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WO/2023/238043A1 |
A soft sensor which may be used in robotic grasping applications includes a composite material being reversibly deformable and comprising an elastomer material containing dispersed conductive filler material, wherein the quantity of fill...
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WO/2023/238528A1 |
A capacitor array 1 comprises: a plurality of capacitor parts 10 arranged in a plane in a planar direction orthogonal to the thickness direction T; and sealing parts 60 that are formed from an insulating material and seal the plurality o...
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WO/2023/238527A1 |
A capacitor array 1 includes: a plurality of capacitor units 10 arranged horizontally in a plane direction orthogonal to a thickness direction T; and a sealing part 60 that seals the plurality of capacitor units 10 from both main surface...
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WO/2023/238453A1 |
Provided is a laminated ceramic capacitor capable of reducing ESL. A laminated ceramic capacitor 1 comprises: a first inner electrode layer 31 extending in a length direction L; and a second inner electrode layer 32 extending in a width ...
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WO/2023/238681A1 |
This capacitor array 1 comprises: a capacitor unit 20 which includes a plurality of capacitor elements 10 planarly disposed in a plane direction perpendicular to a thickness direction, and in which mutually adjacent capacitor elements 10...
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WO/2023/233918A1 |
A capacitor 1a is provided with a first electrode 11, a second electrode 12, and a dielectric body 20. The dielectric body 20 is arranged between the first electrode 11 and the second electrode 12. The dielectric body 20 contains a compo...
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WO/2023/234343A1 |
This capacitor 1a comprises a metal tantalum 10, a conductor 20, and a tantalum oxide film 30. The tantalum oxide film 30 is disposed in contact with the metal tantalum 10, and is disposed between the metal tantalum 10 and the conductor ...
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WO/2023/234314A1 |
Provided is a layered ceramic capacitor with which it is possible to improve both moisture resistance and high-temperature reliability. In a layered ceramic capacitor 1 according to the present embodiment, an effective layer part 11E i...
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WO/2023/234205A1 |
A resin composition for ceramic green sheets according to the present invention contains a ceramic powder, a binder and an organic solvent; the binder is a polyvinyl butyral; and the organic solvent is a mixed solvent that contains methy...
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WO/2023/233836A1 |
The present invention provides a multilayer ceramic capacitor that has improved moisture resistance reliability. and that can suppress the occurrence of cracks in external electrodes. This multilayer ceramic capacitor (1) comprises: meta...
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WO/2023/233917A1 |
This capacitor 1a comprises a first electrode 11, a second electrode 12, and a dielectric 20. The dielectric 20 is arranged between the first electrode 11 and the second electrode 12. The dielectric 20 includes a halide, and satisfies th...
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WO/2023/233835A1 |
The present invention provides a multilayer ceramic capacitor that enables increased capacitance to be achieved without increasing the possibility of electrical shorts occurring. This multilayer ceramic capacitor 1 comprises: a multilaye...
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WO/2023/234392A1 |
A multilayer ceramic capacitor according to the present invention includes: a laminate having a plurality of stacked dielectric layers and a plurality of internal electrodes formed along an interface between the dielectric layers; and a ...
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WO/2023/233837A1 |
Provided is a multilayer ceramic capacitor capable of suppressing an occurrence of a crack in an external electrode and having increased moisture resistance reliability. In a multilayer ceramic capacitor (1), external electrodes are prov...
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WO/2023/228906A1 |
A ceramic electronic component (102) comprises: a body (1) the main material of which is ceramic, and which includes a first surface (1a) and a second surface (1b) that mutually form the front and back of the body; dummy conductors (4) t...
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WO/2023/223677A1 |
A capacitor 1a is provided with: a first electrode 11; a second electrode 12; and a dielectric body 20. The dielectric body 20 is arranged between the first electrode 11 and the second electrode 12. The dielectric body 20 contains an oxi...
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WO/2023/223852A1 |
This dielectric 10 has a composition represented by BixMgyTizOk. This composition satisfies the conditions x ≥ 0.15, y ≤ 0.40, z ≥ 0.25, and x + y + z = 1.0. In this composition, k is a value for maintaining electrical neutrality.
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WO/2023/223652A1 |
Provided is a multilayer ceramic capacitor that suppresses the phenomenon of an internal electrode layer becoming finely divided at an end portion of the internal electrode layer, and that has excellent reliability whereby favorable diel...
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WO/2023/223730A1 |
Provided is a capacitor in which interlayer detachment is further inhibited. In this multilayer ceramic capacitor (1): a dimension A in a width direction of a first draw-out part (8b) and a second draw-out part (8c) is smaller than a dim...
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WO/2023/217701A1 |
A improved capacitor component is provided. The capacitor component comprises a heat sink and a winding in direct thermal contact with the heat sink.
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WO/2023/220296A1 |
A broadband multilayer ceramic capacitor may include a first external termination and a second external termination. A first portion of the first external termination may be spaced apart from a first portion of the second external termin...
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WO/2023/220679A1 |
Disclosed embodiments may include a power converter package including devices stacked vertically. The devices include a first device (110a) and a second device (110b). The first device (110a) includes a first switched capacitor circuit (...
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WO/2023/218955A1 |
Provided is a laminated ceramic capacitor having high reliability while still being compact and having a large capacity. A laminated ceramic capacitor 1 has a laminated body 10 provided with: an internal layer section 30 formed by alte...
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WO/2023/214504A1 |
The present disclosure provides an electronic component in which variations of the capacitance of a capacitor in a manufacturing process are reduced while suppressing the proportion of the area occupied by the capacitor in the electronic...
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WO/2023/210892A1 |
The present application can provide a conductive paste composition that has excellent viscosity characteristics and is easy to print and disperse, even with a small amount of conductive metal powder, by substituting a portion thereof, fo...
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WO/2023/210134A1 |
The present invention realizes a capacitor which uses a plurality of fiber-like conductive members, and in which the number of occurrences of short paths is reduced without substantially diminishing capacitance density. Provided is a cap...
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WO/2023/211721A1 |
A capacitor assembly comprises a laminar bus plate arrangement having at least one first polarity bus plate and at least one second polarity bus plate separated by a sheet-like insulator. At least one pair of bus terminals have a first p...
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WO/2023/210465A1 |
Provided are a multilayer ceramic capacitor in which cracking is less likely to occur, and a method for mounting a multilayer ceramic capacitor. A multilayer ceramic capacitor 1 of the present invention comprises: a multilayer body 2 whi...
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WO/2023/204176A1 |
Provided is a dielectric resin film that makes it possible to form a film capacitor that has excellent self-recovery capability and does not easily lose capacitance when high voltage is applied. A dielectric resin film according to the p...
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WO/2023/204298A1 |
This electronic component manufacturing device includes a grip plate (22, 25, 27), and the grip plate has a jig (20A, 20B) having a plurality of holes (23, 26, 28-1) into which each one of a plurality of electronic components (10) is ins...
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WO/2023/203754A1 |
A capacitor unit (11) comprises: a plurality of capacitor elements (21a, 21b, 21c, 21d); and one or a plurality of heat transfer members (22a, 22b, 22c), each of which is provided in a location neighboring at least one of the plurality o...
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WO/2023/199695A1 |
The present invention provides a multilayer ceramic electronic component 2 which comprises a ceramic layer 3 and an electrode 9 that is in contact with the ceramic layer 3, wherein: the ceramics contained in the ceramic layer 3 include a...
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WO/2023/195451A1 |
This ceramic electronic component comprises a main body (1), which has ceramic as the main material, has a first surface (41) and main body side surfaces perpendicular to the first surface (41), and a side-surface electrode (3) arranged ...
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WO/2023/195396A1 |
This film capacitor is fixed to a housing and comprises: a capacitor element having a stacked body of a dielectric film and an internal electrode, and end surface electrodes formed respectively on one end surface and the other end surfac...
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WO/2023/195526A1 |
An electrolytic capacitor lead terminal 1 comprises a rolled part 12, a rod-shaped part 18, and a lead wire 20. A side peripheral surface of the rolled part has: a first main surface 14a and a second main surface 14b; a pair of sheared s...
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WO/2023/190616A1 |
Provided is a conductive paste which can further improve adhesion to a substrate. This conductive paste comprises a conductive powder, a binder resin, an additive, and an organic solvent, wherein the glass transition point of a dried b...
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WO/2023/189919A1 |
The present invention provides a capacitor (1) comprising a body element (10) on which a dielectric layer (13) made of a thermosetting resin and a metal electrode layer (11) are laminated or wound, and an external electrode (20) to which...
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WO/2023/189718A1 |
A multilayer ceramic capacitor 10 comprises: a capacitor body 11 that includes a plurality of laminated dielectric layers 12, a plurality of first inner electrodes 13a, and a plurality of second inner electrodes 13b, and that has a first...
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WO/2023/189749A1 |
The purpose of the present invention is to provide a multilayer ceramic capacitor (1) that is resistant to cracking due to firing. The multilayer ceramic capacitor (1) comprises a stack (10) in which dielectric layers (20) and internal e...
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WO/2023/190613A1 |
Provided is a conductive paste of which adhesion with a base material is further improved. The conductive paste comprises a conductive powder, a binder resin, an additive, and an organic solvent, the additive comprising a compound havi...
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WO/2023/190452A1 |
[Problem] To provide: a barium titanate particulate powder which is fine and highly crystalline, can be suitably used as a raw material for a small-sized, high-performance electronic component or optical component due to the easy dispers...
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WO/2023/188598A1 |
The present invention addresses the problem of providing a polypropylene film that has excellent withstand voltage characteristics and reliability in high-temperature environments, and is suitable for a capacitor or the like used under h...
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WO/2023/190615A1 |
Provided is a conductive paste with which adhesion to a base material can be further enhanced. This conductive paste contains a conductive powder, an additive, a binder resin, and an organic solvent, wherein the conductive paste contai...
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WO/2023/189845A1 |
The present invention provides a resin composition for a ceramic green sheet, the composition having excellent solvent solubility and enabling fabrication of a ceramic capacitor having excellent reliability by reducing the amount of fine...
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WO/2023/189926A1 |
This semiconductor device comprises a substrate, a passivation film that covers the substrate, a first resin film that is provided on the passivation film, a capacitor that is provided on the passivation film and is positioned above the ...
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WO/2023/189448A1 |
Provided is a layered ceramic capacitor that suppresses cracking and chipping of a laminate, even when stress is applied to a substrate on which the layered ceramic capacitor is mounted and the substrate bends. A layered ceramic capaci...
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WO/2023/189678A1 |
The present invention provides an electronic device and a solid-state battery having high adhesion to terminal electrodes. The present invention comprises: a battery element body 140 having a positive electrode layer 110, a negative elec...
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WO/2023/189300A1 |
The present invention provides a method for producing a printed wiring board with a built-in capacitor, the printed wiring board exhibiting excellent adhesion between a circuit and a dielectric layer, with high productivity, while reduci...
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WO/2023/190614A1 |
Provided is an electroconductive paste making it possible to further improve adhesion to a substrate. The electroconductive paste contains an electroconductive powder, an additive, a binder resin, and an organic solvent. The electrocon...
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WO/2023/182051A1 |
An electronic component (102) comprises a semiconductor substrate (1), an insulator layer (2) formed on the top surface layer side of the semiconductor substrate (1), internal electrodes (3A1, 3A2, 3B) formed inside the insulator layer (...
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