fluorophosphate glass substrate comprising polishing the surface of said substrate using at least a formulation having a pH comprised between 7 and 14 comprising ...
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WO/2017/100518A1 |
A process for producing an aqueous polymeric dispersion may include coextruding a copolymer of an α-olefin and an α, β- unsaturated carboxylic acid to form a combined polymer, and a wax. The process may include emulsifying the combine...
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WO/2017/085904A1 |
The present invention provides a polishing composition containing abrasive grains, characterized in that: the surfaces of the abrasive grains have been modified by two or more organic compounds; the two or more organic compounds each hav...
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WO/2017/074800A1 |
Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing c...
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WO/2017/074801A1 |
Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
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WO/2017/070074A1 |
The invention provides a chemical-mechanical polishing composition that contains (a) abrasive particles, (b) an azole compound having an octanol-water logP of about 1 to about 2, (c) a cobalt corrosion inhibitor, wherein the cobalt corro...
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WO/2017/061109A1 |
The purpose of the present invention is to provide is an abrasive agent for a magnetic disk, the agent having a fast polishing speed with respect to an object to be polished. Provided is an abrasive agent for a magnetic disk comprising 2...
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WO/2017/057155A1 |
[Problem] The objective of the present invention is to provide a polishing composition with which it is possible to polish an article to be polished at higher speeds. [Solution] Provided is a polishing composition used for polishing an a...
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WO/2017/057156A1 |
[Problem] The present invention provides a means that is capable of achieving sufficient planarization of the surface of an object of polishing, said object containing two or more different materials. [Solution] The present invention is ...
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WO/2017/057906A1 |
The present invention relates to a CMP slurry composition, for polishing an organic film, comprising: cerium salts comprising ultrapure water, abrasives and cerium (IV) ions; and an oxidizing agent, wherein the oxidizing agent has an oxi...
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WO/2017/057478A1 |
[Problem] To provide a polishing composition with which an object to be polished that includes oxygen atoms and silicon atoms can be polished at a high polishing speed, and with which the scratching of the surface of the object to be pol...
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WO/2017/051770A1 |
Provided is an abrasive material composition with which it is possible to not only achieve a high polishing rate without requiring the use of alumina particles but also obtain satisfactory surface smoothness and edge surface shape. The a...
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WO/2017/047307A1 |
Provided is a polishing composition in which the ratio of the rate of polishing polysilicon or amorphous silicon to the rate of polishing silicon nitride is high, the rate of polishing polysilicon or amorphous silicon is high, and the ra...
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WO/2017/044340A1 |
The invention provides a chemical mechanical polishing composition comprising, consisting essentially of, or consisting of (a) about 0.01 wt.% to about 1 wt.% of wet process ceria, (b) about 10 ppm to about 200 ppm of a cationic polymer ...
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WO/2017/040571A1 |
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.
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WO/2017/030710A1 |
A slurry composition for use in chemical-mechanical polishing sapphire substrates and includes an alkaline pH adjuster and an accelerant.
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WO/2017/025536A1 |
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy and (iii) Ti N and /or TaN, wherein the CMP composition (Q) comprises (E) ...
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WO/2017/023677A1 |
This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weig...
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WO/2017/011115A1 |
The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and one of a...
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WO/2016/208301A1 |
Provided is a polishing composition in which the abrasive grains are less likely to precipitate and the abrasive grains that have precipitated and agglomerated redisperse easily. The polishing composition contains abrasive grains, a liqu...
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WO/2016/207808A1 |
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-cross linked functionalised lignin oligomer, wherein the lignin oligomer: (a) has a number average molecular weight (Mn) i...
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WO/2016/207811A1 |
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a non-crosslinked functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of ligni...
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WO/2016/207809A1 |
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) ...
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WO/2016/207810A1 |
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a functionalised lignin oligomer, wherein the functionalised lignin oligomer: (a) has an average number of lignin monomers of fr...
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WO/2016/207812A1 |
A consumer goods product comprising a consumer goods product ingredient and a cross-linked co-polymer of a lignin oligomer and a vinyl monomer, wherein the lignin oligomer has: (a) comprises less than 1wt% sulphur content; (b) has a numb...
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WO/2016/207807A1 |
The present invention relates to a consumer goods product comprising a consumer goods product ingredient and a lignin oligomer, wherein the lignin oligomer: (a) comprises less than 1wt% sulphur content; (b) has a number average molecular...
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WO/2016/201191A1 |
Floor coating compositions and methods of forming a floor coating composition are provided. The floor coating composition includes an acrylic wax, water, and an indicator that includes a color at a first pH and that is colorless at a sec...
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WO/2016/200941A1 |
The present invention refers to a polishing composition designed for conditioning surfaces, such as gears, seals, rings, and others. The composition is an oil in water emulsion, wherein the improvement was achieved when using a synergist...
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WO/2016/194614A1 |
This invention enables a high polishing speed in the polishing of ceramics that are used in electronic devices and include an oxide crystal, or the like, by suppressing the occurrence of defects such as scratches. A polishing composition...
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WO/2016/191248A1 |
A polishing composition with improved stability at low temperatures comprising from 10 to 50% by weight of water, from 10 to 60 % by weight of hydrocarbons, from 0.5 to 5% by weight of one or more organic acids and including its salts wh...
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WO/2016/186214A1 |
The present invention provides a method for manufacturing a glass substrate, in which polishing speed can be improved in a polishing process of using cerium oxide as polishing abrasive grains to polish the surface of a glass substrate. T...
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WO/2016/181600A1 |
The present invention is a polishing agent for synthetic quartz glass substrates which comprises abrasive grains, a polishing accelerator, and water, characterized in that the abrasive grains are wet-process ceria particles and that the ...
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WO/2016/150176A1 |
Provided is a cobalt-containing doped silicon dioxide nano-composite abrasive grain sol, a preparation method thereof comprising: mixing, by weight percentage, 0.43 wt% of cobalt nitrate solution and 2.5 wt% of silicic acid solution acco...
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WO/2016/143323A1 |
Provided are a composition for grinding, which can achieve both excellent surface quality and high grinding speed, and a method for grinding a silicon substrate. The composition for grinding contains abrasive grains, a basic compound, an...
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WO/2016/143797A1 |
This polishing agent for resin polishing contains: abrasive particles; a water-soluble polymer that has an ether bond; an organic solvent; and water. Therein, the abrasive particles have a positive charge within the polishing agent, and ...
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WO/2016/141259A1 |
The invention provides chemical-mechanical polishing compositions and methods of chemically-mechanically polishing a substrate, especially a substrate comprising a silicon oxide layer, with the chemical-mechanical polishing compositions....
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WO/2016/141260A1 |
The invention provides a chemical-mechanical polishing composition including wet-process ceria particles having a median particle size of about 25 nm to about 150 nm and a particle size distribution of about 300 nm or more, and an aqueou...
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WO/2016/140246A1 |
A CMP polishing liquid for polishing a ruthenium-based metal, wherein: the CMP polishing liquid contains abrasive grains, a metal oxidant, and water; the metal oxidant has an oxidation-reduction potential accompanied by exchange of hydro...
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WO/2016/136342A1 |
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently control the polishing rate for an object to be polished having a silicon-silicon bond. [Sol...
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WO/2016/136177A1 |
A composition for polishing, which is used for polishing of the surface of an object to be polished, said surface containing an oxide of a metal or a semimetal or a composite material of these oxides, and which contains at least water an...
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WO/2016/136314A1 |
A cerium-free polishing material is provided which has an excellent polishing speed, and which can cut production costs and has improved production efficiency; also provided is a production method for conveniently obtaining said polishin...
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WO/2016/136162A1 |
Provided is a polishing composition that, even when used for polishing an object to be polished containing a transition metal having a standard electrode potential between -0.45V and 0.33V inclusive, is less likely to etch or corrode the...
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WO/2016/136447A1 |
A polishing method is provided which yields a negatively charged substrate with excellent surface smoothness with good productivity while achieving high polishing speeds. Also provided is a method for achieving a negatively charged subst...
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WO/2016/132952A1 |
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently suppress the polishing rate for an object to be polished having a silicon-nitrogen bond, su...
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WO/2016/132951A1 |
[Problem] To provide a polishing composition with which it is possible, in at least one of the acidic, neutral, and basic ranges, to sufficiently control the polishing rate for an object to be polished having a silicon-oxygen bond, such ...
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WO/2016/129508A1 |
Provided is a polishing composition with which simple silicon substances can be polished at higher speeds. The present invention is a polishing composition to be used for polishing objects to be polished that comprise a simple silicon ...
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WO/2016/129164A1 |
Provided is a glass article which has excellent surface smoothness. The glass article 1 comprises a polished main surface, the arithmetic average roughness (Ra) of the polished main surface being 0.2 nm or less.
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WO/2016/115096A1 |
Chemical Mechanical Planarization(CMP) polishing compositions comprising composite particles, such as ceria coated silica particles, offer low dishing, low defects, and high removal rate for polishing oxide films. Chemical Mechanical Pla...
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WO/2016/107406A1 |
The present invention relates to a chemically mechanical polishing liquid and an application thereof. The polishing liquid comprises grinding particles, an amino silane reagent, and water. The present invention is applicable to polishing...
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