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WO/2015/170743A1 |
This polishing solution composition for a sapphire plate contains alumina particles, an anionic polymer, and an aqueous medium. One example of a manufacturing method for a sapphire plate according to the present invention includes a step...
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WO/2015/159506A1 |
This invention provides a composition for polishing silicon wafers. Said composition, which excels at reducing haze on the surface of silicon wafers, contains abrasive grains, a silicon-wafer polishing accelerator, an amide-group-contain...
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WO/2015/152151A1 |
The invention of the present application relates to: a polishing composition comprising water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and a NMR specific surface area of 10 m2/g or more; and a pol...
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WO/2015/146363A1 |
This polishing composition includes: abrasive grains of at least one type selected from calcium carbonate, barium carbonate, manganese dioxide, zirconia, and alumina; and a pH adjustment agent. The polishing composition has a pH of at le...
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WO/2015/146942A1 |
Provided is a polishing agent composition which enables both the achievement of high polishing rate and the achievement of good surface smoothness and good end face shape at the same time without using alumina particles. A polishing agen...
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WO/2015/148163A1 |
An aqueous composition comprising: (a) an aromatic-acrylic polymer comprising from 3 to 11 wt% polymerized units of C3-C6 carboxylic acid monomers and from 0.2 to 3 wt% polymerized units of anti-agglomerating monomers; (b) a reactive pol...
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WO/2015/146941A1 |
Provided is a polishing agent composition which enables both the achievement of high polishing rate and the achievement of good surface smoothness at the same time without using alumina particles. A polishing agent composition which cont...
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WO/2015/140850A1 |
Provided is a polishing composition which exerts high polishing speed and with which it is possible to stably polish a substrate having an organic layer in a short time. Also provided is a polishing method using said polishing compositio...
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WO/2015/123743A1 |
The present patent relates to a composition for cleaning, protecting and revitalizing surfaces in general and resulting product, pertaining to the field of chemistry, specifically a composition containing water, silica, hydrogen peroxide...
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WO/2015/118927A1 |
[Problem] To polish the surface of an object material at a high removal rate and into a high-quality surface. [Solution] The object material is polished by wet polishing. A slurry comprises polishing abrasive particles dispersed in pure ...
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WO/2015/114489A1 |
A chemical mechanical polishing (CMP) composition comprising (A) Colloidal or fumed inorganic particles or a mixture thereof, (B) a poly(amino acid) and or a salt thereof,and (M) an aqueous medium.
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WO/2015/107992A1 |
The purpose of the present invention is to provide a kit for producing a polishing composition, the kit enabling the production of a polishing composition that exhibits high pH maintainability, and the kit exhibiting excellent storage st...
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WO/2015/095154A9 |
CMP processes, tools and slurries utilize metal oxide-polymer composite particles that include metal oxide particles and a polymer core. The metal oxide particles are modified with a modifying agent and are partially or fully embedded wi...
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WO/2015/101034A1 |
A chemical mechanical polishing slurry including chemical solution, and organic and inorganic particles suspended in the chemical solution is disclosed. The organic particles are formed by monomer-polymerized long chain structures and/or...
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WO/2015/096627A1 |
The invention relates to the application of a chemical mechanical polishing liquid for silicon polishing. The polishing liquid contains abrasive particles and organic amine. The polishing liquid of present invention has a high silicon-re...
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WO/2015/096631A1 |
Disclosed is a chemical mechanical polishing slurry for aluminum. The polishing slurry contains at least one kind of metal ions. With the addition of the metal ions, the polishing slurry of the present invention can have a high aluminum ...
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WO/2015/096629A1 |
The present invention relates to a chemical-mechanical polishing liquid applied to the STI field, containing a cerium oxide abradant, a cyclic oligosaccharide compound, an organic high-molecular polymer and an organic polyacid. The cycli...
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WO/2015/096630A1 |
The present invention relates to a chemical mechanical polishing liquid for polishing a cobalt barrier layer, the chemical mechanical polishing liquid containing abrasive particles, an azole compound, a complexing agent, a polyalkoxide a...
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WO/2015/091495A1 |
The present invention relates to a suspension of cerium oxide particles in a liquid phase, in which said particles comprise secondary particles comprising primary particles, and a process for preparing said liquid suspension in which the...
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WO/2015/086762A1 |
Gloss enhancing compositions for polymer surfaces and polishing compositions for stainless steel surfaces are microemulsions of a diaminoorganopolysiloxane, a film forming acrylate polymer, and a wax. The compositions exhibit high gloss,...
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WO/2015/060293A1 |
This polishing liquid composition for silicon wafers contains 0.01-0.5% by mass of silica particles, a nitrogen-containing basic compound and a water-soluble polymer. The water-soluble polymer contains a constituent unit represented by g...
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WO/2015/053207A1 |
A semiconductor wetting agent including an aqueous polymer having within a molecule 70-99 mol% of the structural unit represented by formula (1), and 1-30 mol% of the specific structural unit represented by formula (2). [-CH2CH(OH)-] (1)...
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WO/2015/052988A1 |
A polishing agent which contains water, abrasive grains containing a hydroxide of a tetravalent metal element, a polymerization product of α-glucose and a cationic polymer, and wherein the polymerization product of α-glucose has a weig...
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WO/2015/050260A2 |
Provided are: a polishing agent composition that contains silica particles, an alkali substance, a water-soluble synthetic polymer, and water, and that is characterized by the water-soluble synthetic polymer having structural unit (1), t...
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WO/2015/045757A1 |
The present invention provides a polishing composition having excellent storage stability. The present invention is a polishing composition comprising abrasive grains and an oxidizing agent containing a halogen atom, wherein a value (A/B...
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WO/2015/041942A1 |
An aqueous composition having three components. The first component is an aromatic-acrylic polymer. The second component is an epoxy silane. The third component is a nonionic surfactant having a C10-C20 alkyl group and two to four polyme...
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WO/2015/040979A1 |
The present invention is a polishing composition containing: silica having functional groups that satisfy at least one of the following conditions (1) and (2), the functional groups immobilized on the surface of the silica; and a pH adju...
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WO/2015/024610A1 |
The invention relates to the use of a silica-based polishing agent for polishing an optical glass.
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WO/2015/019849A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and cleaning performance. This slurry for CMP...
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WO/2015/019911A1 |
The problem addressed by the present invention is to provide a slurry for CMP, with which it is possible to suppress polishing scratches and dishing, and to achieve a higher polishing speed and dispersion stability. This slurry for CMP i...
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WO/2015/019706A1 |
[Problem] To provide a method for producing a polished object which is capable of reducing the haze level of the surface of an object to be polished, while effectively reducing defects. [Solution] A method for producing a polished object...
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WO/2015/008193A1 |
Described is a chemical-mechanical polishing (CMP) composition comprising abrasive particles containing ceria.
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WO/2015/005200A1 |
[Problem] To provide a means which is capable of reducing level difference defects such as dishing, while maintaining a high polishing rate, and which is also capable of improving storage stability with respect to a polishing composition...
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WO/2014/208400A1 |
This method for producing an SiC substrate comprises at least a CMP step wherein an Si surface (1a) and a C surface (1b) of an SiC substrate (1) are subjected to double side polishing by a Chemical Mechanical Polishing (CMP) method at a ...
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WO/2014/195932A1 |
A wet napkin sealed in a packaging wherein the said wet napkin is moisturized with cleaning materials or with shining and protective materials aimed for cleaning and protecting plastic materials including car headlights
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WO/2014/195167A1 |
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) elemental germanium or (ii) Si1-xGex with 0.1 ≤ x < 1, wherein the CMP composition (Q) consists essentiall...
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WO/2014/185835A1 |
The present invention regards a method for manufacture of an article (ART) adapted to be mountable on a sub-structure (54) of an aerial vehicle (23), the article comprises an outer surface (3) serving as an aerodynamic surface during use...
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WO/2014/179419A1 |
CMP processes, tools and slurries utilize composite particles that include core particles having organosilica particles disposed about the core particles. Using these processes, tools and slurries can enhance removal rates, reduce defect...
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WO/2014/172604A1 |
The present invention provides an antistatic wax, which comprises: 1 part by weight of a wax; 1.2 to 10 parts by weight of an imidazole-based amphoteric surfactant; and 3-1000 parts by weight of a solvent.
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WO/2014/156381A1 |
Provided is a polishing composition which is able to be stably used for the polishing of a material that contains a metal, especially tungsten, and which is capable of improving the polishing rate. The present invention is a polishing co...
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WO/2014/148399A1 |
Provided is a polishing composition that contains a water-soluble polymer having a molecular structure that contains a plurality types of repeating units having different SP values, in which an etching rate and abrasive grain adsorption ...
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WO/2014/126051A1 |
Provided is a polishing composition which includes abrasive grains, a water-soluble polymer, and water. Measured using dynamic light scattering, the volume average particle size (DA) of particles included in the polishing composition whe...
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WO/2014/122976A1 |
The problem addressed by the present invention is to provide a polishing material slurry that can obtain a high polishing speed and superior durability, and that suppresses the amount of cerium oxide used. The polishing material slurry c...
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WO/2014/122982A1 |
The problem to be solved by the present invention is to provide a polishing slurry that makes it possible to reduce the amount of cerium oxide used, does not cause clumping of polishing particles during long-term storage, has outstanding...
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WO/2014/119301A1 |
The present invention provides a polishing composition having a high ratio of a polishing rate of a silicon nitride (SiN) surface to a polishing rate of a silicon oxide surface and/or a high ratio of a polishing rate of a SiN surface to ...
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WO/2014/117066A1 |
A tungsten jewelry resurfacing kit for consumer end use comprises a buffing cloth; a container of tungsten resurfacing compound having less than 50 ml of resurfacing compound, wherein the resurfacing compound comprises a mixture of i) a ...
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WO/2014/112857A1 |
The invention relates to a surface treatment process and to polishing operations comprising the following steps: - The impurities which exist in the crude phosphate are removed using a sieve. - The phosphate is washed with distilled wate...
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WO/2014/102249A1 |
Provided is a method for the formation of particulate compounds of selectable size characteristics, which method includes supporting a slurried particulate precursor on a porous support; heating the support such that aggregates of the pa...
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WO/2014/089906A1 |
An application of a phosphate ester surfactant in self-stopping polishing. The phosphate ester surfactant at least comprises a structural formula (1) and/or a structural formula (2), wherein X=RO, RO-(CH2CH2O)n, or RCOO-(CH2CH2O)n; R is ...
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WO/2014/090890A1 |
This invention relates to a composition for the brightening and/or passivating of stainless steel after pickling. The invention is based on the discovery that the presence of organic compounds containing multiple hydroxyl groups with at ...
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