| Document |
Document Title |
|
WO/2022/244617A1 |
Provided is a method for producing a resin member for a production process of electronic devices which makes it possible to suppress, for a long period of time, adhesion of an adhering substance on a surface. A method for producing a res...
|
|
WO/2022/238618A1 |
The invention relates to a method for a mechanical treatment of a concrete floor, such as troweling and blade finishing, using a hand-operated, a walk-behind or a ride-on actuator, such as a concrete power trowel machine, a floor treatme...
|
|
WO/2022/239376A1 |
A method for creating correlational expression for polishing condition determination, the method comprising: polishing a semiconductor wafer on the basis of a plurality of polishing conditions including a plurality of polishing parameter...
|
|
WO/2022/237200A1 |
Disclosed in the present invention is a preparation method for a flexible sol-gel polishing block, comprising the following steps: (1) putting a gelling agent and W20 diamond abrasive into deionized water, and uniformly stirring; (2) add...
|
|
WO/2022/235588A1 |
A method of processing a substrate includes selectively dispensing a treatment fluid on a die-by-die basis to onto a substrate, and chemical mechanical polishing the substrate after dispensing the treatment fluid. The treatment fluid mod...
|
|
WO/2022/232290A1 |
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, a temperature monit...
|
|
WO/2022/230646A1 |
The present invention relates to a polishing device and a polishing method. A polishing device comprises an operation control unit (9) for individually controlling the pressure of each of a plurality of pressure chambers. The operation c...
|
|
WO/2022/232154A1 |
A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional...
|
|
WO/2022/231308A1 |
Methods and apparatus for simultaneous double-side grinding semiconductor structures are disclosed. The double-side grinding apparatus may include first and second grinding wheels each having abrasive members that are shaped as a convex ...
|
|
WO/2022/224508A1 |
The present invention pertains to a polishing method and polishing device for polishing a substrate such as a wafer while also pressing the substrate up against a polishing surface of a polishing pad, and, in particular, to a polishing m...
|
|
WO/2022/224357A1 |
One aspect of the present disclosure provides a CMP polishing liquid for polishing a polysilicon, the CMP polishing liquid containing abrasive grains and a cationic polymer that contains at least one polymer selected from the group consi...
|
|
WO/2022/224356A1 |
A polishing liquid which contains: abrasive grains containing a hydroxide of a tetravalent metal element; a polymer that comprises a structural unit represented by formula (1); and a liquid medium. (In formula (1), * represents a bonding...
|
|
WO/2022/223277A1 |
A surface treatment device for treating a surface of a substrate support, wherein the surface treatment device comprises a contacting surface that is configured to contact the surface of the substrate support. The contacting surface is c...
|
|
WO/2022/219955A1 |
The present invention pertains to a method for manufacturing a semiconductor wafer, the method being characterized by comprising, at least, a chamfering step for polishing the circumferential edge of a wafer and forming a chamfered part ...
|
|
WO/2022/215370A1 |
The present invention is a wafer processing method characterized by surface-grinding a front surface of a wafer and a back surface opposite the front surface, with a grindstone with a grit number of 10000 or more, and double-side polishi...
|
|
WO/2022/216554A1 |
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image ...
|
|
WO/2022/210744A1 |
[Problem] To provide a polishing composition that has a superior working force and that has good washability after polishing. [Solution] A polishing composition including: abrasive grains; water; and a hydrophobic dispersion medium. The ...
|
|
WO/2022/210165A1 |
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing...
|
|
WO/2022/210676A1 |
This polishing pad has a polishing layer that comprises an isocyanate-terminated prepolymer and a polyurethane resin foam derived from a curing agent, wherein: the distance between hard segments in the polishing layer as measured by smal...
|
|
WO/2022/209389A1 |
The present invention relates to a polishing pad and a polishing device for use in polishing a substrate such as a wafer. Moreover, the present invention relates to a method of polishing a substrate such as a wafer. A polishing pad (30) ...
|
|
WO/2022/209758A1 |
Provided is a polishing method whereby it becomes possible to reduce defects on the surface of an object to be polished. The polishing method comprises a polishing step for supplying a polishing composition S1 containing abrasive grains ...
|
|
WO/2022/210264A1 |
This polishing pad includes: a polyurethane sheet serving as a polishing layer; and an end point detection window provided in an opening in the polyurethane sheet. In a dynamic viscoelasticity measurement of the end point detection windo...
|
|
WO/2022/210037A1 |
Provided is a polishing pad comprising a polishing layer made of a polyurethane resin foam containing an isocyanate-terminated prepolymer, and a curing agent, wherein the ratio (NC80/NC40) of a weight proportion (NC80) of an amorphous ph...
|
|
WO/2022/209229A1 |
Provided is a polishing composition that can polish a resin-made object to be polished at high polishing speed and that can polish the surface of the resin-made object to be polished so as to be flat and smooth. This polishing compositio...
|
|
WO/2022/209150A1 |
[Problem] To provide a means which, when used for polishing works comprising polysilicon and silicon nitride, is effective in inhibiting both insufficient polishing and dishing. [Solution] A polishing composition which comprises abrasive...
|
|
WO/2022/203881A1 |
Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The up...
|
|
WO/2022/203781A1 |
A method and apparatus for polishing a substrate is disclosed herein. More specifically, the apparatus relates to an integrated CMP system for polishing substrates. The CMP system has a polishing station configured to polish substrates. ...
|
|
WO/2022/202688A1 |
The present invention provides a means for reducing surface defects in a substrate after the polishing of the substrate. The present invention relates to a method for polishing a substrate, the method comprising a polishing step, in whic...
|
|
WO/2022/201254A1 |
This polishing pad comprises a polyurethane sheet as a polishing layer, the polyurethane sheet being such that the ratio (E'B40/E'T40) of the 40°C storage elastic modulus E'B40 in a dynamic viscoelasticity measurement performed under be...
|
|
WO/2022/202059A1 |
Provided is a method for manufacturing a polishing pad that comprises a polishing layer having an endpoint detection window, the method including: a curing step for fixing an endpoint detection window member inside of a die, and curing a...
|
|
WO/2022/202008A1 |
The present invention can prevent a decrease in the accuracy of stopping point detection in which a window for stopping point detection is used, while also suppressing influence on polishing performance. A polishing pad 3 comprises a w...
|
|
WO/2022/197347A1 |
A substrate polishing apparatus includes a processing station including a plurality of polishing platens having a polishing pad thereon, and a substrate support configured to hold a substrate therein, wherein the substrate support is pos...
|
|
WO/2022/196631A1 |
Provided are a polishing head and a polishing treatment device with which uneven polishing of a substrate surface being polished, such as partial insufficient polishing or over-polishing, is prevented, with which a further improvement in...
|
|
WO/2022/197132A1 |
A diamond disc comprises: a shank base; a bonding layer formed on the surface of the shank base; a plurality of boron-doped diamonds disposed so as to be exposed to the bonding layer, wherein at least some of the plurality of boron-doped...
|
|
WO/2022/192344A1 |
A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polish...
|
|
WO/2022/190771A1 |
The present invention pertains to managing a polishing device for polishing wafers, and in particular, pertains to a technique for measuring a physical quantity on the surface of a wafer being polished by the polishing device. The polish...
|
|
WO/2022/187074A1 |
A polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The chemical mechanical polishing sy...
|
|
WO/2022/187146A1 |
Controlling a polishing system includes receiving from an in-situ monitoring system, for each region of a plurality of regions on a substrate being processed by the polishing system, a sequence of characterizing values for the region. Fo...
|
|
WO/2022/187105A1 |
Generating a recipe for a polishing process includes receiving a target removal profile that includes a target thickness to remove for locations spaced angularly around a center of a substrate, storing a first function providing substrat...
|
|
WO/2022/186993A1 |
During polishing of a substrate a sequence of measured values is received from an in-situ motor torque monitoring system. Positions on the substrate of the region of lower coefficient of friction are calculated for at least two measured ...
|
|
WO/2022/187259A1 |
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the pla...
|
|
WO/2022/187249A1 |
A carrier head for holding a substrate in a polishing system includes a housing, an annular body that is vertically movable relative to the housing by an actuator, a first annular membrane secured to extending below the annular body to f...
|
|
WO/2022/186992A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so ...
|
|
WO/2022/187025A1 |
A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first mod...
|
|
WO/2022/187023A1 |
A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the ...
|
|
WO/2022/187057A1 |
Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camer...
|
|
WO/2022/185793A1 |
Provided is a means for being able to reduce the abrasive grain residue on the surface of an object to be polished after polishing. The polishing composition of the present invention is a polishing composition including abrasive grains a...
|
|
WO/2022/187055A1 |
A method for optimizing polishing includes, for each respective retaining ring of a plurality of retaining rings mounted on a particular carrier head, performing measurements for a bottom surface of the respective retaining ring mounted ...
|
|
WO/2022/186988A1 |
Method of training a neural network for spectrographic monitoring includes polishing a test substrate, measuring by an in-situ spectrographic monitoring system a sequence of test spectra of light reflected from the substrate and measurin...
|
|
WO/2022/182881A1 |
Containment and exhaust systems for substrate polishing components are disclosed. In one aspect, a substrate carrier head, includes a polishing pad, a substrate carrier head configured to retain a wafer against the polishing pad, an atom...
|
