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WO/2024/025002A1 |
The present invention relates to a method for polishing the surface of a 3D-printed orthopedic Ti alloy plate, the method enabling the surface of a 3D-printed orthopedic Ti alloy plate to be polished to a roughness level suitable for bio...
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WO/2024/026380A1 |
In one embodiment, a polishing composition can comprise abrasive particles including zirconia, an oxidizing agent including hydroxylamine and water. The polishing composition can have a high copper removal rate of at least 3500 Å/min, a...
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WO/2024/018735A1 |
A method for dressing a polishing pad is proposed by which the polishing pad can be more evenly dressed even on a rotating platen having a curved surface. The method for dressing a polishing pad 100 comprises pressing the grindstone 12 o...
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WO/2024/019240A1 |
A pad conditioner for dressing the surface of a CMP pad according to an embodiment of the present invention comprises: a substrate; and a plurality of protrusion members provided on the substrate. Each of the protrusion members may inclu...
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WO/2024/012048A1 |
A TFT-LCD float glass substrate processing line, sequentially comprising: a fine-cutting and edge-grinding working area, a surface grinding working area, and an inspection and packaging working area. A cold cutting device, a fine-cutting...
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WO/2024/010132A1 |
Disclosed are a polishing pad equipped with a window and a method for manufacturing same, wherein, in the process of inserting and attaching a window into a polishing pad, no thermal melting/bonding scheme and no vibration melting/bondin...
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WO/2024/009580A1 |
Provided is a method for determining conditions for polishing one surface of a wafer with a polisher. The polisher comprises at least a platen, a polishing pad disposed on the platen, and a polishing chuck disposed over the polishing pad...
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WO/2024/008338A1 |
The present invention relates to a grinding and/or polishing machine (1) with a rotatable specimen holder (20) and a rotatable disc (8) for supporting a preparation surface (6), the specimen holder (20) comprising a housing (25) having a...
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WO/2024/002312A1 |
Disclosed in the present invention is a chemical mechanical planarization apparatus, comprising: a polishing module, a cleaning module, and a cleaning input module, which is arranged respectively adjacent to the polishing module and the ...
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WO/2024/004751A1 |
A polishing material slurry according to the present invention comprises: manganese oxide abrasive grains that contain manganese oxide particles; permanganate ions; phosphoric acids; and a polymer additive which contains one or more wate...
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WO/2024/006213A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, an actuator, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and th...
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WO/2024/004750A1 |
A polishing material slurry according to the present invention comprises: manganese oxide abrasive grains that contain manganese oxide particles; permanganate ions; and phosphoric acids. A polishing method of a polishing material slurry ...
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WO/2023/248949A1 |
The objective of the present invention is to provide silica particles, a silica sol, and a polishing composition that have excellent mechanical strength, polishing properties, and storage stability. The present invention relates to silic...
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WO/2023/248960A1 |
A method, for polishing both sides of a workpiece made of a glass substrate, comprises: (1) a step for starting polishing of the workpiece; (2) a step for monitoring the rotational state of the workpiece in real time; and (3) a step for ...
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WO/2023/249678A1 |
A method of controlling a chemical mechanical polishing system includes receiving a respective time-varying test signal from an endpoint detection system for each of a plurality of test substrates, simultaneously visually displaying the ...
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WO/2023/248951A1 |
The purpose of the present invention is to provide: silica particles which has excellent mechanical strength, polishing characteristics and storage stability; a silica sol; and a polishing composition. The present invention relates to si...
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WO/2023/244740A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization, comprising one or more acrylate urethane oligomers, one or more acrylate monomers and at least one photo-polymerization initi...
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/244739A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more ac...
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WO/2023/239393A1 |
Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an elect...
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WO/2023/239421A1 |
A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move ...
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WO/2023/240260A1 |
A chemical mechanical polishing (CMP) slurry can comprise a plurality of particles distributed in a carrier, wherein at least a portion of the particles of the plurality of particles can have a body including a core comprising zirconia a...
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WO/2023/239420A1 |
A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a...
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WO/2023/233681A1 |
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of l...
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WO/2023/234974A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/235582A1 |
A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier h...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/234973A1 |
A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relati...
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WO/2023/228579A1 |
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which m...
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WO/2023/229009A1 |
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate. One aspect of the present disclosure pe...
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WO/2023/229660A1 |
The invention relates to a brake disc arrangement (86) having a brake disc (12) that has a friction ring (14) and a brake disc pot having an opening concentric to a central brake disc axis, which opening is delimited by a boundary which ...
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WO/2023/229658A1 |
A carrier head for chemical mechanical polishing includes a housing, a substrate mounting surface, and a retaining ring assembly. The retaining ring assembly includes an inner ring surrounding the substrate mounting surface and having an...
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WO/2023/229661A1 |
A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing sy...
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WO/2023/223959A1 |
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a ...
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WO/2023/219004A1 |
The present invention provides colloidal silica in which fine particles are reduced and a production method therefor. Provided is colloidal silica wherein the number distribution ratio of fine particles having a particle diameter such th...
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WO/2023/218812A1 |
The present invention provides a double-sided polishing method including a startup stage for gradually increasing a polishing rate from a polishing stopped state, a main polishing step, continuous with the startup stage, for performing d...
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WO/2023/219783A1 |
Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed o...
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WO/2023/218809A1 |
This silicon carbide substrate has a main surface. The silicon carbide substrate contains a plurality of carbon inclusions. The main surface has a plurality of pits formed therein. The plurality of carbon inclusions each have a maximum l...
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WO/2023/212981A1 |
Provided in the embodiments of the present disclosure are a chemical mechanical polish process method and a device, relating to the technical field of semiconductor manufacturing. The method comprises: providing a substrate on which a di...
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WO/2023/214986A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/214985A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/210073A1 |
The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing ...
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WO/2023/203915A1 |
[Problem] To provide a carrier for double-sided polishing, with which an increase in service life can be achieved by improving wear resistance, and a silicon wafer double-sided polishing method and device employing the same. [Solution] A...
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WO/2023/203680A1 |
Provided is a polishing agent for polishing a polishing target surface including indium tin oxide, said polishing agent comprising: polishing grains; at least one dicarboxylic acid component selected from the group consisting of dicarbox...
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WO/2023/197237A1 |
A lapping table (100), comprising a rigid body (110), and the rigid body being used for carrying a wafer (20) and provided with a cavity. The lapping table further comprises a plurality of first through holes (V1) passing through the upp...
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WO/2023/200269A1 |
The present invention provides a sub-pad for a polishing pad, a polishing pad including same, and a method for manufacturing the sub-pad for a polishing pad, the sub-pad being stacked under a top pad that contacts and polishes a wafer an...
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WO/2023/201189A1 |
Synthesis of polycationic polymer or copolymer is disclosed. The polycationic polymer or copolymer are formed by at least one first cationic monomer and at least one second cationic monomer wherein the first cationic monomer and the seco...
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WO/2023/189512A1 |
Provided is a polishing composition that can achieve an excellent polishing/removal rate for a polishing target. The polishing composition provided by the present invention is used for polishing a polishing target. The polishing composit...
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WO/2023/190604A1 |
Provided is a silicon polishing method and a polishing fluid 26 with which polishing efficiency is achieved. When a polishing pad 18 that is a polishing abrasive grain-including polishing pad including polishing abrasive grains 36 is use...
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WO/2023/192128A1 |
A method of polishing a surface of a polycrystalline sintered ceramic body, the method comprising the steps of: a) providing a sintered ceramic body comprising a polycrystalline material and having a density of from about 99.5% to about ...
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