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WO/2018/055985A1 |
[Problem] To provide a polishing composition with which it is possible to effectively improve the polishing rate of an object to be polished. [Solution] A polishing composition containing abrasive grains, a polishing accelerator having a...
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WO/2018/057674A1 |
A CMP slurry including a carrier, a particulate material within the carrier including an oxide, carbide, nitride, boride, diamond or any combination thereof, an oxidizer including at least one material selected from the group of peroxide...
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WO/2018/056122A1 |
Provided is a slurry containing abrasive particles, glycol, and water, wherein the average particle size of the abrasive particles is 120 nm or less, and the pH of the slurry is at least 4.0 and less than 8.0. Also provided is a polishin...
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WO/2018/048068A1 |
The present invention relates to surface-modified colloidal ceria abrasive particles, a preparation method therefor, and a polishing slurry composition containing the same. According to one embodiment of the present invention, the surfac...
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WO/2018/038885A1 |
An acidic slurry composition for use in chemical-mechanical polishing including an acid pH adjuster and a cationic polishing suppressant comprising a quaternized aromatic heterocycle. The quaternized aromatic heterocycle imparts a polish...
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WO/2018/026099A1 |
The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a...
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WO/2018/020931A1 |
Abrasive grains according to the present invention are abrasive grains in which the surfaces thereof are coated with an additive and that are formed of inorganic abrasive particles having a positive zeta potential at pH 8 or lower. Also,...
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WO/2018/012173A1 |
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). This polishing composition includes silica of which the maximum peak h...
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WO/2018/013847A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive, (b) a cobalt accelerator, and (c) an oxidizing agent that oxidizes a metal, wherein the polishing composition has a pH of about 4 to about 10....
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WO/2018/012174A1 |
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). The present invention relates to a polishing composition which include...
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WO/2018/012176A1 |
The present invention provides a polishing composition which is capable of polishing an object to be polished, with high polishing speed, and few scratches (defects). This polishing composition includes silica of which the maximum peak t...
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WO/2018/012175A1 |
The present invention provides a process for producing a polishing composition with which a work can be polished at a high polishing rate with few scratches (defects). The present invention relates to a process for producing a polishing ...
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WO/2018/004142A1 |
A CMP slurry composition for a metal film of the present invention comprises abrasive particles, a solvent, an oxidant, metal ions, and a reductant.
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WO/2017/219499A1 |
A method for preparing an aluminium oxide polishing solution, comprising the following steps: 1) mixing a silane coupling agent, ethanol and water to form a hydrolysate; 2) adding the hydrolysate to an aluminium oxide powder under the co...
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WO/2017/223225A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) wet-process ceria abrasive, (b) a surfactant comprising an amine-containing anchor group and ethylene oxide-propylene oxide stabilizing group, wherein the ...
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WO/2017/223308A1 |
A stable aqueous, semi-aqueous or non-aqueous suspension medium to suspend inert organic or inorganic particles in the suspension medium containing gel particles as a separating agent for the inert organic or inorganic particles, which g...
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WO/2017/214995A1 |
Provided are a polishing agent, a copper part and a polishing treatment method therefor. The polishing agent is used for pre-treating the surface of a copper part, and comprises, with a total of 100 parts by weight, the following ingredi...
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WO/2017/212874A1 |
The present invention addresses the problem of providing: a polishing liquid that, when used for CMP, is not likely to cause flaws in a polished object; and a chemical mechanical polishing method. This polishing liquid is for use in chem...
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WO/2017/214185A1 |
Described are slurry compositions useful in chemical-mechanical processing of a nickel layer of a substrate, wherein the slurry compositions contain abrasive particles that include silica particles that are cationically charged at a low pH.
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WO/2017/208667A1 |
The present invention addresses the issue of providing a polishing liquid whereby abrasive grains in the polishing liquid are unlikely to agglomerate and, even when used in CMP, defects are less likely to occur in a polished surface. The...
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WO/2017/204035A1 |
The invention provides a polishing solution that can obtain an excellent polishing rate when applied to CMP and is less likely to cause dishing of the surface to be polished, a method for producing a polishing solution, a polishing solut...
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WO/2017/200297A1 |
Disclosed is a slurry composition for chemical-mechanical polishing, the composition exhibiting a small change in pH over time in an acidic atmosphere, thereby being easily storable for a long time. The slurry composition for chemical-me...
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WO/2017/200211A1 |
The present invention relates to a slurry composition for polishing a high stepped region. The slurry composition for polishing a high stepped region according to an embodiment of the present invention comprises: a polishing liquid conta...
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WO/2017/195968A1 |
The present invention relates to: a CMP slurry composition for polishing copper, containing an oxidizing agent, a corrosion inhibitor, a chelating agent, a solvent, and a copolymer of (meth)acrylic acid and a (meth)acrylamide compound, w...
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WO/2017/186283A1 |
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an ...
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WO/2017/183290A1 |
The present invention is a polishing material for synthetic quarts glass substrates which comprises abrasive grains and water, characterized in that the abrasive grains comprise ceria particles as base particles and, fixed to the surface...
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WO/2017/177993A1 |
The invention relates to the field of emulsions of natural waxes in water and alcohol and to their use in sustainable/natural cleaning, preservative and care agents.
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WO/2017/170179A1 |
Provided is a polishing composition which renders smoothness with higher accuracy possible. The polishing composition includes abrasive grains and a basic compound and further contains a water-soluble high-molecular-weight compound and a...
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WO/2017/170061A1 |
Provided is a polishing composition for polishing a material to be polished. This polishing composition contains diamond abrasive and non-diamond abrasive, and in terms of weight, the ratio (B/A) of the content of non-diamond abrasive (B...
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WO/2017/162462A1 |
Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a p...
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WO/2017/161510A1 |
A spraying liquid vehicle wax composition comprises the following components: wax, solvent oil, silicone oil, abrasive particles, sodium alkyl benzene sulfonate, 3-phosphoglyceride, silicone grease and water. The composition has the adva...
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WO/2017/161509A1 |
Disclosed in the present invention is a composition for a brushing-free shoe polish. The composition comprises the following components: beeswax in parts by weight, resin in parts by weight, a leather softener in parts by weight, vegetab...
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WO/2017/161157A1 |
Chemical compositions or "cocktails" for injecting into shale oil formations to stimulate oil, condensate and/or gas recovery are disclosed, along with the corresponding processes for stimulating oil, condensate and/or gas recovery. Thes...
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WO/2017/150118A1 |
The present invention pertains to a polishing composition containing abrasive grains, a water-soluble polymer, an anionic surfactant, a basic compound, and water, the anionic surfactant having oxyalkylene units, and the average number of...
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WO/2017/147768A1 |
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an...
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WO/2017/150114A1 |
The present invention proposes a polishing composition which has excellent wafer-protecting ability (resistance to alkali etching) and which can be expected to attain a reduction in haze while maintaining a low particle level. The presen...
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WO/2017/147767A1 |
A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising : providing the substrate; providing a polishing composition, containing, as initial components : water; an oxidizing agent; ...
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WO/2017/147891A1 |
A method of polishing a substrate comprises the steps of: providing the substrate which contains titanium nitride and titanium; providing a chemical mechanical polishing composition which contains: water, an oxidizing agent, a linear pol...
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WO/2017/142805A1 |
A polishing system includes a substrate to be polished and a polishing pad. The polishing pad includes a base layer and a wear resistant layer. The system further includes a polishing solution disposed between the polishing pad and the s...
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WO/2017/140952A1 |
Provided herein is a composition for improving performance of waxless skis, in particular skin skis, more particularly of skin strips, on snow, the composition com¬ prising (a) C1-6-alcohol(s); and (b) lubricant(s) selected from a group...
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WO/2017/138308A1 |
This polishing slurry contains abrasive grains formed of a metal oxide, a permanganate salt and an inorganic compound other than the permanganate salt. With respect to the inorganic compound, the redox potential of a solution that is obt...
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WO/2017/135427A1 |
A floor-polishing agent containing at least (A) a polyurethane resin, (B) an acrylic resin, and (C) a crosslinking agent, wherein said (A) polyurethane resin contains a carbonate group, and the total concentration of a urea group and a u...
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WO/2017/126268A1 |
Provided is a polishing composition which enables the formation of a surface having smoothness and reduced defects. The polishing composition contains a water-soluble polymer that meets the following requirements (A) and (B): (A) the ads...
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WO/2017/120402A1 |
Described are compositions (e.g., slurries) useful in methods for chemical-mechanical processing (e.g. polishing or planarizing) a surface of a substrate that contains tungsten, the slurries containing abrasive particles, metal cation ca...
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WO/2017/120396A1 |
Disclosed is a method of chemically-mechanically polishing a substrate. The method comprises, consists of, or consists essentially of (a) contacting a substrate containing a low-k dielectric composition, which includes less than about 80...
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WO/2017/119342A1 |
The purpose of the present invention is to provide a polishing material which has excellent polishing rate and is not susceptible to decrease of the polishing rate for a relatively long period of time. The present invention is a polishin...
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WO/2017/117404A1 |
Described are compositions useful in methods for chemical-mechanical processing a surface of a substrate, especially a substrate that contains dielectric material, wherein the composition contains cyclodextrin and alkylamine.
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WO/2017/114309A1 |
Disclosed in the present invention are a chemical mechanical polishing slurry and an application thereof, the polishing slurry comprising: (a) grinding particles, (b) aminosilane coupling agent, (c) azole compound, (d) complexing agent, ...
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WO/2017/114312A1 |
Provided are a method for preparing cerium oxide powder and an application thereof. The method comprising: adding carbon dioxide to a cerium source solution by means of bubbling, and preparing cerium carbonate by precipitation; and calci...
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WO/2017/116773A1 |
The invention relates to a process for preparing potassium thiosulfate, potassium sulfite or potassium bisulfite comprising the following steps: Step (1a): providing a potassium hydroxide or potassium carbonate solution for neutralizing ...
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