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WO/2022/230787A1 |
A capacitor 1a of the present disclosure is provided with a first electrode 11, a second electrode 12, and a dielectric 20. The second electrode 12 is disposed opposite a main surface of the first electrode 11. The dielectric 20 is dispo...
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WO/2022/230432A1 |
A dielectric 10 of the present disclosure contains a composite oxide having at least two elements selected from the group consisting of Nb, Bi, and Ta, and satisfies the following condition (I), (II), or (III). (I) The composite oxide ha...
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WO/2022/230431A1 |
A dielectric 10 according to the present disclosure contains a composite oxide having a composition represented by LaxYyAl(1-x-y)Ok. In this composition, the condition 0.1 ≤ x+y < 0.50 is satisfied. Here, k is a value for keeping elect...
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WO/2022/229159A1 |
Electroacoustic devices (502) with a capacitive element (504) and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device (502) above a first region (506b) of a substrate, and forming a...
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WO/2022/228610A2 |
A DC link capacitor (1) with heat dissipation comprises a lower busbar (2), an upper busbar (4), a cooling structure (5) and a plurality of structurally identical capacitor elements (3) which are arranged between the lower busbar (2) and...
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WO/2022/230786A1 |
A capacitor 1a according to the present disclosure is provided with a first electrode 11, a second electrode 12 and a dielectric body 20. The dielectric body 20 is arranged between the first electrode 11 and the second electrode 12. The ...
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WO/2022/230412A1 |
A dielectric 10 includes a complex oxide. The complex oxide is amorphous and has a composition represented by CexAl1–xOk. In said composition represented by CexAl1–xOk, the condition 0.400≤x<0.90 is satisfied, and k is a value that...
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WO/2022/225361A1 |
A multilayer ceramic electronic component manufacturing method is provided. The multilayer ceramic electronic component manufacturing method according to one embodiment of the present invention: more easily and reliably enables an inner ...
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WO/2022/224828A1 |
In the present invention, a mother laminate is cut by arranging the mother laminate on a pedestal and moving a cutting blade having a linear cutting edge through the mother laminate in a parallel direction along the arrangement surface o...
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WO/2022/225360A1 |
Provided is a method for manufacturing a multilayer ceramic electronic component. According to the method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention, it is possible to...
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WO/2022/224668A1 |
This wiring module 20 is attached to a plurality of power storage elements 11 having electrode terminals 12A, 12B, the wiring module 20 comprising a plurality of bus bar units 22, and electric wires 21 connected to the bus bar units 22. ...
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WO/2022/223195A1 |
The invention comprises a semiconductor die (2) comprising a base body (20) comprising a semiconductor material, a surface with two contact areas (4) provided with contact pads (6) at which the die (2) can be contacted electrically and t...
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WO/2022/224669A1 |
A capacitor 1 is provided with a silicon substrate 2, a first terminal 31, a dielectric layer 4, an electrically conductive portion 5, and a second terminal 32. The silicon substrate 2 includes a main surface 21 and a porous material por...
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WO/2022/224561A1 |
A dielectric body 10 according to the present disclosure contains an amorphous tantalum compound containing fluorine and oxygen, and is advantageous in terms of obtaining a high dielectric constant.
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WO/2022/225517A1 |
A ceramic feedthrough assembly has a feedthrough interface sleeve brazed to a ceramic feedthrough body and a housing interface sleeve brazed to the feedthrough interface sleeve. The housing interface sleeve is configured to be integrated...
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WO/2022/220031A1 |
This multilayer ceramic capacitor 100 comprises: a capacitor main body 1 in which a plurality of first internal electrodes 3 and a plurality of second internal electrodes 4 are layered; a first via conductor 5 which is provided inside th...
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WO/2022/220087A1 |
This intaglio jig (100, 300) for manufacturing an electronic component (10, 200) having external electrodes (30-38, 240, 250) by applying a conductive paste (P) on an electronic component body (20, 210), has an elastic body (110, 310), a...
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WO/2022/220302A1 |
This metallized film capacitor is provided with a first metallized film and a second metallized film that is arranged so as to face the first metallized film; the first and second metallized films respectively comprise first and second d...
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WO/2022/220248A1 |
Provided is a metallized polypropylene film having excellent insulation breakdown resistance properties. A metallized polypropylene film according to the present invention has a thickness of 0.5-4.0 μm, and exhibits a thickness-adjust...
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WO/2022/219939A1 |
A capacitor 1a is provided with a first electrode layer 11, a second electrode layer 12, and an antiferroelectric layer 20. The antiferroelectric layer 20 is disposed between the first electrode layer 11 and the second electrode layer 12...
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WO/2022/216509A2 |
Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conduc...
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WO/2022/215353A1 |
A filter device (100) comprises a main body (110), a grounding terminal (GND), grounding electrodes (PG1, PG2), resonators (RC10 to RC40), and a via (VG5). The grounding electrodes are arranged in different positions in a normal line dir...
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WO/2022/215665A1 |
In the present invention, on an insulating surface of a substrate is disposed an inductor containing two patterned conductors which are mutually layered with an insulating film sandwiched therebetween. The two patterned conductors consti...
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WO/2022/216136A1 |
Provided is an electrode composition for electrospraying. The electrode composition for electrospraying according to an embodiment of the present invention is for obtaining an electrode having an average thickness of at most 1.0 μm when...
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WO/2022/210826A1 |
[Problem] To prevent a chip capacitor obtained by attaching a seat plate to a capacitor from forming voids and cracks due to flux gas generated during soldering. [Solution] When providing an auxiliary terminal 20 for increasing soldering...
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WO/2022/210129A1 |
A film capacitor according to the present disclosure includes: a stacked film body obtained by stacking dielectric films and dielectric films inverted in the x direction; and sprayed metal layers formed respectively on a pair of end surf...
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WO/2022/210642A1 |
Provided is a multilayer ceramic capacitor with which dielectric breakdown voltage can be further improved. A multilayer ceramic capacitor 10 is provided with a layered body 12, and external electrodes 24. The layered body 12 includes a ...
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WO/2022/210626A1 |
The present invention provides a multilayer ceramic capacitor which has excellent reliability even if a high electric field strength voltage is applied thereto, while having a dielectric layer that has a further reduced thickness. With...
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WO/2022/210627A1 |
The present invention provides a multilayered ceramic capacitor in which a dielectric layer is made even thinner, and which exhibits excellent reliability even when a voltage of high field intensity is applied thereto. Provided is a mu...
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WO/2022/212640A1 |
Provided is an electronic component, and particularly a film capacitor, comprising a working element comprising a dielectric and an encasement with the working element encased in said encasement wherein the encasement comprises a phase c...
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WO/2022/210130A1 |
The present invention is such that: a first metal layer electrically connected to a first metal electrode and a second metal electrode extends in a first direction and has a plurality of first band-like metal layers and second band-like ...
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WO/2022/210629A1 |
The present invention provides a multilayer ceramic capacitor which has excellent reliability even if a high electric field strength voltage is applied thereto, while having a dielectric layer that has a further reduced thickness. With...
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WO/2022/210624A1 |
Provided is a multilayer ceramic capacitor that exhibits excellent reliability even when a dielectric layer becomes thinner and a voltage of a high electric field intensity is applied. The multilayer ceramic capacitor (1) comprises a p...
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WO/2022/210625A1 |
Provided is a laminated ceramic capacitor that exhibits excellent reliability even when a dielectric layer thereof is further thinned and a voltage giving a high electric field strength is applied thereto. In a laminated ceramic capaci...
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WO/2022/210628A1 |
Provided is a layered ceramic capacitor that has even thinner dielectric layers and demonstrates excellent reliability, even when voltage that has a high field intensity is applied. A layered ceramic capacitor (1) comprises a plurality...
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WO/2022/202039A1 |
The present invention provides an electronic component which is provided with a glass layer that has resistance to a plating solution. An electronic component which is provided with a ceramic element, an external electrode that is provid...
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WO/2022/202193A1 |
This film capacitor includes: a film laminate made by laminating dielectric films so that every other dielectric film is inverted; and a first metal electrode and a second metal electrode that are respectively located on a pair of end su...
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WO/2022/202940A1 |
A parent laminate in which a plurality of dielectric ceramics and internal electrode layers are alternately stacked is cut, and foreign matter that is adhered to a cut surface on which an internal electrode layer is exposed is removed by...
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WO/2022/202038A1 |
Provided is an electronic component: in which an external electrode includes a base layer and a metal layer; and which exhibits excellent adhesion between the base layer and the metal layer. This electronic component comprises a ceramic ...
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WO/2022/202160A1 |
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...
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WO/2022/202194A1 |
A film capacitor according to the present invention includes: a film laminate in which dielectric films are laminated while each being inverted; and metallikon. A metal layer has connecting metal layers connecting a common metal layer an...
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WO/2022/194498A1 |
A capacitor system is disclosed, comprising: - a first capacitor with a connection for a first pole and a connection for a second pole; - a second capacitor with a connection for a first pole and a connection for a second pole, wherein t...
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WO/2022/195939A1 |
The present invention has a first terminal electrode, a second terminal electrode provided at a different position than the first terminal electrode in a plan view of a main surface, and a third terminal electrode provided at a position ...
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WO/2022/196319A1 |
A wiring module 20 is attached to a plurality of power storage elements 11 having electrode terminals 12 which are arrayed in two rows along an arrangement direction of the plurality of power storage elements 11, the two rows of electrod...
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WO/2022/196557A1 |
The present invention provides a wiring module 20 in which electrode terminals 12 of a plurality of power storage elements 11 are arranged in two rows along the direction in which the power storage elements 11 are aligned, and the two ro...
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WO/2022/196501A1 |
The purpose of the present disclosure is to obtain a laminated ceramic component in which migration hardly occurs. The laminated ceramic component according to the present disclosure comprises a sintered body (11), a plurality of inner e...
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WO/2022/191020A1 |
The glass ceramic material contains a glass including SiO2, B2O3, and M2O (M is an alkali metal), a filler including quartz, and at least one metal oxide selected from the group consisting of MnO, NiO, CuO, and ZnO. The content of the me...
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WO/2022/190708A1 |
A capacitor module comprising: a first capacitor including a first electrode, a second electrode, and a first side surface having flat portions and a curved portion that connect the first electrode and the second electrode; a second capa...
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WO/2022/190838A1 |
The present invention addresses the problem of providing a film with which a capacitor with excellent protecting function operability can be obtained, and which has a high dielectric breakdown strength at high temperatures and good eleme...
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WO/2022/185014A1 |
The invention relates to a capacitor (10) comprising a stack of layers (1) made of a semiconductor material having a band gap energy greater than 2.3 eV, the stack of layers (1) comprising: an electrically insulating intermediate layer (...
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