Title:
DIAMOND DISC AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/197132
Kind Code:
A1
Abstract:
A diamond disc comprises: a shank base; a bonding layer formed on the surface of the shank base; a plurality of boron-doped diamonds disposed so as to be exposed to the bonding layer, wherein at least some of the plurality of boron-doped diamonds are configured such that a surface disposed at an uppermost end while meeting the long axis of the boron-doped diamonds is disposed on the bonding layer to be inclined downward from the upper end of the long axis.
Inventors:
PARK HEEDONG (KR)
KWACK KYOUNG KUK (KR)
LEE SEH KWANG (KR)
KWACK KYOUNG KUK (KR)
LEE SEH KWANG (KR)
Application Number:
PCT/KR2022/003778
Publication Date:
September 22, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
EHWA DIAMOND INDUSTRIAL COMPANY LTD (KR)
International Classes:
B24D3/10; B24B37/10; B24B37/30; B24D18/00
Foreign References:
| US20090325471A1 | 2009-12-31 | |||
| JP2012086291A | 2012-05-10 | |||
| KR20100030475A | 2010-03-18 | |||
| JP2006176698A | 2006-07-06 | |||
| KR20070032067A | 2007-03-20 | |||
| KR20120058303A | 2012-06-07 |
Attorney, Agent or Firm:
FIRSTLAW P.C. (KR)
Download PDF:
Previous Patent: POWER LINE COMMUNICATION SYSTEM USING PHASE CONTROL
Next Patent: COVER DEVICE FOR ELECTRONIC DEVICE
Next Patent: COVER DEVICE FOR ELECTRONIC DEVICE