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WO/2024/096131A1 |
This through-hole electrode substrate comprises: a substrate including a first surface and a second surface positioned on the opposite side from the first surface and having a through-hole penetrating from the first surface to the second...
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WO/2024/095583A1 |
Provided is a layered ceramic capacitor that makes it possible to improve moistureproofing reliability. In the present invention, a multi-layer ceramic capacitor 1 comprises a laminate 2 and an external electrode 3. The laminate 2 has ...
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WO/2024/097036A1 |
A microelectronic assembly comprising a semiconductor structure (e.g., IC chip) and an active interposer that is electrically connected to the semiconductor structure and contains an electronic component embedded within an insulating mat...
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WO/2024/095537A1 |
The present invention realizes a capacitor that comprises composite bulk members with outstanding mechanical strength. The present invention is a capacitor that comprises: a conductive substrate; a plurality of fiber-like conductive memb...
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WO/2024/097037A1 |
A microelectronic assembly comprising a first package comprising a first semiconductor structure electrically connected to a first package substrate and a second package electrically connected and disposed adjacent to the first package a...
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WO/2024/097034A1 |
A microelectronic assembly comprising a semiconductor structure (e.g., IC chip), an interposer electrically connected to the semiconductor structure, and a package substrate electrically connected to the interposer is provided. The assem...
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WO/2024/097038A1 |
A semiconductor package assembly comprising a semiconductor structure (e.g., IC chip) and a package substrate electrically connected to the semiconductor structure is provided. The assembly also comprises a ceramic capacitor that contain...
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WO/2024/095536A1 |
Provided is a capacitor that uses a plurality of fibrous conductive members and has high bonding strength between a substrate and a composite bulk member. The capacitor comprises: a conductive substrate; a plurality of fibrous conductive...
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WO/2024/097032A1 |
The present invention is directed to a multilayer capacitor, a circuit board containing the multilayer capacitor, and an integrated circuit package containing the multilayer capacitor. A multilayer capacitor includes a body containing al...
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WO/2024/095719A1 |
The purpose of the present invention is to provide a binder composition for a dielectric layer, which is capable of imparting excellent blocking resistance and transferability to the dielectric layer. A binder composition for a dielectri...
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WO/2024/095720A1 |
This method for producing a laminated ceramic capacitor comprises: a first step for preparing a plurality of ceramic green sheets by molding, into a sheet shape, a slurry which is mainly composed of dielectric ceramic powder and contains...
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WO/2024/097031A1 |
The present invention is directed to a multilayer capacitor, a circuit board containing the multilayer capacitor, and an integrated circuit package containing the multilayer capacitor. A multilayer capacitor includes a body having top, b...
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WO/2024/095663A1 |
The purpose of the present invention is to provide a slurry composition for a dielectric layer and having excellent dispersion stability. The present invention is a slurry composition for a dielectric layer, said slurry composition inclu...
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WO/2024/097035A1 |
A microelectronic assembly comprising a semiconductor structure (e.g., IC chip) and an interposer that is electrically connected to the semiconductor structure and contains a semiconductor material (e.g., silicon interposer) is provided....
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WO/2024/097033A1 |
The present invention is directed to a multilayer capacitor, a circuit board containing the multilayer capacitor, and an integrated circuit package containing the multilayer capacitor. A multilayer capacitor a body containing alternating...
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WO/2024/095664A1 |
The purpose of the present invention is to provide a binder composition for a dielectric layer, which is capable of imparting excellent blocking resistance to the dielectric layer. The present invention is a binder composition for a diel...
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WO/2024/091846A1 |
Single-chip solutions and related methods that result in much higher capacitance densities than is achievable with current on-chip solutions and which reduce consumption of planar area of a mounting structure. Embodiments of the present ...
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WO/2024/090047A1 |
This solid electrolytic capacitor comprises: a sheet laminate formed by laminating a first capacitor element and a second capacitor element each having a dielectric layer formed on a surface of each flat electrode foil, and a solid elect...
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WO/2024/089948A1 |
Provided is an electronic component and an electronic component mounting structure that can suppress cracking. This electronic component comprises a component body 10 having a length direction L, and a first external electrode 21 and a...
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WO/2024/090392A1 |
This electrolytic capacitor comprises: a capacitor element provided with a positive electrode part and a negative electrode part; an exterior body that encapsulates the capacitor element; a first external electrode that is electrically c...
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WO/2024/090008A1 |
Provided is a multilayer ceramic capacitor that is capable of inhibiting the occurrence of cracks in the multilayer ceramic capacitor and has exceptional reliability. This multilayer ceramic capacitor 1 comprises: a laminate 2 that inc...
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WO/2024/087247A1 |
Provided in the present invention are a high-voltage vacuum ceramic capacitor assembly and a pole-mounted switch comprising same. The high-voltage vacuum ceramic capacitor assembly comprises a housing assembly; a ceramic capacitor, which...
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WO/2024/091675A1 |
Dielectric polymer films and electronic energy storage devices (e.g., thin film capacitors) comprising the dielectric polymer films are described herein. The polymer films comprise aromatic polysulfates and polysulfonates of Formula I, a...
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WO/2024/089941A1 |
A glass film (50) has a base part (51) and a specific part (52). The base part (51) contains, in addition to silicon oxide, an oxide of at least one metal element from among alkali metals and alkaline-earth metals. The specific part (52)...
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WO/2024/084909A1 |
The present invention provides a metallized film which is capable of suppressing excessive operation of a fuse. This metallized film is obtained by vapor depositing a metal on a dielectric film 10 so that an insulating margin 40 is for...
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WO/2024/086219A1 |
A single layer capacitor can include a substrate having a first surface and a second surface opposite the first surface. A resistive layer can be formed over at least a portion of the first surface of the substrate. A first conductive la...
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WO/2024/084966A1 |
Provided is a switching power source device (80) equipped with a composite power inductor (10), the switching power source device comprising: a linear inductor conductor (31); a linear inductor conductor (32); an inductor conductor (33);...
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WO/2024/086220A1 |
A metal-oxide-semiconductor (MOS) capacitor can include a substrate comprising a semiconductor material, an oxide layer formed over a first surface of the substrate, a resistive layer formed over at least a portion of the oxide layer, an...
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WO/2024/085249A1 |
Provided is a resin composition that can provide a film and the like capable of suppressing coloring even after being heated. The present invention also provides a molded product, a film, an electrically conductive film, a film capacitor...
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WO/2024/083625A1 |
The present invention concerns a capacitor comprising at least one capacitor unit, wherein the capacitor unit comprises at least two winding elements (1a, 1b), a first busbar (7), a second busbar (8), a third busbar (107) and a fourth bu...
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WO/2024/085091A1 |
This conductive paste contains: a conductive powder mainly composed of copper; a glass frit; a binder resin; and an organic solvent. The conductive paste is characterized in that: the conductive powder mainly composed of copper has, in a...
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WO/2024/079963A1 |
The present invention has an element body 20, an external electrode covering a portion of an outer surface (21) of the element body (20), and a protective film (30) of aluminum oxide. The protective film (30) is positioned between the el...
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WO/2024/080021A1 |
A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawn-out terminal 20a (20b) that is electrically connected to the extern...
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WO/2024/079968A1 |
A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a drawing-out terminal 20A (21A) electrically connected to the external ele...
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WO/2024/079967A1 |
A capacitor 1 comprises: a capacitor element 10 including an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a lead-out terminal 20a (20b) electrically connected to the external elec...
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WO/2024/080292A1 |
Provided are a copolymer capable of suppressing discoloration even after heating and a method for producing the same. A copolymer containing a structural unit (A) derived from 1,1-dicyanoethylene and a structural unit (B) derived from ...
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WO/2024/080287A1 |
Provided is a copolymer which can be inhibited from taking a color even through heating. The copolymer comprises a constituent unit (A) derived from 1,1-dicyanoethylene and a constituent unit (B) derived from a compound represented by ...
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WO/2024/079966A1 |
This multilayer ceramic electronic component has: a plurality of dielectric layers 22a-22c; a plurality of internal electrode layers 23a, 23b, which are stacked so as to sandwich the dielectric layer; and a large dielectric particle 24, ...
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WO/2024/075404A1 |
Provided is a chip-type electronic component that is less likely to cause separation of a spacer and a mounting substrate. A chip-type electronic component 1 of the present invention comprises a multilayered ceramic capacitor 1A and spac...
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WO/2024/074187A1 |
There is disclosed herein an energy storage module (1) for an energy storage system (100). The energy storage module (1) comprising at least one capacitor (10) for storing electrical energy and a diode (30) arranged antiparallel to the c...
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WO/2024/075428A1 |
Provided is a laminated ceramic capacitor whereby cracking or the like is less likely to occur in a ceramic body. Provided is a laminated ceramic capacitor comprising: a ceramic body, in which a plurality of ceramic layers, a plurality o...
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WO/2024/075691A1 |
This layered ceramic electronic component comprises: a layered body comprising a pair of principal surfaces that are orthogonal to a Z axis, a pair of end surfaces that are orthogonal to an X axis, and a pair of side surfaces that are or...
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WO/2024/075457A1 |
A multilayer ceramic capacitor according to one aspect of the present invention comprises: a ceramic body comprising a multilayered object having an approximately rectangular parallelepiped shape, which comprises a plurality of inner ele...
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WO/2024/075470A1 |
A multilayer ceramic capacitor according to one aspect of the present invention is provided with: a ceramic element which comprises a generally cuboidal multilayer body that is obtained by alternately stacking a plurality of internal ele...
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WO/2024/074250A1 |
A system (100) may include a capacitor (110) for an electronic device (400) of an electric vehicle (300); a main bus bar (130); and a capacitor bus bar (150) configured to connect the capacitor (110) to the main bus bar (130), wherein th...
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WO/2024/075402A1 |
The present invention provides a multilayer ceramic electronic component (1) which enables the achievement of a multilayer ceramic capacitor wherein the adhesion between a multilayer body (2) and a base electrode layer (21) is able to be...
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WO/2024/075427A1 |
The present invention provides a multilayer ceramic capacitor which is not susceptible to the occurrence of a crack or the like in a ceramic element. This multilayer ceramic capacitor is provided with: a ceramic element which is obtained...
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WO/2024/070427A1 |
A ceramic electronic component characterized in that it is provided with: a laminate in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated, and the plurality of internal electrod...
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WO/2024/070428A1 |
A ceramic electronic component including a multilayer structure comprising a plurality of dielectric layers alternating with a plurality of inner electrode layers, wherein at least any one of the inner electrode layers comprises a plural...
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WO/2024/070128A1 |
This method for manufacturing a multilayer ceramic electronic component 1 has: a step for forming a discontinuous internal electrode pattern 6 having breaks Dv on a dielectric green sheet using a vacuum film forming method; a step for la...
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