Title:
LAYERED CERAMIC ELECTRONIC COMPONENT, PACKAGING BODY, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/075691
Kind Code:
A1
Abstract:
This layered ceramic electronic component comprises: a layered body comprising a pair of principal surfaces that are orthogonal to a Z axis, a pair of end surfaces that are orthogonal to an X axis, and a pair of side surfaces that are orthogonal to a Y axis; a first margin part that is formed on one side of the layered body in a second axis direction; a second margin part that is formed on the other side of the layered body in the second axis direction; and a pair of external electrodes that are provided respectively to the pair of end surfaces. Each external electrode comprises an extension part that extends, in the first margin part, to a plane defined by a first axis direction and a third axis direction. A dimension in the first axis direction of at least the first margin part is set to be greater than a dimension in the first axis direction of the layered body.
Inventors:
SATO HIROAKI (JP)
MOTEGI YUYA (JP)
MOTEGI YUYA (JP)
Application Number:
PCT/JP2023/035910
Publication Date:
April 11, 2024
Filing Date:
October 02, 2023
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01G4/30
Foreign References:
| JP2015170849A | 2015-09-28 | |||
| JP2014132631A | 2014-07-17 | |||
| JPH0855752A | 1996-02-27 | |||
| JP2014103371A | 2014-06-05 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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