MULTILAYER CERAMIC ELECTRONIC COMPONENT

WIPO Patent Application WO/2024/075402

A1

The present invention provides a multilayer ceramic electronic component (1) which enables the achievement of a multilayer ceramic capacitor wherein the adhesion between a multilayer body (2) and a base electrode layer (21) is able to be improved without increasing the ESR within an external electrode (20). With respect to this multilayer ceramic electronic component (1), a plurality of ceramic layers (4) stacked upon each other are mainly composed of Ca and Zr; a first external electrode (20a) and a second external electrode (20b) respectively comprise a first base electrode layer (21a) and a second base electrode layer (21b), and a plating layer that is formed so as to partially cover the first base electrode layer (21a) and the second base electrode layer (21b); the first base electrode layer (21a) and the second base electrode layer (21b) are mainly composed of Cu; the multilayer body (2) is provided, on an edge (7) in the stacking direction (T), with a first compound region (8a) that is stretched on a first end face (62a) and a second compound region (8b) that is stretched on a second end face (62b); the first compound region (8a) is bonded to the first base electrode layer (21a); the second compound region (8b) is bonded to the second base electrode layer (21b); and the first compound region (8a) and the second compound region (8b) are not bonded to each other.

MIKATA NAOKI (JP)
YASUDA TATSUNORI (JP)

PCT/JP2023/029511

April 11, 2024

August 15, 2023

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MURATA MANUFACTURING CO (JP)

H01G4/30

WO2007080852A1

2007-07-19

JPH04320017A	1992-11-10
JPS6386414A	1988-04-16

KATO Ryuta et al. (JP)

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